KR102066386B1 - 부품 실장 장치 - Google Patents

부품 실장 장치 Download PDF

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Publication number
KR102066386B1
KR102066386B1 KR1020170078853A KR20170078853A KR102066386B1 KR 102066386 B1 KR102066386 B1 KR 102066386B1 KR 1020170078853 A KR1020170078853 A KR 1020170078853A KR 20170078853 A KR20170078853 A KR 20170078853A KR 102066386 B1 KR102066386 B1 KR 102066386B1
Authority
KR
South Korea
Prior art keywords
mounting head
mounting
recognition
imaging device
rectifying plate
Prior art date
Application number
KR1020170078853A
Other languages
English (en)
Korean (ko)
Other versions
KR20180051345A (ko
Inventor
다이스케 사쿠라이
마사루 하마히라
히로키 유카와
Original Assignee
파나소닉 아이피 매니지먼트 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 파나소닉 아이피 매니지먼트 가부시키가이샤 filed Critical 파나소닉 아이피 매니지먼트 가부시키가이샤
Publication of KR20180051345A publication Critical patent/KR20180051345A/ko
Application granted granted Critical
Publication of KR102066386B1 publication Critical patent/KR102066386B1/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
KR1020170078853A 2016-11-08 2017-06-22 부품 실장 장치 KR102066386B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016217765A JP6547968B2 (ja) 2016-11-08 2016-11-08 部品実装装置
JPJP-P-2016-217765 2016-11-08

Publications (2)

Publication Number Publication Date
KR20180051345A KR20180051345A (ko) 2018-05-16
KR102066386B1 true KR102066386B1 (ko) 2020-02-11

Family

ID=62138041

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170078853A KR102066386B1 (ko) 2016-11-08 2017-06-22 부품 실장 장치

Country Status (4)

Country Link
JP (1) JP6547968B2 (zh)
KR (1) KR102066386B1 (zh)
CN (1) CN108064126B (zh)
TW (1) TWI652973B (zh)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003205256A (ja) * 2001-11-12 2003-07-22 Ikeuchi:Kk ノズル
JP2004022949A (ja) 2002-06-19 2004-01-22 Toray Eng Co Ltd 実装装置および実装方法
JP2012238775A (ja) * 2011-05-13 2012-12-06 Bondtech Inc アライメント装置およびアライメント方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02306643A (ja) * 1989-05-22 1990-12-20 Matsushita Electric Works Ltd テレビカメラの冷却方法
CN1242664C (zh) * 2001-04-27 2006-02-15 株式会社村田制作所 零件安装装置
WO2003041478A1 (fr) 2001-11-05 2003-05-15 Toray Engineering Co., Ltd. Procede et dispositif de montage

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003205256A (ja) * 2001-11-12 2003-07-22 Ikeuchi:Kk ノズル
JP2004022949A (ja) 2002-06-19 2004-01-22 Toray Eng Co Ltd 実装装置および実装方法
JP2012238775A (ja) * 2011-05-13 2012-12-06 Bondtech Inc アライメント装置およびアライメント方法

Also Published As

Publication number Publication date
CN108064126B (zh) 2019-11-19
JP6547968B2 (ja) 2019-07-24
JP2018078156A (ja) 2018-05-17
TWI652973B (zh) 2019-03-01
CN108064126A (zh) 2018-05-22
KR20180051345A (ko) 2018-05-16
TW201818802A (zh) 2018-05-16

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E902 Notification of reason for refusal
E90F Notification of reason for final refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant