MX2014013046A - Pelicula adhesiva electricamente conductora tridimensional. - Google Patents

Pelicula adhesiva electricamente conductora tridimensional.

Info

Publication number
MX2014013046A
MX2014013046A MX2014013046A MX2014013046A MX2014013046A MX 2014013046 A MX2014013046 A MX 2014013046A MX 2014013046 A MX2014013046 A MX 2014013046A MX 2014013046 A MX2014013046 A MX 2014013046A MX 2014013046 A MX2014013046 A MX 2014013046A
Authority
MX
Mexico
Prior art keywords
adhesive film
electrically conductive
conductive adhesive
dimensional electrically
dimensional
Prior art date
Application number
MX2014013046A
Other languages
English (en)
Other versions
MX358202B (es
Inventor
Thorsten Krawinkel
Lesmona Scherf
Alexander Fischer
Original Assignee
Tesa Se
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tesa Se filed Critical Tesa Se
Publication of MX2014013046A publication Critical patent/MX2014013046A/es
Publication of MX358202B publication Critical patent/MX358202B/es

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L21/00—Compositions of unspecified rubbers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/16—Metal
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive

Abstract

La presente invención se refiere a una película adhesiva que comprende una capa de un compuesto adhesivo así como a las partículas conductoras que son agregadas al compuesto adhesivo, caracterizado porque una porción de las partículas conductoras son fibrosas y una porción de las partículas están en la forma de estructuras dendríticas.
MX2014013046A 2012-05-04 2013-04-05 Pelicula adhesiva electricamente conductora tridimensional. MX358202B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102012207462A DE102012207462A1 (de) 2012-05-04 2012-05-04 Dreidimensional elektrisch leitfähige Klebstofffolie
PCT/EP2013/057233 WO2013164154A1 (de) 2012-05-04 2013-04-05 Dreidimensional elektrisch leitfähige klebstofffolie

Publications (2)

Publication Number Publication Date
MX2014013046A true MX2014013046A (es) 2015-02-04
MX358202B MX358202B (es) 2018-08-09

Family

ID=48095832

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2014013046A MX358202B (es) 2012-05-04 2013-04-05 Pelicula adhesiva electricamente conductora tridimensional.

Country Status (11)

Country Link
US (1) US9598614B2 (es)
EP (1) EP2844690B1 (es)
JP (1) JP2015521214A (es)
KR (1) KR102085553B1 (es)
CN (1) CN104284928B (es)
DE (1) DE102012207462A1 (es)
IN (1) IN2014DN10108A (es)
MX (1) MX358202B (es)
PL (1) PL2844690T3 (es)
TW (1) TW201402772A (es)
WO (1) WO2013164154A1 (es)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160012934A1 (en) * 2014-07-11 2016-01-14 Tyco Electronics Corporation Composite Formulation and Composite Product
US20160012931A1 (en) * 2014-07-11 2016-01-14 Tyco Electronics Corporation Conductive Particle
WO2016017644A1 (ja) * 2014-07-31 2016-02-04 タツタ電線株式会社 導電性組成物およびそれを備えた導電性シート
KR101836566B1 (ko) 2015-05-15 2018-03-08 현대자동차주식회사 도전성 접착제 및 이를 이용한 복합소재의 접합방법
JP5972489B1 (ja) 2016-02-10 2016-08-17 古河電気工業株式会社 導電性接着フィルムおよびこれを用いたダイシング・ダイボンディングフィルム
JP6005313B1 (ja) * 2016-02-10 2016-10-12 古河電気工業株式会社 導電性接着フィルムおよびこれを用いたダイシング・ダイボンディングフィルム
JP5989928B1 (ja) * 2016-02-10 2016-09-07 古河電気工業株式会社 導電性接着フィルムおよびこれを用いたダイシング・ダイボンディングフィルム
JP6005312B1 (ja) * 2016-02-10 2016-10-12 古河電気工業株式会社 導電性接着フィルムおよびこれを用いたダイシング・ダイボンディングフィルム
JP5972490B1 (ja) 2016-02-10 2016-08-17 古河電気工業株式会社 導電性接着剤組成物ならびにこれを用いた導電性接着フィルムおよびダイシング・ダイボンディングフィルム
WO2018042701A1 (ja) * 2016-08-30 2018-03-08 日立化成株式会社 接着剤組成物
US11168235B2 (en) * 2017-05-09 2021-11-09 3M Innovative Properties Company Electrically conductive adhesive
KR102579269B1 (ko) * 2017-12-28 2023-09-14 가부시끼가이샤 레조낙 접착제 필름
WO2019131904A1 (ja) 2017-12-28 2019-07-04 日立化成株式会社 接続構造体及びその製造方法
CN111448279B (zh) * 2018-01-30 2021-08-10 拓自达电线株式会社 导电性胶粘剂组合物
JP6805190B2 (ja) * 2018-01-30 2020-12-23 タツタ電線株式会社 導電性接着剤組成物
JP6794592B1 (ja) * 2019-05-31 2020-12-02 タツタ電線株式会社 等方導電性粘着シート
WO2020241818A1 (ja) * 2019-05-31 2020-12-03 タツタ電線株式会社 等方導電性粘着シート

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3475213A (en) 1965-09-13 1969-10-28 Minnesota Mining & Mfg Electrically conductive adhesive tape
US3970608A (en) 1974-04-05 1976-07-20 Bridgestone Tire Company Limited Epoxidized acetylene-conjugated diene random copolymer and the curable composition comprising the same
US4113981A (en) 1974-08-14 1978-09-12 Kabushiki Kaisha Seikosha Electrically conductive adhesive connecting arrays of conductors
NL8204288A (nl) * 1982-11-05 1984-06-01 Gen Electric Polymeermengsel, werkwijze voor het bereiden van het polymeermengsel, voorwerpen gevormd uit het polymeermengsel.
US4606962A (en) 1983-06-13 1986-08-19 Minnesota Mining And Manufacturing Company Electrically and thermally conductive adhesive transfer tape
AU612771B2 (en) 1988-02-26 1991-07-18 Minnesota Mining And Manufacturing Company Electrically conductive pressure-sensitive adhesive tape
DE4012061A1 (de) * 1990-04-10 1991-10-17 Mittweida Ing Hochschule Loesungsmittelfreie isotrope leit- und klebepaste mit eingelagerten elektrisch leitfaehigen partikeln
DE19912628A1 (de) 1998-07-04 2000-01-05 Beiersdorf Ag Elektrisch leitfähige, thermoplastische und hitzeaktivierbare Klebstoffolie
ES2246579T3 (es) 1998-07-04 2006-02-16 Tesa Ag Film adhesivo electroconductor, termoplastico y termoactivable.
DE19853805B4 (de) 1998-11-21 2005-05-12 Tesa Ag Elektrisch leitfähige, thermoplastische und hitzeaktivierbare Klebstofffolie und deren Verwendung
JP2004288924A (ja) 2003-03-24 2004-10-14 Alps Electric Co Ltd 可変抵抗器
JP2006032165A (ja) * 2004-07-16 2006-02-02 Sumitomo Metal Mining Co Ltd 導電性金属粒子とそれを用いた導電性樹脂組成物及び導電性接着剤
GB0710425D0 (en) 2007-06-01 2007-07-11 Hexcel Composites Ltd Improved structural adhesive materials
CA2766859A1 (en) * 2009-07-08 2011-01-13 Henkel Ag & Co. Kgaa Electrically conductive adhesives
EP2431438B1 (en) * 2010-09-20 2012-11-28 Henkel AG & Co. KGaA Electrically conductive adhesives
DE102010060904A1 (de) * 2010-11-30 2012-05-31 Benecke-Kaliko Ag Polymermischung
EP4012061A1 (de) * 2020-12-09 2022-06-15 MTU Aero Engines AG Nickelbasislegierung und bauteil aus dieser

Also Published As

Publication number Publication date
MX358202B (es) 2018-08-09
EP2844690B1 (de) 2016-07-20
PL2844690T3 (pl) 2016-12-30
JP2015521214A (ja) 2015-07-27
KR102085553B1 (ko) 2020-03-06
CN104284928A (zh) 2015-01-14
KR20150013703A (ko) 2015-02-05
US20150129812A1 (en) 2015-05-14
TW201402772A (zh) 2014-01-16
CN104284928B (zh) 2016-04-13
IN2014DN10108A (es) 2015-08-21
US9598614B2 (en) 2017-03-21
DE102012207462A1 (de) 2013-11-07
EP2844690A1 (de) 2015-03-11
WO2013164154A1 (de) 2013-11-07

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