KR102083777B1 - 경화체, 적층체, 프린트 배선판 및 반도체 장치 - Google Patents

경화체, 적층체, 프린트 배선판 및 반도체 장치 Download PDF

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Publication number
KR102083777B1
KR102083777B1 KR1020130104717A KR20130104717A KR102083777B1 KR 102083777 B1 KR102083777 B1 KR 102083777B1 KR 1020130104717 A KR1020130104717 A KR 1020130104717A KR 20130104717 A KR20130104717 A KR 20130104717A KR 102083777 B1 KR102083777 B1 KR 102083777B1
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KR
South Korea
Prior art keywords
resin
hardening
cured
cured product
mass
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KR1020130104717A
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English (en)
Korean (ko)
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KR20140031135A (ko
Inventor
요시오 니시무라
시게오 나카무라
Original Assignee
아지노모토 가부시키가이샤
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Publication of KR20140031135A publication Critical patent/KR20140031135A/ko
Application granted granted Critical
Publication of KR102083777B1 publication Critical patent/KR102083777B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C08J3/244—Stepwise homogeneous crosslinking of one polymer with one crosslinking system, e.g. partial curing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
KR1020130104717A 2012-09-03 2013-09-02 경화체, 적층체, 프린트 배선판 및 반도체 장치 KR102083777B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2012-193475 2012-09-03
JP2012193475 2012-09-03

Publications (2)

Publication Number Publication Date
KR20140031135A KR20140031135A (ko) 2014-03-12
KR102083777B1 true KR102083777B1 (ko) 2020-03-03

Family

ID=50617761

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Application Number Title Priority Date Filing Date
KR1020130104717A KR102083777B1 (ko) 2012-09-03 2013-09-02 경화체, 적층체, 프린트 배선판 및 반도체 장치

Country Status (3)

Country Link
JP (2) JP6343884B2 (zh)
KR (1) KR102083777B1 (zh)
TW (1) TWI598386B (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240017101A (ko) * 2016-02-19 2024-02-06 가부시끼가이샤 레조낙 다층 프린트 배선판용의 접착 필름
JP6808945B2 (ja) * 2016-02-19 2021-01-06 昭和電工マテリアルズ株式会社 多層プリント配線板用の接着フィルム
JP2019056041A (ja) * 2017-09-20 2019-04-11 旭化成株式会社 熱硬化性樹脂組成物
JP6933188B2 (ja) * 2018-05-14 2021-09-08 味の素株式会社 封止用樹脂組成物層、支持体付き樹脂シート、封止用樹脂硬化層、半導体パッケージ及び半導体装置
JP7131360B2 (ja) 2018-12-18 2022-09-06 スズキ株式会社 鞍乗型車両
CN113559981B (zh) * 2021-09-24 2021-12-03 江苏沪申钛白科技有限公司 一种用于二氧化钛生产的粉碎装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000336244A (ja) 1999-05-26 2000-12-05 Sumitomo Bakelite Co Ltd 液状封止樹脂組成物及びそれを用いた半導体装置
JP2006233127A (ja) 2005-02-28 2006-09-07 Sumitomo Bakelite Co Ltd アンダーフィル用液状封止樹脂組成物、並びにこれを用いた半導体装置及びその製造方法
WO2008044552A1 (fr) 2006-10-06 2008-04-17 Sumitomo Bakelite Company, Ltd. composition de résine, feuille isolante avec base, préimprégné, plaque de circuit imprimé à couches multiples et dispositif semi-conducteur
JP2011144361A (ja) * 2009-12-14 2011-07-28 Ajinomoto Co Inc 樹脂組成物

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090110909A1 (en) * 2007-10-26 2009-04-30 E. I. Dupont De Nemours And Company Asymmetric dielectric film
CN102137758B (zh) * 2008-09-01 2014-08-06 积水化学工业株式会社 层叠体及层叠体的制造方法
US20110223383A1 (en) 2008-09-24 2011-09-15 Sekisui Chemical Co., Ltd. Semi-cured body, cured body, multilayer body, method for producing semi-cured body, and method for producing cured body
JP5342221B2 (ja) * 2008-12-05 2013-11-13 パナソニック株式会社 半導体封止用エポキシ樹脂無機複合シート及び成形品
TWI477549B (zh) 2009-02-06 2015-03-21 Ajinomoto Kk Resin composition
JP2011246406A (ja) * 2010-05-28 2011-12-08 Ajinomoto Co Inc 有機けい素化合物
JP5408046B2 (ja) * 2010-06-10 2014-02-05 味の素株式会社 樹脂組成物

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000336244A (ja) 1999-05-26 2000-12-05 Sumitomo Bakelite Co Ltd 液状封止樹脂組成物及びそれを用いた半導体装置
JP2006233127A (ja) 2005-02-28 2006-09-07 Sumitomo Bakelite Co Ltd アンダーフィル用液状封止樹脂組成物、並びにこれを用いた半導体装置及びその製造方法
WO2008044552A1 (fr) 2006-10-06 2008-04-17 Sumitomo Bakelite Company, Ltd. composition de résine, feuille isolante avec base, préimprégné, plaque de circuit imprimé à couches multiples et dispositif semi-conducteur
JP2011144361A (ja) * 2009-12-14 2011-07-28 Ajinomoto Co Inc 樹脂組成物

Also Published As

Publication number Publication date
TWI598386B (zh) 2017-09-11
JP6477941B2 (ja) 2019-03-06
JP2014062230A (ja) 2014-04-10
KR20140031135A (ko) 2014-03-12
JP6343884B2 (ja) 2018-06-20
JP2018104717A (ja) 2018-07-05
TW201420658A (zh) 2014-06-01

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