KR102074004B1 - 적층 구조체 제조 방법, 적층 구조체, 및 전자 장치 - Google Patents

적층 구조체 제조 방법, 적층 구조체, 및 전자 장치 Download PDF

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KR102074004B1
KR102074004B1 KR1020147016812A KR20147016812A KR102074004B1 KR 102074004 B1 KR102074004 B1 KR 102074004B1 KR 1020147016812 A KR1020147016812 A KR 1020147016812A KR 20147016812 A KR20147016812 A KR 20147016812A KR 102074004 B1 KR102074004 B1 KR 102074004B1
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South Korea
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substrate
layer
resin layer
graphene film
laminated structure
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Korean (ko)
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KR20150002574A (ko
Inventor
노조미 기무라
게이스케 시미즈
도시오 후쿠다
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소니 주식회사
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/881—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being a two-dimensional material
    • H10D62/882—Graphene
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P10/00—Bonding of wafers, substrates or parts of devices
    • H10P10/12—Bonding of semiconductor wafers or semiconductor substrates to semiconductor wafers or semiconductor substrates
    • H10P10/128—Bonding of semiconductor wafers or semiconductor substrates to semiconductor wafers or semiconductor substrates by direct semiconductor to semiconductor bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • B32B2037/243—Coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/02—2 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/208—Touch screens
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B32B37/025—Transfer laminating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/30—Self-sustaining carbon mass or layer with impregnant or other layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Liquid Crystal (AREA)
  • Electroluminescent Light Sources (AREA)
  • Position Input By Displaying (AREA)
KR1020147016812A 2012-04-03 2013-03-27 적층 구조체 제조 방법, 적층 구조체, 및 전자 장치 Active KR102074004B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2012084583A JP2013214434A (ja) 2012-04-03 2012-04-03 積層構造体の製造方法、積層構造体および電子機器
JPJP-P-2012-084583 2012-04-03
PCT/JP2013/002101 WO2013150746A1 (en) 2012-04-03 2013-03-27 Laminated structure manufacturing method, laminated structure, and electronic apparatus

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020207002283A Division KR102202997B1 (ko) 2012-04-03 2013-03-27 적층 구조체 제조 방법, 적층 구조체, 및 전자 장치

Publications (2)

Publication Number Publication Date
KR20150002574A KR20150002574A (ko) 2015-01-07
KR102074004B1 true KR102074004B1 (ko) 2020-02-05

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KR1020207002283A Active KR102202997B1 (ko) 2012-04-03 2013-03-27 적층 구조체 제조 방법, 적층 구조체, 및 전자 장치

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Country Status (6)

Country Link
US (1) US10022947B2 (https=)
EP (1) EP2834071A1 (https=)
JP (1) JP2013214434A (https=)
KR (2) KR102074004B1 (https=)
CN (1) CN104203577A (https=)
WO (1) WO2013150746A1 (https=)

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JP6466070B2 (ja) 2014-03-05 2019-02-06 株式会社東芝 透明導電体およびこれを用いたデバイス
CN103935988B (zh) * 2014-03-24 2017-01-11 无锡格菲电子薄膜科技有限公司 一种石墨烯薄膜的转移方法
CN104538562B (zh) * 2015-01-15 2017-04-26 京东方科技集团股份有限公司 一种oled器件及其封装方法和封装装置
CN106201039B (zh) * 2015-04-30 2023-05-23 安徽精卓光显技术有限责任公司 触摸屏及保护膜
KR102581899B1 (ko) * 2015-11-04 2023-09-21 삼성전자주식회사 투명 전극 및 이를 포함하는 소자
FR3045826A1 (fr) * 2015-12-17 2017-06-23 Commissariat Energie Atomique Supports amplificateurs de contraste utilisant un materiau bidimensionnel
JP6649800B2 (ja) * 2016-02-26 2020-02-19 住友電気工業株式会社 電子装置およびその製造方法
WO2018133053A1 (en) * 2017-01-21 2018-07-26 Southern University Of Science And Technology Graphene film and direct method for transfering graphene film onto flexible and transparent substrates
CN106827380B (zh) * 2017-01-23 2019-03-15 业成科技（成都）有限公司 带有抗眩光薄膜的三维工件制作方法
JP2018107138A (ja) * 2018-02-14 2018-07-05 株式会社東芝 透明導電体の製造方法
JP7154698B2 (ja) * 2018-09-06 2022-10-18 株式会社ディスコ ウェーハの加工方法
JP7171134B2 (ja) * 2018-10-17 2022-11-15 株式会社ディスコ ウェーハの加工方法
JP7503886B2 (ja) * 2018-11-06 2024-06-21 株式会社ディスコ ウェーハの加工方法
US12163228B2 (en) 2021-05-18 2024-12-10 Mellanox Technologies, Ltd. CVD system with substrate carrier and associated mechanisms for moving substrate therethrough
US11963309B2 (en) 2021-05-18 2024-04-16 Mellanox Technologies, Ltd. Process for laminating conductive-lubricant coated metals for printed circuit boards
US12289839B2 (en) 2021-05-18 2025-04-29 Mellanox Technologies, Ltd. Process for localized repair of graphene-coated lamination stacks and printed circuit boards
US12004308B2 (en) * 2021-05-18 2024-06-04 Mellanox Technologies, Ltd. Process for laminating graphene-coated printed circuit boards
US12221695B2 (en) 2021-05-18 2025-02-11 Mellanox Technologies, Ltd. CVD system with flange assembly for facilitating uniform and laminar flow

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JP2011520741A (ja) 2008-01-07 2011-07-21 ウィシス テクノロジー ファウンデーション，インコーポレイティド 物質溶媒と複合マトリクスを同定し、特徴付ける方法および装置、並びにその使用方法

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Publication number Publication date
KR20200015947A (ko) 2020-02-13
JP2013214434A (ja) 2013-10-17
WO2013150746A1 (en) 2013-10-10
KR102202997B1 (ko) 2021-01-13
EP2834071A1 (en) 2015-02-11
US20150064470A1 (en) 2015-03-05
CN104203577A (zh) 2014-12-10
US10022947B2 (en) 2018-07-17
KR20150002574A (ko) 2015-01-07

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