KR102061315B1 - Device and method for producing substrate - Google Patents

Abstract

In the first coating station, a liquid thin film material is applied to one side of the base substrate, and the surface layer portion of the thin film material is cured by irradiating light to the thin film material coated on the base substrate. At the first coating station, the base substrate coated with the thin film material is brought into the inversion station. In the inverting station, the thin film material applied to the base substrate is irradiated with light to cure to the inside of the thin film material, and the front and back of the base substrate are reversed. The conveying apparatus conveys the base substrate between the first coating station and the reversing station. The control device controls the first coating station, the inversion station, and the conveying device. The control apparatus controls the conveying apparatus and conveys the base substrate processed by the 1st application station to the inversion station.

Description

Substrate manufacturing apparatus and substrate manufacturing method {Device and method for producing substrate}

The present invention relates to a substrate manufacturing apparatus for discharging droplets of thin film material to form a thin film on a base substrate.

Background Art A technique has been known in which a droplet of a thin film pattern forming material (thin film material) is discharged from a nozzle hole on a surface of a base substrate such as a printed wiring board to form a thin film pattern on the base substrate. The thin film pattern is, for example, a pattern of solder resist.

Disclosed is a liquid resin injector that injects liquid resin directly onto a substrate and forms a pattern based on image information of computer graphics (see Patent Document 1, for example). By the liquid resin injector described in Patent Document 1, the thin film pattern can be easily formed. Moreover, compared with the case of performing pattern formation by photolithography, process time can be shortened and production cost can be reduced.

Prior art literature

(Patent literature)

Patent Document 1: Japanese Patent Publication No. 3544543

There is a demand for a technique that can form a thin film pattern on both sides of a substrate substrate more easily. It is an object of the present invention to provide a substrate manufacturing apparatus capable of forming a thin film pattern on both sides of a base substrate with a simple configuration.

According to one aspect of the present invention,

A first coating station which applies a liquid thin film material to one side of the base substrate, and irradiates light on the thin film material applied to the base substrate to cure the surface layer portion of the thin film material;

An inverting station to which the base substrate coated with the thin film material is loaded in the first coating station, and irradiates light on the thin film material coated on the base substrate to cure the inside of the thin film material, and inverts the front and back of the base substrate; ,

A conveying apparatus for conveying a base substrate between said first coating station and said reversing station;

And a control device for controlling the first coating station, the inversion station, and the conveying device,

The control apparatus is provided with a substrate manufacturing apparatus which controls the conveying apparatus and conveys the substrate substrate processed at the first coating station to the inverting station.

According to another aspect of the present invention,

A step of bringing a substrate to a first coating station, applying a liquid thin film material to the first surface of the substrate to cure the surface layer portion of the thin film material applied to the substrate; and,

Taking out the base substrate from the first coating station and bringing it into the main curing unit, wherein the main curing unit hardens the thin film material coated on the first surface of the base substrate to the inside thereof;

Conveying the base substrate from the main curing unit to the inverting unit, and inverting the front and back of the base substrate in the inverting unit;

The substrate is taken out from the inversion unit, and the substrate is conveyed to the first coating station while the upper and lower sides of the substrate are inverted, and in the first coating station, the first surface of the substrate is Applying a liquid thin film material to the second surface on the opposite side to harden the surface layer portion of the thin film material applied to the second surface of the substrate;

A substrate having a step of conveying the base substrate from the first coating station to the main curing unit and curing the thin film material coated on the second surface of the base substrate to the inside thereof in the main curing unit. A manufacturing method is provided.

In the inverting station, by inverting the front and back of the base substrate on which the thin film pattern is formed on one surface, it is possible to easily form the thin film pattern on the other surface.

1 is a schematic view showing a substrate manufacturing apparatus according to Example 1. FIG.
In FIG. 2, FIG. 2 (a) is a schematic diagram of the alignment apparatus provided in the alignment station, and FIG. 2 (b) and FIG. 2 (c) are plan views showing the base substrate in the alignment station.
In FIG. 3, FIGS. 3A and 3B are schematic views of the liquid droplet discharging apparatus provided in the application station.
In FIG. 4, FIG. 4 (a) is a schematic diagram which shows a nozzle unit, FIG. 4 (b) is a bottom view which shows the droplet discharge surface of a nozzle unit, and FIG. 4 (c) is a nozzle A schematic plan view showing the arrangement of the unit.
In FIG. 5, FIGS. 5A to 5D are schematic views of the substrate inverting device and the ultraviolet irradiation device provided in the inversion station.
In FIG. 6, FIG. 6 (a), FIG. 6 (c), and FIG. 6 (e) are schematic plan views of the substrate supporter, FIG. 6 (b) and FIG. 6 (d). And FIG. 6F is a schematic side view of the substrate supporter.
7 is a schematic view of the substrate manufacturing apparatus according to the second embodiment.
8 is a schematic view of the substrate manufacturing apparatus according to the third embodiment.
9 is a schematic view of the substrate manufacturing apparatus according to the fourth embodiment.
10 is a schematic view of the substrate manufacturing apparatus according to the fifth embodiment.
11 is a schematic view of the substrate manufacturing apparatus according to the sixth embodiment.
12A to 12E are schematic diagrams of an inversion station of the substrate manufacturing apparatus according to the seventh embodiment.
In Fig. 13, Figs. 13A to 13D are schematic views of the inversion station of the substrate manufacturing apparatus according to the eighth embodiment.
14 is a schematic plan view of an application station of the substrate manufacturing apparatus according to the ninth embodiment.
In FIG. 15, FIGS. 15A to 15D are schematic plan views in the coating station for explaining the procedure of forming the thin film pattern in the coating station according to the ninth embodiment.
15E to 15H are schematic plan views of the coating station for explaining the procedure of forming the thin film pattern in the coating station according to the ninth embodiment.
In Fig. 16, Figs. 16A to 16C are schematic views of the inversion station of the substrate manufacturing apparatus according to the tenth embodiment.
In FIG. 16, FIGS. 16D to 16F are schematic views of the inversion station of the substrate manufacturing apparatus according to the tenth embodiment.
17 is a schematic view of the substrate manufacturing apparatus according to the eleventh embodiment.
In FIG. 18, FIGS. 18A to 18C are schematic views for explaining the processing procedure when the substrate is processed by the substrate manufacturing apparatus according to the eleventh embodiment.
In FIG. 18, FIGS. 18D to 18E are schematic views for explaining the processing procedure when the substrate is processed by the substrate manufacturing apparatus according to the eleventh embodiment.
In FIG. 18, FIGS. 18F to 18G are schematic views for explaining the processing procedure when the substrate is processed by the substrate manufacturing apparatus according to the eleventh embodiment.
In FIG. 19, FIG. 19A is a schematic view of the substrate manufacturing apparatus according to the twelfth embodiment, and FIG. 19B is a schematic side view of the temporary storage device.
20 (a) to 20 (c) are schematic diagrams for explaining a processing procedure when the substrate is processed by the substrate manufacturing apparatus according to the twelfth embodiment.
In FIG. 20, FIGS. 20D to 20E are schematic views for explaining the processing procedure when the substrate is processed by the substrate manufacturing apparatus according to the twelfth embodiment.
21 is a schematic view of the substrate manufacturing apparatus according to the thirteenth embodiment.
In Fig. 22, Figs. 22A, 22B, and 22C are the first, second, and second paths of the substrate when the second coating station is broken, respectively. And a schematic diagram showing a third example.
In Fig. 23, Figs. 23A, 23B, and 23C are the first, second, and second paths of the substrate when the first coating station is broken, respectively. And a schematic diagram showing a third example.
In FIG. 24, FIGS. 24A-24B are schematic diagrams for explaining the processing procedure when the substrate is processed by the substrate manufacturing apparatus according to the fourteenth embodiment.
In FIG. 24, FIGS. 24C-24D are schematic for demonstrating the process sequence at the time of processing a board | substrate with the board | substrate manufacturing apparatus by Example 14. FIG.
25 is a schematic view of the substrate manufacturing apparatus according to the fifteenth embodiment.
26 is a schematic diagram of a substrate manufacturing apparatus according to a modification of the fifteenth embodiment.

EXAMPLE 1

1, the schematic diagram of the board | substrate manufacturing apparatus by Example 1 is shown. The substrate manufacturing apparatus according to the first embodiment includes an alignment station 2, an application station 3, an inversion station 4, an alignment station 5, an application station 6, and an ultraviolet ray arranged inside the casing 18. Irradiation apparatuses 8 and 9 and lifters 11 to 14 are included. In the casing 18 of the board | substrate manufacturing apparatus, the carrying out openings 1 and 7 of a board | substrate are provided. The board | substrate manufacturing apparatus by Example 1 is used in order to form the thin film pattern of a soldering resist on both surfaces (1st surface and 2nd surface) of the base substrates 21-27 which are rectangular printed wiring boards, for example. In the present specification, the substrate on which the thin film pattern is not formed is sometimes referred to simply as a "substrate".

The substrate manufacturing apparatus includes the conveyors 15 and 16 and the control apparatus 20. The conveyor 15 carries in the board | substrates 21-27 from the exterior of the casing 18 inward. The lifters 11 to 14 convey the substrates 21 to 27 between the stations in the casing 18. The conveyor 16 carries out board | substrates 21-27 from the inside of the casing 18 to the outside. In the normal operation of the substrate manufacturing apparatus according to the first embodiment, the substrate is loaded from the substrate carrying in and out 1, and the substrate is carried out from the substrate carrying in and out 7. The operation of each device in the casing 18 and the operation of the conveyors 15 and 16 are controlled by the control device 20. The control device 20 includes a memory device 20a.

The boards 21 to 27 are loaded on the conveyor 15 and carried into the casing 18 through the carrying in and out opening 1. At this time, the 1st surface of the board | substrates 21-27 faces the upper direction of a figure (forward direction of a Z-axis).

An XYZ Cartesian coordinate system is defined with the vertical direction upwards in the Z direction. In the following description, the five stations from the alignment station 2 to the application station 6 are arranged in order in the forward direction of the X axis. The board | substrates 21-27 carried in into the casing 18 from the carrying in and out opening 1 are conveyed toward the positive direction of the X-axis as a whole via each station 2-6, and the casing 18 from the carrying out opening 7 is carried out. Are exported outside).

First, operation | movement at the time of normal operation of the board | substrate manufacturing apparatus by Example 1 is demonstrated. The substrates 21 to 27 introduced into the casing 18 are conveyed to the alignment station 2 by the lifter 11. In the alignment station 2, alignment marks formed on the surfaces of the substrates 21 to 27 are detected, and alignment (positioning) of the substrates 21 to 27 is performed based on the detection result.

Aligned substrates 21 to 27 are conveyed to the application station 3 by the lifter 11. In the coating station 3, a thin film pattern of solder resist is formed on the first surfaces of the substrates 21 to 27. In the thin film pattern formed in the coating station 3, only the surface layer part is hardened | cured, and the inside of a thin film pattern remains liquid. The phenomenon that only the surface layer is cured is called "temporary hardening", and the phenomenon of hardening to the inside is called "main hardening".

The substrates 21 to 27 on which the thin film pattern is formed on the first surface are conveyed from the application station 3 to the inversion station 4 by the lifter 12. In the inversion station 4, the front and back of the board | substrates 21-27 are reversed. As a result, the second surface of the substrates 21 to 27 faces the positive direction of the Z axis. In addition, in the inversion station 4, real hardening of the thin film pattern formed in the 1st surface of the board | substrates 21-27 is performed.

The substrates 21 to 27 on which the front and back are reversed and the thin film pattern on the first surface is actually cured are transferred to the lifter 13 from the inversion station 4 to the second alignment station 5. In the second alignment station 5, alignment marks formed on the second surfaces of the substrates 21 to 27 are detected, and the substrates 21 to 27 are aligned based on the detection result.

The boards 21 to 27 are conveyed from the alignment station 5 to the second coating station 6 by the lifter 13. In the second coating station 6, a thin film pattern of solder resist is formed on the second surface of the substrates 21 to 27. FIG.

The substrates 21 to 27 on which the thin film pattern is formed on the second surface are conveyed from the application station 6 to the conveyor 16 by the lifter 14. The conveyor 16 carries out board | substrates 21-27 from the carrying out opening 7 to the exterior of the casing 18. As shown in FIG. In the state where the board | substrates 21-27 are mounted on the conveyor 16, ultraviolet-ray is irradiated to the whole 2nd surface of the board | substrates 21-27 by the ultraviolet irradiation device 9. As shown in FIG. By ultraviolet irradiation, the thin film pattern formed in the 2nd surface of the board | substrates 21-27 is hardened | cured. The ultraviolet irradiation device 9 moves inside the casing 18 so as to pass above the substrates 21 to 27 loaded on the conveyor 16. When the ultraviolet irradiation device 9 passes above the substrates 21 to 27, ultraviolet rays are irradiated to the second surfaces of the substrates 21 to 27. Alternatively, when the ultraviolet irradiation device 9 is fixed in the casing 18 and the substrates 21 to 27 are loaded on the conveyor 16 and pass under the ultraviolet irradiation device 9, the ultraviolet irradiation device 9 The ultraviolet rays may be irradiated onto the substrates 21 to 27. Irradiation of the ultraviolet rays to the substrates 21 to 27 is controlled by the controller 20.

In the substrate manufacturing apparatus according to Example 1, the processing is performed in parallel at each station of the alignment station 2, the application station 3, the inversion station 4, the alignment station 5, and the application station 6, respectively. All. For example, in the alignment station 2, in the application station 3 during the period where the detection of the alignment mark formed on the first surface of the substrate 22 and the alignment of the substrate 22 are performed, another substrate ( A thin film pattern is formed on the first surface of 23). In the meantime, in the inversion station 4, the main hardening of the thin film pattern formed in the 1st surface of the other board | substrate 24 and the inversion of the front and back of the board | substrate 24 are performed, and in the alignment station 5, the other board | substrate 25 is carried out. The alignment mark formed on the 2nd surface of () and the board | substrate 25 are aligned. In the coating station 6, a thin film pattern is formed on the second surface of the other substrate 26. In the meantime, the conveyor 15 carries another substrate 21 having no thin film pattern into the casing 18, and the conveyor 16 carries the casing ( 18) to be taken out. In this way, since the treatments are performed in parallel, an improvement in the production efficiency can be realized.

The alignment station 2 is demonstrated with reference to FIG.2 (a)-FIG.2 (c). FIG. 2A shows a schematic diagram of the alignment apparatus provided in the alignment station 2. The alignment apparatus includes a Y stage 32, a θ stage 33, and a chuck plate 34 arranged on the base (expectation) 31 in order from the base 31 side. The chuck plate 34 sucks and supports the substrate 22 conveyed to the alignment station 2 by the lifter 11 (FIG. 1).

The Y stage 32 moves the substrate 22 in the Y-axis direction together with the θ stage 33 and the chuck plate 34. The θ stage 33 rotates the substrate 22 together with the chuck plate 34 with the axis parallel to the Z axis as the rotation center. In the present specification, the Y stage 32, the θ stage 33, and the chuck plate 34 are collectively referred to as "moving stage". Adsorption of the substrate 22 by the chuck plate 34 and movement of the substrate 22 by the Y stage 32 and the θ stage 33 are controlled by the controller 20.

The alignment apparatus includes CCD cameras 35 to 38. The CCD cameras 35 to 38 image the alignment marks formed on the surface of the substrate 22 supported by the chuck plate 34. Imaging by the CCD cameras 35 to 38 is controlled by the controller 20. The image data (detection results) obtained by the CCD cameras 35 to 38 are transmitted to the control device 20.

FIG. 2B shows a plan view of the moving stage included in the alignment station 2 and the substrate 22 adsorbed and supported by the chuck plate 34. Alignment marks 22a to 22d are formed on the first surface of the substrate 22. Alignment marks 22a-22d are arrange | positioned in the vicinity of four corners, respectively, for example.

The substrate 22 conveyed to the chuck plate 34 by the lifter 11 is supported by the chuck plate 34. The substrate 22 supported on the chuck plate 34 is moved in the negative direction of the Y axis by the Y stage 32. In FIG. 2B, the chuck plate 34 and the substrate 22 after being moved are shown in parentheses.

The CCD cameras 35 to 38 are disposed on the negative side of the Y axis rather than the position of the chuck plate 34 when the substrate 22 is received from the lifter 11. Moreover, CCD camera 35-38 has a relative positional relationship so that imaging marks 22a-22d can be imaged simultaneously, respectively. The substrate 22 is moved below the CCD cameras 35 to 38 by the Y stage 32, and the alignment marks 22a on which the CCD cameras 35 to 38 are formed on the first surface of the substrate 22, respectively. 22d). The captured image data is transmitted to the control device 20.

The control apparatus 20 analyzes the image data acquired by the CCD cameras 35-38, and positions the position of the board | substrate 22, and the position (position) of the rotation direction which made the axis parallel to the Z axis the rotation center. Calculate Thereafter, the position of the substrate 22 in the rotational direction is corrected. The correction of the position in the rotation direction is called "θ correction".

In FIG. 2B, as an example, a position shift occurs in the substrate 22 by an angle α in the counterclockwise direction from the target position with respect to the rotational direction of the XY plane. In this case, the side connecting the vertex corresponding to the alignment mark 22a and the vertex corresponding to the alignment mark 22d is inclined by an angle α in the counterclockwise direction from the forward direction of the X axis, based on the latter vertex. It is lost. The position shift is calculated by the control apparatus 20 based on the image data acquired by the CCD cameras 35 to 38. The controller 20 corrects θ by rotating the θ stage 33 clockwise by an angle α.

2 (c), the top view of the chuck plate 34 and the board | substrate 22 after (theta) correction is shown. As a result of θ correction, each side of the rectangular substrate 22 is parallel to the X axis or the Y axis. After the θ correction of the substrate 22 is performed, the controller 20 drives the Y stage 32 to move the substrate 22 in the positive direction of the Y axis. The movement distance of the Y stage 32 is the same as the distance which moved the Y stage 32 to the negative direction of the Y-axis in the process shown to FIG. 2 (b).

The chuck plate 34 and the board | substrate 22 after having moved to the positive direction of the Y-axis in the parentheses of FIG.2 (c) are shown. The substrate 22 subjected to θ correction is conveyed from the alignment station 2 to the coating station 3 (FIG. 1) by the lifter 11 (FIG. 1). The lifter 11 maintains the position (posture) in the rotational direction of the substrate 22 after the θ correction by the rotation of the θ stage 33, and transports it to the application station 3.

Since the correction is completed in the alignment station 2 shown in FIG. 1, in the coating station 3, the thin film pattern is formed on the first surface of the substrate 22 without performing θ correction on the substrate 22. May be initiated. The treatment time at the coating station 3 can be shortened as compared with the case where θ correction is performed at the coating station 3 and a thin film pattern is formed thereafter. As a result, it is possible to shorten the tact time and to improve the production efficiency.

Elongational deformation may occur in the substrate 22. If extensional strain has occurred, the dimensions of the substrate at the time of forming the thin film pattern are different from the design values. The control apparatus 20 calculates the dimension of the board | substrate 22 based on the image data acquired by the alignment station 2. Based on the calculated dimensions of the substrate, the discharge control image data used when forming the thin film pattern in the application station 3 is generated. The generated discharge control image data is stored in the storage device 20a of the control device 20.

3 (a) and 3 (b) show schematic views of the liquid droplet discharging device 70 provided in the application station 3 (FIG. 1). As shown in Fig. 3A, the liquid droplet discharging device 70 is disposed on the base (expectation) 41 and the base 41, which are provided in a posture parallel to the XY plane, from the base 41 side. The X stage 43, the Y stage 44, and the chuck plate 45 arranged in this order are included. The chuck plate 45 sucks and supports the substrate 23 conveyed to the coating station 3 by the lifter 11 (FIG. 1).

The X stage 43 moves the substrate 23 along the Y stage 44 and the chuck plate 45 in the X axis direction. The Y stage 44 moves the substrate 23 along the chuck plate 45 in the Y-axis direction. The X stage 43, the Y stage 44, and the chuck plate 45 are collectively referred to as "moving stages". Adsorption of the substrate 23 by the chuck plate 45 and movement of the substrate 23 by the X stage 43 and the Y stage 44 are controlled by the controller 20.

However, a high performance stage having the functions of the X stage 43, the Y stage 44, and the chuck plate 45 may be used as the moving stage.

The frame 42 is fixed to the base 41. The frame 42 includes two struts 42a and 42b and a beam 42c. The struts 42a and 42b are attached to the substantially center of the Y-axis direction of the base 41. FIG. The beam 42c is supported by the support posts 42a and 42b so that it may follow the X-axis direction. The nozzle units 47a to 47f are supported above the chuck plate 45 by the frame 42.

The nozzle units 47a to 47f are supported by the beam 42c of the frame 42 via the connecting member 46. The nozzle units 47a to 47f each include a plurality of nozzle heads and an ultraviolet light source. The nozzle head discharges, for example, droplets of an ultraviolet curable thin film material toward the first surface of the substrate 23 supported by the chuck plate 45. Discharge of thin film material is performed, moving the board | substrate 23 to a Y-axis direction. The discharged thin film material forms a thin film pattern having a predetermined planar shape on the first surface of the substrate 23. The thin film pattern is temporarily hardened by the ultraviolet rays emitted from the ultraviolet light source.

In the storage device 20a of the control device 20, image data (pattern definition data) defining a planar shape of a thin film pattern to be formed on the first surface of the substrate 23 is stored. The pattern definition data is given, for example, in Gerber format. In the memory device 20a, data indicating a relationship (discharge timing) between the movement amount of the substrate 23 by the moving stage and the discharge timing of the ink from the nozzle head is stored. These data are design data given on the premise that the substrate 23 does not generate deformation. When deformation has occurred in the substrate 23, this design data cannot be used as it is.

The control apparatus 20 produces | generates image data for discharge control based on the image data of the board | substrate 23 picked up by the alignment station 2 (FIG. 1) from these design data. The image data for discharge control is given, for example, in a raster format. Hereinafter, the generation procedure of the discharge control image data will be described. The control apparatus 20 calculates the amount of expansion and contraction of the substrate 23 in the X direction and the Y direction from the image data acquired by the alignment station 2. The pattern definition data is corrected in accordance with the amounts of expansion and contraction in the X and Y directions of the substrate 23 with respect to the X and Y directions. Based on the pattern definition data after correction, image data for discharge control in the raster format is generated.

The control device 20 controls the thin film material from the nozzle units 47a to 47f so as to apply the thin film material to the predetermined area of the first surface of the substrate 23 based on the image data for discharge control stored in the storage device 20a. The discharge of the thin film material and the movement of the substrate 23 by the moving stage are controlled. The thin film material is apply | coated to the 1st surface of the board | substrate 23 when the board | substrate 23 moves along a Y-axis direction and passes perpendicularly downward (negative direction of a Z-axis) of nozzle units 47a-47f.

3B, a schematic diagram of the vicinity of the nozzle units 47a to 47f of the droplet discharging device 70 is shown. The nozzle units 47a to 47f have the same configuration and are fixed to the connecting member 46 at equal intervals along the X-axis direction. The connecting member 46 is attached to the beam 42c of the frame so as to be movable in the Z-axis direction. By moving the connecting member 46 in the Z-axis direction, the distance between the nozzle units 47a to 47f and the substrate 23 can be changed. The movement of the nozzle units 47a to 47f in the Z-axis direction by the connecting member 46 is controlled by the controller 20. However, the nozzle units 47a to 47f may be directly fixed to the beam 42c of the frame without interposing the connecting member 46.

4A, a perspective view of the nozzle unit 47a is shown. The nozzle unit 47a includes nozzle heads 47a ₁ to 47a ₄ alternately provided along the Y-axis direction, and ultraviolet light sources 47a ₅ to 47a _{9 in the} nozzle holder 47a _c . Each nozzle head (47a ₁ ~ 47a ₄₎ is provided with two rows of nozzle array are arranged along the Y-axis direction. Each nozzle row is comprised by the some, for example, 192 nozzle hole arrange | positioned along the X-axis direction. The length along the X-axis direction of each nozzle row is about 30 mm, for example. For this reason, the length along the X-axis direction of the nozzle unit 47a is also about 30 mm. Ultraviolet curable thin film material is discharged from each nozzle hole.

The ultraviolet light sources 47a ₅ to 47a ₉ include light emitting diodes (LEDs), for example, and emit light having a wavelength in the ultraviolet region. The ultraviolet curable thin film material discharged to the substrate 23 from each nozzle hole of the nozzle heads 47a ₁ to 47a ₄ is temporarily cured by the light emitted from the ultraviolet light sources 47a ₅ to 47a ₉ . The emission of the ultraviolet light from the ultraviolet light sources 47a ₅ to 47a ₉ is controlled by the controller 20.

In Figure 4 (b), shows a bottom view of the nozzle unit (47a) (the nozzle head _{(47a 1 ~ 47a 4))} . In FIG. 4B, the description of the ultraviolet light sources 47a ₅ to 47a ₉ is omitted.

Note that one nozzle row of the nozzle heads 47a ₁ to 47a ₄ is disposed at intervals of 160 μm along the X-axis direction. In each nozzle head (47a ₁ ~ 47a _4), the nozzle arrays in the nozzle hole of the Y-axis positive side has, with respect to the nozzle arrays in the nozzle hole of the side of Y axis, it is displaced in the X axis positive direction 80㎛. Thus, each nozzle head 47a ₁ to 47a ₄ includes 384 nozzle holes arranged in a zigzag shape at intervals of 80 mu m in the X-axis direction, and has a resolution equivalent to about 300 dpi. A piezoelectric element is disposed in each nozzle hole, and the thin film material is discharged from the nozzle hole by applying a voltage to the piezoelectric element. The application of the voltage to the piezoelectric element is controlled by the controller 20. In other words, the discharge of the thin film material is controlled by the controller 20. In Example 1, although two rows of nozzles were arranged in each of the nozzle heads 47a ₁ to 47a ₄ , the number of nozzle rows may be one, or three or more.

The nozzle heads 47a ₁ to 47a ₄ are arranged along the Y-axis direction as a whole while shifting the relative positions in the positive direction of the X-axis in order. In other words, the nozzle head 47a ₂ is disposed to be offset from the nozzle head 47a ₁ in the positive direction of the X axis by 20 μm. Similarly, nozzle head 47a ₃ , 47a ₄ is arrange | positioned with respect to nozzle head 47a ₂ , 47a ₃ , and shifts in the positive direction of an X-axis by 20 micrometers, respectively. The nozzle unit 47a has a plurality of nozzle holes which are arranged at an interval of 20 μm (resolution equivalent to about 1200 dpi) in the X axis direction.

4 (c), schematic plan views of the nozzle units 47a to 47f are shown. As described above, each nozzle unit 47a to 47f has a liquid droplet discharging ability in a range of about 30 mm along the X-axis direction. Moreover, the some nozzle unit 47a-47f is arrange | positioned at equal intervals along the X-axis direction. The distance between adjacent nozzle units 47a-47f is about 60 mm, for example.

The process in the application | coating station 3 (FIG. 1) is demonstrated. The lifter 11 conveys the substrate 23 and is mounted on the chuck plate 45 (FIG. 3A). While moving the substrate 23 supported by the chuck plate 45 in the negative direction of the Y-axis, an odd-numbered region (circle in FIG. 4C) along the Y-axis direction below each of the nozzle units 47a to 47f. The thin film material is discharged from the nozzle units 47a to 47f toward the impact target position (position to which the thin film material should be applied) of the marked area). When application | coating to the impact target position of an odd-numbered area | region is complete | finished, the board | substrate 23 is moved by the X stage 43 (FIG. 3 (a)) by the positive direction of an X-axis, for example by 10 micrometers. Subsequently, even-numbered area regions along the Y-axis direction below the nozzle units 47a to 47f are moved while moving the substrate 23 in the positive direction of the Y-axis (the area indicated by X in FIG. 4C). The thin film material is discharged from the nozzle units 47a to 47f toward the impact target position. The thin film material can be impacted at the target positions of the odd-numbered and even-numbered regions, respectively, in the forward and return paths of the movement of the substrate 23. As a result, a thin film pattern can be formed at a high resolution equivalent to about 2400 dpi.

When the application of the thin film material to the even-numbered regions is completed, the X stage 43 is driven to move the substrate 23 by about 30 mm in the positive direction of the X axis. The Y stage 44 causes the substrate 23 to reciprocate in the Y-axis direction, and the odd-numbered and even-numbered regions are drawn in the paths and the return paths, respectively.

The same process is performed again to form the thin film pattern on the first surface of the substrate 23 by reciprocating the substrate 23 in total along the Y axis direction.

The droplet discharging device 70 shown to FIG.3 (a)-FIG.4 (c) is equipped with six nozzle units 47a-47f. The number of nozzle units is not limited to six. For example, the number of nozzle units may be one.

5A to 5D show schematic views of the substrate reversing apparatus 50 and the ultraviolet irradiation device (thin film material solidifying apparatus) 60 provided in the inversion station 4 (FIG. 1). . As shown in FIG. 5A, the substrate inverting device 50 includes a substrate support 51 and a substrate support 51 for supporting the substrates 21 to 27 conveyed to the inversion station 4. It includes a rod-shaped support member 52 for supporting. The board | substrate supporter 51 is comprised from the rod-shaped member along three remaining sides which removed one short side among four rectangular sides. The part along two long sides parallel to each other is called "cancer", and the part along one short side is called "connection part". The support member 52 is connected to the midpoint of the connecting portion, and extends in the opposite direction to the two arms. The substrate supporter 51 is rotatable using the support member 52 as the rotation axis. The rotation of the substrate supporter 51 by the support member 52 is controlled by the controller 20.

The ultraviolet irradiation device 60 includes a support member 61 and an ultraviolet light source 62. The supporting member 61 extends in a direction parallel to the extending direction of the supporting member 52 of the substrate reversing apparatus 50. The ultraviolet light source 62 includes a lamp or LED and emits light of a wavelength in the ultraviolet region. The ultraviolet light source 62 has a higher output than the ultraviolet light sources 47a ₅ to 47a ₉ (FIG. 4A) included in the nozzle unit. The wavelength of the ultraviolet light emitted from the ultraviolet light source 62 may be the same as or different from the wavelength of the ultraviolet light emitted from the ultraviolet light source of the nozzle unit.

The ultraviolet light source 62 is supported by the support member 61 to be movable in the extending direction. The emission of the ultraviolet light from the ultraviolet light source 62 and the movement along the supporting member 61 of the ultraviolet light source 62 are controlled by the controller 20.

As shown in Fig. 5B, the substrates 21 to 27 having the thin film pattern formed on the first surface of the coating station 3 (Fig. 1), and the substrate 24 as an example, the lifter 12 (Fig. It is conveyed to the inversion station 4 by 1). The substrate 24 is loaded on the substrate support 51 by the lifter 12 so that the first surface (the surface on which the thin film pattern is formed) of the substrate 24 is upward (facing the positive direction of the Z axis). . The substrate supporter 51 supports the substrate 24 fixedly by suction, pressing, clamping, or the like. In other words, the substrate 24 is supported so as not to move relative to the substrate support 51. The fixed support of the substrate 24 by the substrate support 51 and its release are controlled by the controller 20.

As shown in FIG. 5C, the ultraviolet light source 62 is moved along the supporting member 61 while emitting the ultraviolet light from the ultraviolet light source 62. When moving the ultraviolet light source 62 along the support member 61, the ultraviolet light source 62 passes above the substrate 24 supported by the substrate support 51, and the ultraviolet light source 62 Ultraviolet light emitted from the () is irradiated to at least the region where the thin film pattern of the substrate 24 is formed, for example, the entire area of the first surface of the substrate 24. The ultraviolet light emitted from the ultraviolet light source 62 is irradiated to the entire first surface of the substrate 24 at an energy density of, for example, 1000 mJ / cm ² . By irradiation of ultraviolet light, the main hardening of the thin film pattern formed in the 1st surface of the board | substrate 24 is performed. When the main curing of the thin film pattern is performed, ultraviolet light is irradiated onto the substrate 24 at a stronger energy density than when performing temporary curing.

As shown in FIG.5 (d), after main-hardening the thin film pattern of the 1st surface of the board | substrate 24, the board | substrate support 51 is rotated 180 degrees with the support member 52 as a rotating shaft. This reverses the front and back of the substrate 24 supported by the substrate support 51. The board | substrate 24 whose front and back were reversed is conveyed to the alignment station 5 by the lifter 13 (FIG. 1). When the process in the alignment station 5 is complete | finished, the board | substrate 24 is conveyed to the application | coating station 6. Before the conveyance by the lifter 13 is performed, the support of the substrate 24 by the substrate support 51 is released.

Referring to Figs. 6A to 6F, the substrate support structure of the substrate support 51 will be described. 6 (a), 6 (c), and 6 (e) show schematic plan views of the substrate supporter 51, (b), FIG. 6 (d), And FIG. 6F shows a schematic side view of the substrate support 51.

In the example shown to FIG. 6 (a) and FIG. 6 (b), the board | substrate supporter 51 is equipped with the vacuum suction pad 53 on the surface of an arm. 6A and 6B show an example in which a plurality of vacuum suction pads 53 are formed on the upper surfaces of two arms. The substrate 24 is loaded on the vacuum adsorption pad 53 by the lifter 12 (FIG. 1), and is supported by the substrate support 51 by the suction force from the vacuum adsorption pad 53.

In the example shown to FIG.6 (c) and FIG.6 (d), the board | substrate supporter 51 is equipped with the press roller 54 extended in parallel with an arm on two arms. By the lifter 12 (FIG. 1), the press roller 54 moves on the edge of the board | substrate 24 mounted on the upper surface of the board | substrate support 51. As shown in FIG. The substrate 24 is pressed by the push roller 54, thereby being fixedly supported by the substrate support 51.

In the examples shown in FIGS. 6E and 6F, the substrate support 51 includes a clamp mechanism 55. The clamp mechanism 55 has an upright part extending in the direction parallel to two arms, and it bends 90 degrees so that a part (clamp tip) may be bend | folded inward. The edge of the substrate 24 loaded on the substrate support 51 is fitted to the clamp mechanism 55, so that the substrate 24 is supported by the substrate support 51.

In any of the configuration examples of FIGS. 6A to 6F, the substrate supporter 51 contacts the substrate 24 at the portion where the thin film pattern is not formed.

In the above-mentioned example, after ultraviolet light was irradiated, the thin film pattern of the 1st surface of the board | substrate 24 was completely hardened, the board | substrate support 51 was rotated, and the front and back of the board | substrate 24 were reversed. After inverting the front and back of the substrate 24, ultraviolet light may be irradiated to the first surface of the substrate 24 from the negative side of the Z axis to perform main curing. In addition, the main curing by irradiation of ultraviolet light and the inversion of the substrate 24 by the rotation of the substrate supporter 51 may be simultaneously performed in parallel. In this case, for example, the ultraviolet light source 62 is rotated in synchronization with the rotation of the substrate 24 so that ultraviolet light having a predetermined intensity is irradiated onto the first surface of the substrate 24 during rotation. Adopt. By performing the main curing in the period in which the substrate 24 is inverted, the processing time in the inversion station 4 can be shortened.

The substrate 24 on which the main hardening of the thin film pattern on the first surface and the front and back are reversed is conveyed to the alignment station 5 (FIG. 1) by the lifter 13 (FIG. 1).

The alignment station 5 has the same structure and function as the alignment station 2. Alignment marks formed on the second surface opposite to the first surface of the substrate 24 are detected by the CCD camera, and θ correction is performed. Moreover, the image data for discharge control used when calculating the dimension of the board | substrate 24 on which the thin film pattern formation of the 1st surface was completed, and forming a thin film pattern on the 2nd surface of the board | substrate 24 from the image data imaged imaged is newly renewed. Create Further, θ correction of the substrate 24 is performed in the alignment station 5.

The lifter 13 (FIG. 1) carries the board | substrate 24 after (theta) correction to the stage of the application | coating station 6 (FIG. 1), maintaining the direction of the rotation direction.

The coating station 6 has the same structure and function as the coating station 3. In the coating station 6, a thin film pattern is formed in the 2nd surface of the board | substrate 24 based on image data for discharge control of a 2nd surface.

However, the image data for discharge control of the second surface can also be created based on the image data acquired by the first alignment station 2. In this case, the image data obtained by the alignment station 5 is used only for θ correction, for example.

Since the θ correction of the substrate 24 is performed at the alignment station 5, the θ correction is not necessary at the coating station 6. For this reason, formation of the thin film pattern to a 2nd surface can be started, without performing the alignment of the board | substrate 24 conveyed to the application station 6 in the rotation direction. Thereby, the processing time in the coating station 6 can be shortened, and it is possible to shorten the tact time and to improve the production efficiency.

The substrate 24 on which the formation of the thin film pattern on the second surface is completed is conveyed to the conveyor 16 by the lifter 14 (FIG. 1). The ultraviolet ray which radiate | emitted the ultraviolet irradiation device 9 was irradiated to the 2nd surface of the board | substrate 24 mounted on the conveyor 16, and this hardening of a thin film pattern is performed. Subsequently, the substrate 24 is carried out from the carrying in and out 7 to the outside of the casing 18 by the conveyor 16.

In the board | substrate manufacturing apparatus by Example 1, the stage of the coating station 6 (FIG. 1) from the completion | finish of formation of the thin film pattern to the 1st surface of the board | substrate 24 in the coating station 3 (FIG. 1). In the inversion station 4, the thin film pattern formed in the 1st surface of the board | substrate 24 is hardened | cured until it loads the board | substrate 24 in the main body. The thin film pattern formed on the 1st surface of the board | substrate 24 in the application | coating station 3 does not contact anywhere, and is hardened by the inversion station 4 at this point.

In the state where the thin film pattern is not hardened, tacking occurs in the thin film pattern. When the thin film pattern of the second surface of the substrate 24 is formed without carrying out the main curing of the thin film pattern of the first surface of the substrate 24, for example, the substrate by the lifter 13 (FIG. 1). When the thin film pattern is formed on the second surface of the substrate 24 in the handling of (24) or in the application station 6, traces of scratches or the like may remain on the thin film pattern on the first surface. Further, due to the tack, defects may occur in various processes.

From the end of forming the thin film pattern of the first surface of the substrate 24 until the substrate 24 is loaded on the stage of the coating station 6, the thin film pattern formed on the first surface of the substrate 24 is completely cured. By doing so, it is possible to prevent scratches and traces from remaining on the thin film pattern on the first surface of the substrate 24. This makes it possible to form a high quality thin film pattern.

Moreover, since the hardening of the thin film pattern of the 2nd surface of the board | substrate 24 is performed by the ultraviolet-ray which emitted the ultraviolet irradiation device 9, after carrying out to the exterior of the casing 18, Scratches and traces can be prevented from remaining on the thin film pattern on the second surface.

With reference to FIG. 1, the operation | movement at the time of non-normal operation of the board | substrate manufacturing apparatus by Example 1 is demonstrated. In normal operation, for example, one of the liquid droplet discharging apparatuses disposed in the dispensing stations 3 and 6 is in a state of failure or maintenance, and only the other dispensing station can be used.

The operation of the substrate manufacturing apparatus in the period in which a defect occurs in the liquid drop discharging device of the second coating station 6 or the period during which the liquid drop discharging device is maintained will be described. This operation is realized by the control from the control device 20.

Processing in the alignment station 2, the application station 3, and the inversion station 4 for the substrate introduced into the casing 18 is the same as in normal operation. That is, in the alignment station 2, the alignment mark formed in the 1st surface of a board | substrate is detected, and (theta) correction of a board | substrate is performed based on a detection result. Moreover, the size of a board | substrate is calculated based on the image data acquired by the alignment station 2, and the discharge control image data is produced | generated according to the grasped size. The lifter 11 conveys to the stage of the application station 3 in the state which maintained the position (posture) of the board | substrate rotation direction. In the coating station 3, a thin film pattern is formed on the first surface of the substrate based on the image data for discharge control. The lifter 12 conveys the substrate from the application station 3 to the inversion station 4. In the inversion station 4, the main hardening of the thin film pattern formed in the 1st surface of the board | substrate, and the inversion of front and back are performed.

The board | substrate with which the main hardening of the thin film pattern of the 1st surface and the front and back were reversed is conveyed to the 1st alignment station 2 by the lifter 12 or 11. In the alignment station 2, alignment marks formed on the second surface of the substrate are detected by the CCD cameras 35 to 38 (FIG. 2A). Based on the detection result, θ correction of the substrate is performed. Moreover, the size of a board | substrate is calculated based on the image data acquired by CCD camera 35-38, and the image data for discharge control of the thin film pattern formed in the 2nd surface of a board | substrate is produced | generated according to the calculated size. .

However, the image data for discharge control of the thin film pattern formed on the second surface may be generated based on the image data obtained by imaging the alignment mark on the first surface. In this case, the image data obtained by the alignment station 2 after substrate inversion is used only for θ correction.

The board | substrate with which (theta) correction was performed is conveyed to the application | coating station (3) by the lifter (11).

In the coating station 3, a droplet ejection apparatus forms a thin film pattern on the second surface of the substrate based on the image data for controlling discharge of the thin film pattern formed on the second surface.

The board | substrate with which the thin film pattern was formed in the 2nd surface is conveyed to the conveyor 15 by the lifter 11. As shown in FIG. The conveyor 15 carries out a board | substrate from the carrying out opening 1 to the exterior of the casing 18. In the event of failure or maintenance of the liquid droplet discharging device of the coating station 6, the substrate loading / unloading opening 1 is used for loading and unloading the substrate. In the state mounted on the conveyor 15, ultraviolet-ray is irradiated to the whole area | region of the 2nd surface of a board | substrate by the ultraviolet irradiation device 8, and the main hardening of the thin film pattern formed in the 2nd surface is performed. The ultraviolet irradiation device 8 is movable inside the casing 18 so as to pass above the substrate loaded on the conveyor 15, and irradiates ultraviolet rays to the second surface of the substrate while passing above the substrate. However, the ultraviolet irradiation device 8 may be fixedly disposed in the casing 18 and the substrate may pass under the ultraviolet irradiation device 8 in the period of conveying the substrate to the conveyor 15. Irradiation of ultraviolet rays to the substrate is controlled by the controller 20.

In the substrate manufacturing apparatus according to the first embodiment, at the time of failure or maintenance of the liquid droplet discharging device of the coating station 6, the liquid droplet discharging device of the first coating station 3 is used to obtain the first substrate of the substrate. Thin film patterns are formed on both the surface and the second surface. In this way, even when the second coating station 6 cannot be used, the formation of the thin film pattern can be continued using the first coating station 3.

In normal operation, the substrates are processed in parallel at the same time in each of the stations 2 to 4, but at the time of failure or maintenance of the droplet discharging device of the second coating station 6, the substrates are not concurrent. It is processed one by one. For example, after the process with respect to one board | substrate is complete | finished and the board | substrate is carried out from the casing 18, another board | substrate is carried in into the casing 18. As shown in FIG. For this reason, in non-normal operation, production efficiency becomes low compared with normal operation.

In some cases, the substrate may be conveyed to the conveyor 15 using the lifter 11 after the thin film pattern is formed at the coating station 3 without the formation of the thin film pattern on the second surface. After the formation of the thin film pattern on the first surface is completed, the reverse station 4 performs the main curing of the thin film pattern on the first surface, and then transfers the substrate to the conveyor 15 using the lifter 12 or 11. It is also possible. In addition, in the inversion station 4, not only the hardening of a thin film pattern but also the inversion of the front and back of a board | substrate may be performed.

As described above, when the droplet discharging device of the second coating station 6 breaks down or is maintained, the thin film material is applied using the droplet discharging device of the first coating station 3. At the time of failure or maintenance of the droplet discharging device of the first dispensing station 3, the thin film material is applied using the droplet discharging device of the second dispensing station 6.

Next, the operation of the substrate manufacturing apparatus in the period in which a problem occurs in the liquid drop discharging device of the first coating station 3 or in the period in which the liquid drop discharging device is maintained is described.

The conveyor 16 carries in a board | substrate into the casing 18 from the carrying in and out 7. The board | substrate carrying in / out 7 is used not only for carrying out a board | substrate but also for carrying in a board | substrate. However, at the time of carrying in, the 1st surface of a board | substrate faces the positive direction of a Z axis.

The substrate introduced into the casing 18 is conveyed to the alignment station 5 by the lifter 14 or 13. In the alignment station 5, an alignment mark formed on the first surface of the substrate is detected. Θ correction of the substrate is performed based on the detection result. Moreover, the size of a board | substrate is calculated based on the image data acquired by the alignment station 5, and image data for discharge control is produced | generated according to the calculated size.

The board | substrate with which (theta) correction was performed is conveyed to the stage of the application | coating station 6 by the lifter 13. As shown in FIG. On the basis of the generated discharge control image data, a thin film pattern is formed on the first surface of the substrate. Then, the board | substrate is conveyed to the inversion station 4 by the lifter 13, and main hardening of the thin film pattern formed in the 1st surface and inversion of front and back are performed.

The board | substrate with the 2nd surface facing the positive direction of a Z-axis is conveyed to the alignment station 5 by the lifter 13 again. In the alignment station 5, the alignment mark formed on the 2nd surface of the board | substrate is detected, and (theta) correction of a board | substrate is performed based on a detection result. Moreover, based on the image data acquired by the alignment station 5, the size of a board | substrate is computed and the image data for discharge control of the thin film pattern formed in a 2nd surface is produced | generated according to the calculated size.

However, the image data for discharge control of the thin film pattern formed on the second surface may be created based on the detection result of the alignment mark on the first surface.

The board | substrate with which (theta) correction was performed is conveyed to the stage of the application | coating station 6 by the lifter 13. As shown in FIG.

In the coating station 6, the thin film pattern is formed on the second surface by the liquid droplet discharging device based on the image data for controlling discharge of the thin film pattern formed on the second surface.

The board | substrate with which the thin film pattern was formed in the 2nd surface is conveyed to the conveyor 16 by the lifter 14. As shown in FIG. The conveyor 16 carries out a board | substrate from the carrying out opening 7 to the exterior of the casing 18. In the state loaded on the conveyor 16, the ultraviolet irradiation device 9 irradiates ultraviolet rays to the entire area of the second surface of the substrate, thereby realizing the thin film pattern.

After the processing with respect to one board | substrate is complete | finished and the board | substrate is carried out from the casing 18, the board | substrate which should be processed next is carried in into the casing 18. As shown in FIG.

Depending on circumstances, the substrate may be conveyed to the conveyor 16 using the lifter 14 after the formation of the thin film pattern on the first surface at the coating station 6 is not formed on the second surface. have. After the formation of the thin film pattern of the first surface is completed, it is also possible to carry out the main curing of the thin film pattern of the first surface in the inversion station 4, and then to convey the substrate to the conveyor 16 by the lifter 13 or 14. Do. In addition, in the inversion station 4, not only the hardening of a thin film pattern but also the inversion of the front and back of a board | substrate may be performed.

However, in the case where one of the liquid droplet discharging devices of the application stations 3 and 6 is unavailable, an example of forming the thin film pattern in the order of the first surface and the second surface has been described. Thin film patterns may be formed in order. In addition, although the example which forms a thin film pattern only in the 1st surface was shown, you may form a thin film pattern only in a 2nd surface.

In the substrate manufacturing apparatus according to the first embodiment, in the case of failure or maintenance of the droplet discharging apparatus of the second dispensing station 6, the liquid discharging apparatus of the first dispensing station 3 is used. When the material is applied and the droplet discharging device of the first coating station 3 fails or is maintained, the thin film material is applied using the droplet discharging device of the second coating station 6. . For this reason, the board | substrate manufacturing apparatus by Example 1 is excellent in continuity of work | work.

EXAMPLE 2

7 is a schematic view of the substrate manufacturing apparatus according to the second embodiment. Hereinafter, the difference with Example 1 is demonstrated and description is abbreviate | omitted about the same structure. In Example 2, the alignment stations 2 and 5 do not include the alignment apparatus for performing (theta) correction. Instead, the droplet ejection apparatuses of the application stations 3 and 6 include the θ stage 49 and the CCD cameras 63 to 66.

An operation during normal operation of the substrate manufacturing apparatus according to the second embodiment will be described.

In the alignment stations 2 and 5 of the second embodiment, temporary stages 48, which are alignment devices for performing a simple alignment without θ correction, are arranged. The substrates 21 to 27 are mounted on the temporary stage 48 of the alignment stations 2 and 5 by the lifters 11 and 13. The substrates 21 to 27 are conveyed to the application stations 3 and 6 after simple alignment such as pressing on the fixing pins is performed.

The droplet ejection apparatuses of the application stations 3 and 6 include a θ stage 49 between the Y stage 44 and the chuck plate 45. The θ stage 49 can rotate the substrates 21 to 27 supported by the chuck plate 45 with a straight line parallel to the Z axis as the rotation center. The droplet ejection apparatus includes CCD cameras 63 to 66 for detecting alignment marks formed on the surfaces facing the substrates 21 to 27 upward.

The substrates 21 to 27 conveyed to the application stations 3 and 6 are supported by the chuck plates 45, and the alignment marks on the upper surface of the substrates 21 to 27 are detected by the CCD cameras 63 to 66. The detection result, that is, the captured image data is transmitted to the control device 20.

The control apparatus 20 analyzes a detection result, and calculates the position of the board | substrate 21-27 in the X and Y direction, and the position (posture) of a rotation direction. Based on the calculated result, the θ correction of the substrates 21 to 27 is performed by driving the θ stage 49. Moreover, the control apparatus 20 calculates the size of the board | substrates 21-27 based on the detection result of CCD camera 63-66, and produces | generates image data for discharge control according to the calculated size.

In the substrate manufacturing apparatus according to the second embodiment, θ correction of the substrates 21 to 27 is performed at the coating stations 3 and 6 without performing θ correction of the substrates 21 to 27 at the alignment stations 2 and 5. Is done. Further, a thin film pattern is formed on the substrates 21 to 27 based on the generated discharge control image data.

The operation | movement at the time of non-normal operation of the board | substrate manufacturing apparatus by Example 2 is demonstrated centering on a point different from Example 1. FIG.

When the liquid droplet discharging device of the second coating station 6 cannot be used for failure or maintenance, the operation of the substrate manufacturing apparatus according to the second embodiment is controlled by the controller 20 as follows.

The board | substrate introduce | transduced into the casing 18 from the carrying in and out opening 1 is mounted on the temporary stage 48 of the alignment station 2, and simple alignment is performed. Thereafter, it is conveyed from the alignment station 2 to the chuck plate 45 of the application station 3.

The substrate is supported by the chuck plate 45 and the alignment marks on the first surface are detected by the CCD cameras 63 to 66. The detection result is transmitted to the control device 20. The control apparatus 20 analyzes a detection result, and detects the position of a board | substrate, and the attitude | position of a rotation direction. Θ correction of the substrate is performed based on the detection result. Moreover, the control apparatus 20 calculates the size of a board | substrate based on the detection result of CCD cameras 63-66, and produces | generates image data for discharge control according to the calculated size. Then, based on the generated discharge control image data, a thin film pattern is formed on the first surface of the substrate.

The board | substrate is conveyed to the inversion station 4 by the lifter 12, the main hardening of the thin film pattern formed in the 1st surface of the board | substrate, and inversion of front and back are performed. After that, a simple alignment is performed by loading the temporary stage 48 of the alignment station 2. After a simple alignment, it is returned to the chuck plate 45 of the liquid droplet discharging device of the application station 3 again.

In the coating station 3, alignment marks formed on the second surface of the substrate are detected by the CCD cameras 63 to 66, and θ correction of the substrate is performed based on the detection result. Moreover, the size of a board | substrate is calculated based on the image data acquired by CCD cameras 63-66, and the image data for discharge control of the thin film pattern formed in the 2nd surface of a board | substrate is produced | generated according to the calculated size. . The thin film pattern is formed on the second surface of the substrate based on the image data for discharge control of the thin film pattern formed on the second surface.

The board | substrate with which the thin film pattern was formed in the 2nd surface is conveyed by the conveyor 15, and the ultraviolet-ray irradiation apparatus 8 carries out the main hardening of the thin film pattern of the 2nd surface. Then, the conveyor 15 carries out a board | substrate from the carrying out opening 1 to the exterior of the casing 18.

When the droplet discharging device of the first coating station 3 cannot be used, the substrate manufacturing device is controlled by the control device 20 as follows.

The substrate is introduced into the casing 18 from the carrying in and out 7. The substrate introduced into the casing 18 is conveyed to the temporary stage 48 of the alignment station 5 by the lifters 14 and 13, and simple alignment is performed. Thereafter, it is conveyed from the alignment station 5 to the chuck plate 45 of the liquid droplet discharging device of the application station 6.

Alignment marks on the first surface of the substrate adsorbed and supported by the chuck plate 45 are detected by the CCD cameras 63 to 66, and the detection results are transmitted to the control device 20. The control apparatus 20 analyzes a detection result, detects the position of a board | substrate, and the attitude | position of a rotation direction, and performs (theta) correction. Moreover, the control apparatus 20 calculates the size of a board | substrate based on the detection result of CCD cameras 63-66, and produces | generates image data for discharge control according to the calculated size. Then, based on the generated discharge control image data, a thin film pattern is formed on the first surface of the substrate.

The board | substrate with which the thin film pattern was formed in the 1st surface is conveyed to the inversion station 4 by the lifter 13, and the main hardening of the thin film pattern formed in the 1st surface and inversion of front and back are performed. After that, a simple alignment is performed in the temporary stage 48 of the alignment station 5, and then returned to the chuck plate 45 of the droplet discharging device of the application station 6 again.

In the coating station 6, alignment marks formed on the second surface of the substrate are detected by the CCD cameras 63 to 66, and θ correction of the substrate is performed based on the detection result. Moreover, the size of a board | substrate is calculated based on the image data acquired by CCD cameras 63-66, and the image data for discharge control of the thin film pattern formed in the 2nd surface of a board | substrate is produced | generated according to the calculated size. . The thin film pattern is formed on the second surface based on the image data for discharge control of the thin film pattern formed on the second surface.

The board | substrate with which the thin film pattern was formed in the 2nd surface is conveyed by the conveyor 16, and the main curing of the thin film pattern of a 2nd surface is performed by the ultraviolet irradiation device 9. As shown in FIG. The board | substrate after this hardening is carried out from the carrying out opening 7 to the exterior of the casing 18.

In the substrate manufacturing apparatus according to the second embodiment, when one of the liquid droplet discharging devices of the coating stations 3 and 6 is unavailable, the thin film pattern can be formed using the other coating station. This ensures continuity of work.

EXAMPLE 3

8, the schematic diagram of the board | substrate manufacturing apparatus by Example 3 is shown. Hereinafter, the difference with Example 1 is demonstrated and description is abbreviate | omitted about the same structure. Example 3 differs from Example 1 in that it does not include the ultraviolet irradiation device 8 (FIG. 1), and the inversion station 4 is equipped with the board | substrate discharge opening 17. FIG. The operation during normal operation of the substrate manufacturing apparatus according to the third embodiment is the same as that of the first embodiment. In the non-normal operation, the substrate manufacturing apparatus according to the third embodiment forms a thin film pattern on one side of the substrate, for example, the first side.

At the time of failure or maintenance of the liquid droplet discharging device of the second coating station 6, the substrate manufacturing apparatus according to the third embodiment is controlled by the controller 20 as follows.

The processing in the alignment station 2, the coating station 3, and the inversion station 4 with respect to the substrates 21 to 24 introduced into the casing 18 is the same as the processing during normal operation.

The substrates 21 to 24 on which the main hardening of the thin film pattern formed on the first surface and the front and back are reversed are carried out of the casing 18 from the substrate outlet 17. Carrying out may be carried out using a conveyor or may be performed manually.

However, with respect to the board | substrates 21-24 conveyed to the inversion station 4, one or both of the main hardening of the thin film pattern formed in the surface and the inversion of the board | substrate are not performed, but the board | substrate 21-24 is carried out from the board | substrate outlet 17. 24) may be exported.

In Example 1, when the liquid droplet discharging device of the coating station 6 cannot be used, after the processing with respect to one board | substrate is complete | finished and the board | substrate is carried out from the casing 18, the other board | substrate 18 is cascaded. ) Into. In Example 3, the process of a board | substrate can be performed simultaneously in parallel in each station 2-4. This makes it possible to maintain high production efficiency even when the droplet discharging device of the coating station 6 cannot be used.

At the time of failure or maintenance of the droplet discharging device of the dispensing station 3, one side of the substrate, for example, is controlled by the control of the controller 20 using the liquid discharging device of the dispensing station 6. For example, a thin film pattern is formed on the first surface of the substrate.

The substrate is conveyed to the conveyor 16 and introduced into the casing 18 from the carrying in and out opening 7. The substrate introduced into the casing 18 is conveyed to the alignment station 5 by the lifters 14 and 13. In the alignment station 5, θ correction of the substrate is performed. Moreover, the size of a board | substrate is calculated based on the image data acquired by the alignment station 5, and the image data for discharge control of the thin film pattern formed in a 1st surface is produced | generated according to the calculated size.

The lifter 13 conveys the substrate after θ correction from the alignment station 5 to the stage of the coating station 6. On the basis of the generated discharge control image data, a thin film pattern is formed on the first surface. The board | substrate is conveyed to the inversion station 4 by the lifter 13, The main hardening of the thin film pattern formed in the 1st surface, and inversion of front and back are performed. Then, the board | substrate is carried out from the board | substrate carrying out opening 17 to the exterior of the casing 18 by conveyor or manual labor, for example.

After conveying the board | substrate to the inversion station 4, you may carry out from the board | substrate export opening 17 without carrying out the one or both of the main hardening of a thin film pattern, and the inversion of a board | substrate.

In Example 3, even when the droplet dispensing apparatus of the coating station 3 cannot be used, the alignment station 5 is connected to the alignment station 5 during the period in which the hardening of the solder resist and the inversion of the substrate are performed in the inversion station 4. The thin film material in the alignment or the coating station 6 can be applied. For this reason, in Example 1, it is possible to raise a production efficiency compared with the case where the droplet dispensing apparatus of the coating station 3 cannot be used.

In the substrate manufacturing apparatus according to the third embodiment, when one of the liquid droplet discharging devices of the coating stations 3 and 6 cannot be used, the thin film pattern is formed on one side of the substrate by using the other coating station. The board | substrate with which processing was completed is carried out from the board | substrate export outlet 17 to the exterior of the casing 18. As shown in FIG. For this reason, the board | substrate manufacturing apparatus which concerns on Example 3 can also carry out work | work continuously at the time of the failure of an application | coating station. In addition, the board | substrate discharge opening 17 can take out a board | substrate to the exterior (outside of the casing 18) of a board | substrate manufacturing apparatus from the board | substrate conveyance path | route which connects the application | coating station 3 and the application | coating station 6.

EXAMPLE 4

9, the schematic diagram of the board | substrate manufacturing apparatus by Example 4 is shown. Hereinafter, the difference with Example 2 is demonstrated and description is abbreviate | omitted about the same structure. Example 4 differs from Example 2 in that it does not include the ultraviolet irradiation device 8 (FIG. 7), and the inversion station 4 is equipped with the board | substrate discharge opening 17. FIG. The operation during normal operation of the substrate manufacturing apparatus according to the fourth embodiment is the same as that of the second embodiment. In the case of non-normal operation, the substrate manufacturing apparatus according to the fourth embodiment forms a thin film pattern on only one surface of the substrate, for example, on the first surface, similarly to the third embodiment.

At the time of failure or maintenance of the droplet discharging device of the coating station 6, the substrate manufacturing apparatus according to the fourth embodiment is controlled by the controller 20 as follows.

Processing in the alignment station 2, the application station 3, and the inversion station 4 for the substrates 21 to 24 introduced into the casing 18 is the same as in normal operation.

The substrates 21 to 24 on which the main hardening of the thin film pattern formed on the first surface and the front and back are reversed are carried out of the casing 18 from the substrate outlet 17. Carrying out may be carried out using a conveyor or may be performed manually.

However, carrying out of the hardening of the thin film pattern formed on the 1st surface of the board | substrate 21-24 conveyed to the inversion station 4, and carrying out from the board | substrate export outlet 17 is not carried out one or both of the inversion of the board | substrate. You can also do it.

In Example 2, when the droplet discharging device of the coating station 6 cannot be used, after the processing for one substrate is finished and the substrate is taken out from the casing 18, the other substrate is cased (18). ). In Example 4, the process of a board | substrate can be performed simultaneously in parallel in each station 2-4. This makes it possible to maintain high production efficiency even when the droplet discharging device of the coating station 6 cannot be used.

At the time of failure or maintenance of the droplet discharging device of the first dispensing station 3, the one side of the substrate is similarly controlled by the control device 20 using the liquid discharging device of the dispensing station 6. For example, a thin film pattern is formed on a first surface.

The substrate is conveyed to the conveyor 16 and introduced into the casing 18 from the carrying in and out opening 7. The board | substrate introduced into the casing 18 is conveyed to the alignment station 5 by the lifter 14 and 13, and simple alignment is performed. Thereafter, the substrate is conveyed to the chuck plate 45 of the droplet discharging device of the coating station 6. In the coating station 6, alignment marks on the first surface of the substrate are detected by the CCD cameras 63 to 66. The control apparatus 20 detects the position of the board | substrates 21-24 and the attitude | position of a rotation direction based on a detection result, and performs (theta) correction of a board | substrate. Moreover, the control apparatus 20 calculates the size of a board | substrate and produces | generates image data for discharge control according to the calculated size. Then, based on the generated discharge control image data, a thin film pattern is formed on the first surface of the substrate. The board | substrate with which the thin film pattern was formed is conveyed to the inversion station 4 by the lifter 13, and main hardening of the thin film pattern formed in the 1st surface and inversion of front and back are performed. Then, the board | substrate is carried out from the board | substrate carrying out opening 17 to the exterior of the casing 18 by conveyor or manual labor, for example.

Similarly to the case where the droplet discharging device of the second coating station 6 cannot be used, in the inversion station 4, the substrate discharging opening is performed without performing one or both of the main curing of the thin film pattern and the inversion of the substrate. You may carry out a board | substrate from (17).

In Example 4, even when the droplet discharging device of the first coating station 3 cannot be used, the alignment station (in the inversion station 4 during the period of the main curing of the thin film pattern and the inversion of the substrate) is performed. The alignment in 5) or the thin film material in the coating station 6 can be applied. For this reason, in Example 2, it is possible to raise a production efficiency compared with the case where the droplet dispensing apparatus of the coating station 3 cannot be used.

Similarly to Example 3, when the substrate manufacturing apparatus according to Example 4 cannot use one of the droplet ejection apparatuses of the application stations 3 and 6, a thin film pattern is formed on one side of the substrate using the other application station. do. The board | substrate with a thin film pattern in one side is carried out from the board | substrate export port 17 to the exterior (outside of the casing 18) of a substrate manufacturing apparatus. The substrate manufacturing apparatus according to the fourth embodiment can also continue to work in the event of a failure of the coating station.

EXAMPLE 5

10, the schematic diagram of the board | substrate manufacturing apparatus by Example 5 is shown. Hereinafter, the difference with Example 1 is demonstrated and description is abbreviate | omitted about the same structure. Example 5 is the same as Example 1 in that it does not include the alignment station 5, the application station 6, the ultraviolet irradiation device 9, the lifter 13, 14, and the conveyor 16 shown in FIG. Different. Moreover, in the board | substrate manufacturing apparatus by Example 5, the casing 18 does not have the board | substrate carrying out opening 7 (FIG. 1). In addition, the content of the control by the control apparatus 20 differs from Example 1. FIG. In the substrate manufacturing apparatus according to the fifth embodiment, when the liquid droplet discharging device of the application station 6 of the substrate manufacturing apparatus according to the first embodiment is unavailable, the procedure is the same as that of forming the thin film pattern on both sides of the substrate. Thin film patterns are formed on both sides of the substrate.

The board | substrate 21 is conveyed to the conveyor 15, and is introduce | transduced into the casing 18 from the carrying in and out opening 1. The first surface of the substrate 21 faces upward (positive direction of the Z axis). The substrate 21 is conveyed from the conveyor 15 to the alignment station 2 by the lifter 11.

In the alignment station 2, the alignment mark formed in the 1st surface of the board | substrate 21 is detected. Based on the detection result, the θ correction of the substrate 21 is performed. Moreover, the size of the board | substrate 21 is calculated based on the image data acquired by the alignment station 2, and image data for discharge control is produced | generated according to the calculated size.

The substrate 21 on which θ correction has been performed is conveyed to the application station 3 by the lifter 11. In the coating station 3, without performing θ correction, a thin film pattern is formed on the first surface of the substrate 21 based on the image data for discharge control.

The substrate 21 on which the thin film pattern is formed is conveyed to the inversion station 4 by the lifter 12. In the inversion station 4, the main hardening of the thin film pattern formed in the 1st surface of the board | substrate 21, and the board | substrate 21 are reversed.

The inverted board | substrate 21 is conveyed to the alignment station 2 by the lifter 12,11. In the alignment station 2, the alignment mark formed on the 2nd surface of the board | substrate 21 is detected, and (theta) correction of the board | substrate 21 is performed based on a detection result. Moreover, the size of the board | substrate 21 is calculated based on the image data acquired by CCD cameras 35-38, and image data for discharge control of the thin film pattern formed in the 2nd surface of a board | substrate according to the calculated size. Is generated.

In addition, you may use the detection result of the alignment mark of the 1st surface of the board | substrate 21 for generation | occurrence | production of the image data for discharge control of the thin film pattern formed in the 2nd surface. In this case, the imaging result of the alignment mark of the 2nd surface of the board | substrate 21 is used only for (theta) correction.

The substrate 21 subjected to θ correction is conveyed to the application station 3 by the lifter 11.

In the coating station 3, the second of the substrate 21 is based on the discharge control image data of the thin film pattern formed on the second surface of the substrate 21 by the liquid droplet discharging device without performing θ correction. A thin film pattern is formed on the surface.

The board | substrate 21 in which the thin film pattern was formed in the 2nd surface is conveyed to the conveyor 15 by the lifter 11, and the pattern of the thin film pattern of the 2nd surface by irradiation of the ultraviolet-ray from the ultraviolet irradiation device 8 is carried out. Curing is performed. The conveyor 15 carries out the board | substrate 21 from the carrying in and out 1 to the exterior of the casing 18.

The structure of the board | substrate manufacturing apparatus which concerns on Example 5 is simple compared with the board | substrate manufacturing apparatus which concerns on Example 1, and it is possible to reduce the cost of an apparatus.

EXAMPLE 6

11, the schematic diagram of the board | substrate manufacturing apparatus by Example 6 is shown. Hereinafter, the difference with Example 2 is demonstrated and description is abbreviate | omitted about the same structure. Example 6 differs from Example 2 in that it does not include the alignment station 5, the application station 6, the ultraviolet irradiation device 9, the lifter 13, 14, and the conveyor 16 shown in FIG. Different. Moreover, in the board | substrate manufacturing apparatus which concerns on Example 6, the casing 18 does not have the board | substrate carrying out opening 7. In addition, the content of the control by the control apparatus 20 differs from Example 2. FIG. In the substrate manufacturing apparatus according to the sixth embodiment, when the liquid droplet discharging device of the application station 6 of the substrate manufacturing apparatus according to the second embodiment is not available, the procedure is the same as that of forming the thin film pattern on both sides of the substrate. The thin film pattern is formed on both sides of the substrate.

The board | substrate 21 is conveyed by the conveyor 15, and is introduce | transduced into the casing 18 from the carrying in and out opening 1. FIG. The first surface of the substrate 21 faces upward (positive direction of the Z axis). The substrate 21 introduced into the casing 18 is conveyed to the alignment station 2 by the lifter 11.

In the alignment station 2, a simple alignment of the substrate 21 is performed. After completion of the alignment, the substrate 21 is conveyed to the application station 3.

In the coating station 3, a thin film pattern is formed on the first surface of the substrate 21. The board | substrate 21 in which the thin film pattern was formed in the 1st surface is conveyed to the inversion station 4 by the lifter 12. As shown in FIG. In the inversion station 4, the main hardening of the thin film pattern formed in the 1st surface of the board | substrate, and the board | substrate inversion are performed.

Thereafter, the substrate 21 is conveyed to the alignment station 2. After simple alignment is performed in the alignment station 2, the substrate 21 is again conveyed to the application station 3.

In the coating station 3, a thin film pattern is formed on the second surface of the substrate 21. The board | substrate 21 in which the thin film pattern was formed in the 2nd surface is conveyed to the conveyor 15 by the lifter 11, and the main hardening of the thin film pattern of a 2nd surface is performed. Then, the board | substrate 21 is carried out from the carrying out opening 1 to the exterior of the casing 18.

The structure of the board | substrate manufacturing apparatus which concerns on Example 6 is simple compared with the structure of the board | substrate manufacturing apparatus which concerns on Example 2, and can reduce the cost of an apparatus.

EXAMPLE 7

12A to 12E show schematic views of the inversion station of the substrate manufacturing apparatus according to the seventh embodiment. This inversion station is applicable to the inversion station 4 (FIGS. 1, 7-11) of the board | substrate manufacturing apparatus by Example 1-Example 6.

As shown in Fig. 12A, a pair of semi-circular guides 56 are provided on both sides of the ultraviolet light source 62 elongated in the Y-axis direction. The ultraviolet light source 62 is guided by the guides 56 on both sides and is movable. The movement of the ultraviolet light source 62 is controlled by the controller 20. In the state before rotation of the board | substrate 24, the surface in which the thin film pattern was formed has turned to the positive direction of the Z-axis. The ultraviolet light which has emitted the ultraviolet light source 62 is irradiated to the surface in which the thin film pattern of the board | substrate 24 was formed. In addition, in the example shown to FIG. 12 (a)-FIG. 12 (e), the ultraviolet light source 62 emits the emitted ultraviolet light.

As shown to FIG. 12 (b)-FIG. 12 (e), the control apparatus 20 rotates the board | substrate 24 at a fixed angular velocity using the support member 52 as a rotating shaft. In synchronization with the rotation of the substrate 24, the ultraviolet light source 62 is moved along the guide 56 at a constant speed so that ultraviolet light having a predetermined intensity or more is irradiated onto the thin film pattern formation surface of the substrate 24 during rotation. Irradiation of ultraviolet light is complete | finished when the thin film pattern formation surface of the board | substrate 24 faces the negative direction of a Z axis | shaft, as shown to FIG. 7E.

In Example 7, the inversion of the substrate and the ultraviolet irradiation can be performed in parallel. As a result, the processing time in the inversion station 4 can be shortened.

EXAMPLE 8

13A to 13D show schematic views of the inversion station of the substrate manufacturing apparatus according to the eighth embodiment. This inversion station is applicable to the inversion station 4 (FIGS. 1, 7-11) of the board | substrate manufacturing apparatus by Example 1-Example 6. Hereinafter, the difference with Example 7 is demonstrated and description is abbreviate | omitted about the same structure.

In Example 8 shown to FIG. 13A-FIG. 13D, the ultraviolet light source 62 emits the ultraviolet light which focuses. As shown to Fig.13 (a), the pair of guides 56 are provided in the both ends of the support member 61 long in a Y-axis direction. The ultraviolet light source 62 elongated in the X-axis direction is supported by the support member 61 at one end thereof. The support member 61 is guided by the guides 56 at both ends and is movable. The movement of the support member 61 is controlled by the control device 20.

As shown to FIG. 13 (a)-FIG. 13 (d), the control apparatus 20 rotates the board | substrate 24 at a fixed angular velocity using the support member 52 as a rotating shaft. In synchronization with the rotation of the substrate 24, the support member 61 is moved along the guide 56 at a constant speed. In addition, the ultraviolet light source 62 is moved along the support member 61 at a constant speed in the Y-axis direction. 13A shows a state in which the thin film pattern formation surface of the substrate 24 faces the positive direction of the Z axis. The board | substrate 24 rotated gradually and the state in which the thin film pattern formation surface of the board | substrate 24 faces the negative direction of Z-axis is shown to FIG. 13 (d). In the state shown to Fig.13 (a), the ultraviolet light source 62 irradiates an ultraviolet light to the edge part of the positive side of the Y-axis of the board | substrate 24. As shown to FIG. The ultraviolet light source 62 moves to the position which irradiates an ultraviolet light to the edge part of the negative side of the Y-axis of the board | substrate 24 until it reaches the state shown to FIG. 13 (d). Irradiation of ultraviolet light is started when the thin film pattern formation surface of the board | substrate 24 faces the positive direction of a Z-axis, and it ends when the thin film pattern formation surface of the board | substrate 24 faces the negative direction of a Z-axis.

Also in the eighth embodiment, as in the seventh embodiment, the processing time in the inversion station 4 can be shortened.

In Examples 1 to 8, the substrate (movement in the XY plane) with respect to the nozzle unit was performed only by the stage, but the frame 42 (Fig. 3 (a)) was moved in the Y-axis direction. The nozzle units 47a to 47f (FIG. 3A) may be movable to the frame 42 in the X-axis direction and the Z-axis direction. The nozzle unit and the substrate may be moved relatively. However, the structure which moves only a board | substrate in an XY plane can raise the positional precision of a thin film pattern compared with the structure which moves a nozzle unit also in an XY plane direction.

Moreover, in Example 1-8, although the thin film pattern of the soldering resist was formed on the printed wiring board by the board | substrate manufacturing apparatus, the board | substrate manufacturing apparatus by Example 1-Example 8 of the other thin film pattern It can be applied to formation. For example, the board | substrate manufacturing apparatus by Example 1-Example 8 can be used for manufacture of the touchscreen which forms an insulating film on a glass substrate.

In addition, in the embodiment provided with the temporary stage 48 (FIG. 7, etc.), it is not essential to pass via the temporary stage before conveying a board | substrate to a droplet discharge apparatus. For example, when the liquid droplet discharging device of the dispensing station 6 (FIG. 8) of Example 2 is broken or in maintenance, the dispensing station 4 does not pass through the alignment station 2 from the inversion station 4; You may convey a board | substrate by 3). By omitting the processing by the alignment station 2, an increase in the tact time can be suppressed. This point is the same also in the normal operation | movement of the board | substrate manufacturing apparatus which concerns on Example 6, etc.

In Examples 1 to 8, the alignment function may be provided in the lifter or the substrate reversing apparatus. In addition, in Example 5 and Example 6, you may provide an alignment station between the application | coating station 3 (FIG. 10, FIG. 11) and the inversion station 4 (FIG. 10, FIG. 11). Instead of conveying the substrate processed by the inversion station 4 to the application station 3 via the alignment station 2, an alignment station provided between the application station 3 and the inversion station 4 is provided. By conveying to the application | coating station 3 via via, the tact time can be shortened.

In addition, in Example 1-Example 8, although each station was arrange | positioned linearly, you may provide each station in the position corresponding to a vertex of a polygon, for example. By setting it as such a structure, it is possible to suppress the increase of the tact time which arises, for example with alignment.

EXAMPLE 9

14, the schematic top view of the application | coating station 3 of the board | substrate manufacturing apparatus by Example 9 is shown. This coating station 3 is the first coating station 3 (FIGS. 1, 7-11) of the board | substrate manufacturing apparatus by Example 1-Example 8, and the 2nd coating station 6 (FIG. 1, 7 to 9). However, since the application | coating station 3 which concerns on Example 9 is equipped with the alignment function of a board | substrate, when the application | coating station 3 which concerns on Example 9 is applied to Example 1-Example 8, the alignment station (2, 5) (FIGS. 1, 7-11) are abbreviate | omitted.

As shown in FIG. 14, the application | coating station 3 is equipped with the 1st application | coating stage 85A and the 2nd application | coating stage 85B. The first coating stage 85A is movable between the first receiving area 80A, the first alignment region 81A, and the coating region 82 in the coating station 3. The second coating stage 85B is movable between the second receiving area 80B, the second alignment region 81B, and the coating region 82 in the coating station 3. The coating area 82 is shared by the first coating stage 85A and the second coating stage 85B.

The lifter 11 can pass through the first and second receiving areas 80A and 80B. The substrate can be exchanged from the lifter 11 to the first coating stage 85A or vice versa with the first coating stage 85A disposed in the first receiving region 80A. Similarly, the substrate can be sent and received from the lifter 11 to the second coating stage 85B or vice versa with the second coating stage 85B being disposed in the second receiving region 80B.

A plurality of imaging devices 83 are disposed in the first alignment area 81A and the second alignment area 81B, respectively. With the first coating stage 85A disposed in the first alignment region 81A, the alignment mark of the substrate supported by the first coating stage 85A is picked up by the imaging device 83. By analyzing the imaging results, it is possible to calculate the amount of expansion and contraction in the X direction and the Y direction while performing θ correction of the substrate. Similarly, while the second coating stage 85B is disposed in the second alignment region 81B, the substrate supported by the second coating stage 85B is corrected, and the amount of stretching in the X and Y directions is adjusted. Can be calculated.

The nozzle units 47a to 47f are provided in the application area 82. A thin film pattern is formed on the upper surface of the substrate supported by the first coating stage 85A by disposing the first coating stage 85A in the coating region 82 and scanning the substrate with respect to the nozzle units 47a to 47f. can do. Similarly, by arranging the second coating stage 85B in the coating region 82, a thin film pattern can be formed on the upper surface of the substrate supported by the second coating stage 85B.

Next, the procedure for forming the thin film pattern on the substrate in the coating station 3 will be described. As shown to Fig.15 (a), the 1st coating stage 85A and the 2nd coating stage 85B are arrange | positioned at the 1st receiving area 80A and the 2nd receiving area 80B, respectively. In this state, the lifter 11 (FIG. 14) mounts the untreated substrate 21 on the first coating stage 85A.

As shown in FIG. 15B, the first coating stage 85A is moved to the first alignment region 81A. In this state, the alignment mark formed on the upper surface of the board | substrate 21 is imaged with the imaging device 83 (FIG. 14). Based on the imaging result, the substrate 21 is corrected and the image data for discharge control for forming the thin film pattern is generated.

As shown in FIG. 15C, the first coating stage 85A is moved to the coating region 82 to apply the thin film material to the substrate 21. In parallel, the lifter 11 mounts the substrate 22 to be processed next on the second coating stage 85B.

As shown in FIG. 15D, the second coating stage 85B is moved to the second alignment region 81B. In this state, the alignment mark formed on the upper surface of the substrate 22 supported by the second coating stage 85B is imaged by the imaging device 83 (FIG. 14). Based on the imaging result, the substrate 22 is corrected and the image data for discharge control is generated. The coating process of a thin film material is continuously performed about the board | substrate 21 supported by 85 A of 1st coating stages.

As shown in FIG. 15E, after the application of the thin film material to the substrate 21 is completed, the first coating stage 85A is moved from the coating area 82 to the first receiving area 80A. In parallel, the second coating stage 85B is moved from the second alignment region 81B to the coating region 82.

As shown in FIG.15 (f), a thin film material is apply | coated to the upper surface of the board | substrate 22 supported by the 2nd coating stage 85B. In parallel, the lifter 12 (FIG. 1) takes out the substrate 21 supported by the first coating stage 85A from the coating station 3.

As shown in FIG. 15G, the lifter 11 (FIG. 14) mounts the substrate 23 to be processed next on the first coating stage 85A. At this time, in the coating area 82, the coating process of the thin film material on the upper surface of the substrate 22 supported by the second coating stage 85B is continued.

As shown in FIG. 15H, the first coating stage 85A is moved to the first alignment region 81A. In this state, the alignment mark formed on the upper surface of the substrate 23 is imaged. Based on the imaging result, the substrate 23 is corrected and the image data for discharge control is generated. At this time, in the coating area 82, the coating process of the thin film material on the upper surface of the substrate 22 supported by the second coating stage 85B is continued.

When the application of the thin film material to the substrate 22 supported by the second coating stage 85B is completed, the second coating stage 85B is moved to the second receiving area 80B to apply the substrate 22. It takes out from the station 3. In parallel, similarly to the process shown in FIG. 15C, the first coating stage 85A is moved to the coating region 82, and the substrate to be processed next to the second coating stage 85B. Loads. Thereafter, the process is repeatedly executed from FIG. 15D to FIG. 15H.

As described above, in the ninth embodiment, in the coating station 3, in the period during which the thin film material is applied to one substrate, the θ correction of the substrate to be processed next and the image data for discharge control are performed. The production is done in parallel. As a result, the processing time can be shortened.

EXAMPLE 10

16A to 16F show schematic views of the inversion station 4 of the substrate manufacturing apparatus according to the tenth embodiment. Hereinafter, the difference with Example 1 is demonstrated and description is abbreviate | omitted about the same structure. The inversion station 4 of Example 10 is applied to the inversion station 4 (FIGS. 1, 7-11) of the board | substrate manufacturing apparatus of Examples 1-9.

As shown in FIG. 16A, a roller conveyor 90 is provided in the inversion station 4. From the upstream end of the roller conveyor 90 to the downstream end, the carrying-in part 4A, this hardening part 4B, the inversion part 4C, and the carrying out part 4D are defined. The substrate 21 to which the thin film material is applied in the application station 3 (FIGS. 1 and 7 to 11) is formed by the lifter 12 (FIGS. 1 and 7 to 11) of the roller conveyor 90. It is loaded on the loading portion 4A. The first surface 21A coated with the thin film material faces upward, and the second surface 21B on the opposite side contacts the roller conveyor 90.

The light source 91 for hardening is arrange | positioned above the roller conveyor 90 of this hardening part 4B. The light source 91 for hardening irradiates an ultraviolet-ray to the upper surface of the board | substrate 21 which passes below by the roller conveyor 90. As shown in FIG.

In 4C of inversion parts, the roller conveyor 90 contains the 1st roller 90A which supports the board | substrate 21 from below, and the 2nd roller 90B which contact | connects the upper surface of the board | substrate 21. As shown in FIG. By inverting the vertical relationship between the first roller 90A and the second roller 90B, the front and back of the substrate 21 can be reversed. When the substrate 21 is inverted, the first surface 21A coated with the thin film material faces downward, and the second surface not coated with the thin film material faces upward.

The board | substrate 21 conveyed to the carrying out part 4D of the roller conveyor 90 is carried out from the inversion station 4 by the lifter 13 (FIGS. 1, 7-9), and apply | coats a 2nd application | coating. It is carried in to the station 6 (FIGS. 1, 7-9) etc.

As shown to FIG. 16 (b), the board | substrate 21 mounted in the roller conveyor 90 of 4 A of carrying-in parts passes through this hardening part 4B, and is conveyed toward the inversion part 4C. When passing through the main hardening part 4B, the ultraviolet-ray from the light source 91 for hardening is irradiated, and the thin film material apply | coated to the 1st surface 21A of the board | substrate 21 is hardened. The control device 20 includes a memory device 20b which stores the transfer speed of the substrate 21. The transmission speed stored in the storage device 20b is set so that the optical energy density injected into the first surface 21A of the substrate 21 is large enough to cause the thin film material to harden. However, the light irradiation time may be stored in the memory device 20b. In this case, the control apparatus 20 calculates the transfer speed of the board | substrate 21 from the irradiation time memorize | stored in the memory | storage device 20b.

As shown to FIG. 16C, the board | substrate 21 is conveyed to the roller conveyor 90 of 4 C of inversion parts. The first roller 90A, the second roller 90B, and the substrate 21 are parallel to the conveyance direction with the substrate 21 sandwiched between the first roller 90A and the second roller 90B. Rotate 180 ° with one straight line as the center of rotation. 16D, the side view of the state which rotated the 1st roller 90A, the 2nd roller 90B, and the board | substrate 21 by 90 degrees is shown. The first surface 21A of the substrate 21 faces forward.

16E, the side view of the state which rotated the 1st roller 90A, the 2nd roller 90B, and the board | substrate 21 by 90 degrees is shown. The vertical relationship between the first roller 90A and the second roller 90B is reversed, and the second surface 21B of the substrate 21 faces upward. As shown in FIG.16 (f), the board | substrate 21 whose front and back were reversed is conveyed to the carrying out part 4D of the roller conveyor 90. FIG.

As in the tenth embodiment, it is also possible to invert the main curing and the substrate by using the roller conveyor 90.

EXAMPLE 11

17, the schematic diagram of the board | substrate manufacturing apparatus by Example 11 is shown. A plurality of substrates are accumulated in the substrate stocker 93. In the application station 3, a thin film pattern having a predetermined planar shape is formed on the substrate. The thin film pattern formed in the coating station 3 is in a temporary curing state, and the main curing is not performed. The inversion station 4 contains the main hardening part 4B and the inversion part 4C. In the main hardening part 4B, the thin film material apply | coated to the board | substrate is real hardened. In the inversion station 4C, the front and back of the substrate are reversed. In the substrate manufacturing apparatus according to the eleventh embodiment, in addition to the main curing unit 4B, the main curing station 94 is disposed. Also in the main hardening station 94, the main hardening of the thin film material apply | coated to the board | substrate is performed.

The transfer apparatus 100 transfers the substrate between the substrate stocker 93, the main curing station 94, the application station 3, and the main curing unit 4B and the inversion unit 4C of the inversion station 4. Return. As the conveying apparatus 100, a roller conveyor, the lifter which attracts and supports the upper surface of a board | substrate, the robot arm which supports a board | substrate from below, etc. are used. The conveying apparatus 100 and the apparatus in each station are controlled by the control apparatus 20. In FIG. 17, the movement path of a board | substrate when a board | substrate is processed is shown by the curve which attached the arrow.

The unprocessed substrate accumulated in the substrate stocker 93 is conveyed to the coating station 3 by the conveying apparatus 100. In the coating station 3, a thin film pattern is formed in the 1st surface which is one surface of a board | substrate. The board | substrate with a thin film pattern is conveyed to the main hardening part 4B of the inversion station 4 by the conveyance apparatus 100. FIG. In the main hardening part 4B, the thin film pattern is fully hardened. Then, in the inversion station 4C, the substrate is reversed. The inverted board | substrate is conveyed to the application | coating station 3 with the conveying apparatus 100. FIG. In the coating station 3, a thin film pattern is formed on the second surface opposite to the first surface of the substrate. The board | substrate with which the thin film pattern was formed in the 2nd surface is conveyed to the main hardening station 94 by the conveying apparatus 100. FIG. The main curing station 94 performs a main curing of the thin film pattern formed on the second surface of the substrate. After the thin film pattern of the 2nd surface is completely hardened | cured, the board | substrate is conveyed to the board | substrate stocker 93 by the conveyance apparatus 100. FIG. Next, with reference to FIG. 18A-FIG. 18G, the method of forming a thin film pattern in a board | substrate is demonstrated in detail.

* The structure of the carrying-in part 4A, the main hardening part 4B, and the reversing part 4C of the inversion station 4 shown to Fig.18 (a) is similar to Example 10 shown to Fig.16 (a). It has the same structure as that of the board | substrate manufacturing apparatus by the same. The board | substrate 21 is conveyed to the application | coating station 3 from the board | substrate stocker 93 (FIG. 17). In the application station 3, a thin film pattern is formed on the first surface 21A of the substrate 21. The board | substrate 21 in which the thin film pattern was formed is carried in to the carrying-in part 4A of the inversion station 4 by the conveyance apparatus 100 (FIG. 17). The first surface 21A on which the thin film pattern is formed faces upward.

As shown in FIG. 18B, by driving the roller conveyor 90, the substrate 21 is conveyed to the inversion unit 4C via the main curing unit 4B. The roller conveyor 90 conveys the board | substrate 21 which conveys the board | substrate 21 from the application station 3 to the main hardening part 4B, and from the main hardening part 4B to the inversion part 4C (FIG. 17) function. The thin film pattern formed on the first surface 21A of the substrate 21 is cured by irradiation of ultraviolet light when passing through the main curing light source 91 under the main curing portion 4B.

As shown in FIG. 18C, the substrate 21 is sandwiched between the first roller 90A and the second roller 90B of the inversion station 4C. As shown in FIG. 18D, the top and bottom of the first roller 90A and the second roller 90B are reversed. As a result, the second surface 21B of the substrate 21 faces upward.

As shown to FIG. 18E, the roller conveyor 90 is driven and the board | substrate 21 is conveyed to 4 A of carrying-in parts. At this time, no processing is performed in the main curing unit 4B, and the substrate 21 merely passes through the main curing unit 4B.

As shown in FIG. 18F, the conveying apparatus 100 (FIG. 17) conveys the substrate 21 from the inversion station 4 to the application station 3. In the coating station 3, a thin film pattern is formed on the second surface 21B of the substrate 21.

As shown in FIG. 18G, the conveying apparatus 100 (FIG. 17) conveys the substrate 21 from the coating station 3 to the main curing station 94. In the main curing station 94, ultraviolet rays are irradiated from the main curing light source 92 to the thin film pattern formed on the second surface 21B of the substrate 21. As a result, the thin film pattern formed on the second surface 21B is completely cured. The board | substrate 21 by which the thin film pattern of the 2nd surface was hardened is conveyed to the board | substrate stocker 93 by the conveying apparatus 100 (FIG. 17).

In Example 11, after forming a thin film pattern in the 2nd surface 21B of the board | substrate 21 by the process shown in FIG. 18F, the board | substrate 21 is not returned to the inversion station 4, The main curing station 94 can perform main curing of the thin film pattern.

As shown in Fig. 17, the application station 3 is used when the substrate is conveyed in the left direction in Fig. 17, i.e., when the thin film pattern is formed on the first surface, and when the substrate is conveyed in the right direction, i.e. It is used both when a thin film pattern is formed in a 2nd surface. In FIG. 17, a path in which the substrate is conveyed in the left direction is referred to as "backward", and a path conveyed in the right direction is referred to as "return".

It is preferable to employ the application station 3 according to the ninth embodiment shown in FIG. 14 as the application station 3. In Example 9, 5A application station 3 is equipped with 1st application | coating stage 85A (FIG. 14) and the 2nd application | coating stage 85B (FIG. 14), and 5A. For example, the first coating stage 85A may be used in the roadway, and the second coating stage 85B may be used in the return path. For this reason, the board | substrate which conveys a return path | route and the board | substrate which conveys a return path can be crossed in the application | coating station 3. Thereby, the board | substrate which needs to be processed next can be sent out to a path | route before the board | substrate carried out from the board | substrate stocker 93 returns to the board | substrate stocker 93 via a path | route and a return path.

EXAMPLE 12

19A, the schematic diagram of the board | substrate manufacturing apparatus by Example 12 is shown. The substrate manufacturing apparatus according to the twelfth embodiment includes a substrate stocker 93, an application station 3, an inversion station 4, and a temporary storage device 95. The inversion station 4 has the structure similar to the inversion station 4 (FIG. 18 (a)) of Example 11, and contains this hardening part 4B and the inversion part 4C. The transfer apparatus 100 includes a substrate stocker 93, an application station 3, a main curing unit 4B of the inversion station 4, an inversion unit 4C of the inversion station 4, and a temporary storage device 95. The board | substrate is conveyed between and. The conveying apparatus 100 and the apparatus in each station are controlled by the control apparatus 20.

19B, a schematic side view of the temporary storage device 95 is shown. The temporary storage device 95 has a table on which a substrate is mounted. On this table, a plurality of substrates 21 are stacked. The board | substrate carried in to the temporary storage device 95 by the conveying apparatus 100 is mounted on the top of the board | substrate already accumulate | stored. Moreover, the conveyance apparatus 100 supports the uppermost board | substrate among the board | substrates 21 laminated | stacked on the temporary storage device 95, and carries it out from the temporary storage device 95. FIG.

A processing method of a substrate by the substrate manufacturing apparatus according to Example 12 will be described with reference to FIGS. 20A to 20E.

As shown in FIG. 20A, at the start of operation of the substrate manufacturing apparatus, all the substrates 21 to be processed are stored in the substrate stocker 93, and the substrates are accumulated in the temporary storage apparatus 95. It is not. The board | substrate 21 accumulate | stored in the board | substrate stocker 93 is laminated | stacked in the attitude which a 1st surface faces upward.

As shown in FIG. 20B, the transfer apparatus 100 takes out the substrates stored in the substrate stocker 93 one by one, and the main curing portion of the coating station 3 and the inversion station 4 ( 4B) and 4C of inverting stations 4 are conveyed to the temporary storage device 95. The path of conveyance from the substrate stocker 93 to the temporary storage device 95 will be referred to as "route". In the application station 3, a thin film pattern is formed on the first surface of the substrate 21. In the main hardening part 4B, the thin film pattern formed in the 1st surface of the board | substrate 21 is real hardened. In the inversion part 4C, the front and back of the substrate are reversed so that the second surface of the substrate 21 faces upward. In the temporary storage device 95, the substrates 21 are stacked in a posture in which the second surface faces upward.

In FIG. 20C, all the substrates 21 stored in the substrate stocker 93 are carried out, and the state temporarily stored in the temporary storage device 95 is shown.

As shown in FIG. 20 (d), the transfer apparatus 100 carries out the substrates 21 stored in the temporary storage apparatus 95 one by one, and the coating station 3 and the inversion station 4 are separated. It conveys to the board | substrate stocker 93 via this hardening part 4B. The path conveyed from the temporary storage device 95 to the substrate stocker 93 will be referred to as "return." In the application station 3, a thin film pattern is formed on the second surface of the substrate 21. In the main hardening part 4B, the thin film pattern formed in the 2nd surface is real hardened.

As shown in FIG. 20E, all of the substrates 21 temporarily stored in the temporary storage device 95 are conveyed to the substrate stocker 93. The thin film pattern is formed in both surfaces of the board | substrate 21 accumulate | stored in the board | substrate stocker 93. As shown in FIG.

In Example 12, the cross | intersection of the board | substrate which conveys the back path shown in FIG. 20B and the board | substrate which conveys the return path shown in FIG. For this reason, the board | substrate which needs to be processed next can be sent from the board | substrate stocker 93 to the back path in the period in which one board | substrate is conveying a back path.

EXAMPLE 13

21, the schematic diagram of the board | substrate manufacturing apparatus by Example 13 is shown. Unprocessed substrates are accumulated in the substrate stocker 93 on the carry-in side. The conveying apparatus 100 includes the first coating station 3, the main curing unit 4B of the inversion station 4, the inversion unit 4C of the inversion station 4, the intermediate stocker 98, and the second The board | substrate is conveyed between the application | coating station 6, this hardening station 96, and the board | substrate stocker 97 of the carrying-out side. As the application stations 3 and 6, for example, the application station according to the ninth embodiment shown in Fig. 14 is employed. As the inversion station 4, an inversion station according to the tenth embodiment shown in Fig. 16A is employed. This hardening station 96 contains the roller conveyor 16 and the ultraviolet irradiation device 8 of the board | substrate manufacturing apparatus by Example 1, for example. The conveying apparatus 100 and the apparatus in each station are controlled by the control apparatus 20.

The conveying apparatus 100 and the apparatus in each station are controlled by the control apparatus 20. The control device 20 includes a storage device 20c. The storage device 20c stores the presence or absence of a failure of the first application station 3 and the second application station 6. When the application stations 3 and 6 are not broken, the substrate stored in the substrate stocker 93 is transferred to the first application station 3 and the reverse station 4 by the transfer device 100. Via the hardening part 4B, the inversion part 4C of the inversion station 4, the 2nd coating station 6, and this hardening station 96, it is conveyed to the board | substrate stocker 97 of the carrying-out side. As a result, thin film patterns are formed on both surfaces of the substrate. The intermediate stocker 98 is not used.

The intermediate stocker 98 is disposed between the inversion station 4 and the second coating station 6. The intermediate stocker 98 can store a plurality of substrates. In addition, the substrate accumulated in the intermediate stocker 98 can be carried out of the substrate manufacturing apparatus. Conversely, it is also possible to carry in a board | substrate to the intermediate stocker 98 from the exterior of a board | substrate manufacturing apparatus.

22A, 22B, and 22C, the first, second, and first paths of the substrate path when the second coating station 6 fails, respectively. Three examples are shown. In the first example shown in FIG. 22A, the substrate is loaded into the second coating station 6 and the main curing station 96, but is carried out without processing anything. In the second example shown in FIG. 22B, the substrate carried out from the inversion station 4 is directly taken out of the substrate without passing through the second coating station 6 and the main curing station 96. It is conveyed to the stocker 97. In the third example shown in FIG. 22C, the substrate processed by the inversion station 4 is transferred to the intermediate stocker 98 by the transfer device 100. The processed substrate is taken out from the intermediate stocker 98 to the outside.

23 (a), 23 (b) and 23 (c), the first, second, and first paths of the substrate path when the first coating station 3 fails; Three examples are shown. In the first example shown in FIG. 23A, the substrate is loaded into the first application station 3 and the inversion station 4, but is carried out without processing anything. In the second example shown in FIG. 23B, the substrate carried out from the substrate stocker 93 on the carrying-in side is directly and secondly without passing through the first coating station 3 and the inversion station 4. It is conveyed to the application station 6 of. In the third example shown in FIG. 23C, an untreated substrate is prepared in the intermediate stocker 98 without using the substrate stocker 93 on the carry-in side. The unprocessed substrate is conveyed from the intermediate stocker 98 to the second coating station 6.

As shown in FIG.22 (a)-FIG.23 (c), even when one of the coating stations 3 and 6 fails, a thin film pattern can be formed in the single side | surface of a board | substrate.

EXAMPLE 14

A substrate manufacturing apparatus according to a fourteenth embodiment will be described with reference to FIGS. 24A to 24D. Hereinafter, difference with Example 13 is demonstrated and description is abbreviate | omitted about the same structure. In Example 14, moving stockers 99A and 99B are disposed in place of the substrate stocker 93 and the intermediate stocker 98 (FIG. 21) for carrying in of the thirteenth embodiment. The moving stockers 99A and 99B can move apart from the conveying path of the conveying apparatus 100. 24A to 24D show the flow of the substrate processing when the second coating station 6 is broken.

As shown to Fig.24 (a), the some unprocessed board | substrate is accumulate | stored in the moving stocker 99A for carrying in. The board | substrate is not accumulate | stored in the other moving stocker 99B. The moving stockers 99A and 99B are disposed at positions of the substrate stocker 93 and the intermediate stocker 98 for loading in FIG. 21, respectively. The conveying apparatus 100 conveys a board | substrate from the moving stocker 99A to the other moving stocker 99B via the 1st application station 3 and the inversion station 4. As a result, a thin film pattern is formed on the first surface of the substrate. After all the board | substrate accumulate | stored in the moving stocker 99A is conveyed to the other moving stocker 99B, as shown to FIG. 24 (b), the transfer stocker 99A, 99B is conveyed. Separate from the conveying path of.

As shown in Fig. 24C, the moving stocker 99A, which is emptied, is disposed at the position of the intermediate stocker 98 (FIG. 21), and the moving stocker 99B accumulates a substrate having a thin film pattern formed on one surface thereof. Is placed at the position of the substrate stocker 93 (FIG. 21) for carrying in. The moving stockers 99A and 99B may be moved by hand, or the moving stockers 99A and 99B may have an automatic driving function.

As shown in FIG. 24 (d), from the moving stocker 99B to the other moving stocker 99A via the application station 3 and the main curing unit 4B of the inversion station 4. Carry the substrate. As a result, a thin film pattern is formed on the second surface of the substrate. When the inversion station 4 employs the inversion station 4 according to the tenth embodiment shown in Fig. 16A, the substrate passes through the inversion portion 4C, but the inversion operation is not performed.

In Example 14, the conveying apparatus 100 can only convey a board | substrate to one direction, and can form a thin film pattern on both surfaces. When the first coating station 3 is broken, the intermediate stocker 98 and the substrate stocker 97 for carrying out may be replaced with the moving stockers 99A and 99B, respectively.

EXAMPLE 15

25, the schematic diagram of the board | substrate manufacturing apparatus by Example 15 is shown. Hereinafter, the difference with Example 13 shown in FIG. 21 is demonstrated, and description is abbreviate | omitted about the same structure. In the fifteenth embodiment, the intermediate stocker 98 and the main hardening station 96 shown in FIG. 21 are not arranged. That is, one main hardening part 4B is arrange | positioned with respect to the two coating stations 3 and 6.

The flow of the substrate from the substrate stocker 93 for carrying in to the second coating station 6 is the same as that in Example 13 shown in FIG. In Example 15, the board | substrate with which the thin film pattern was formed in the 2nd surface in the 2nd coating station 6 is returned to the main hardening part 4B of the inversion station 4 by the conveyance apparatus 100. FIG. In the main hardening part 4B, the thin film pattern of the 2nd surface of a board | substrate is main hardened. Then, the board | substrate is conveyed from the main hardening part 4B to the board | substrate stocker 97 for carrying out.

When the main curing process in the main curing unit 4B is short compared to the coating processing time of the thin film material in the coating stations 3 and 6, as in Example 15, one main curing unit 4B In this case, the hardening of the thin film patterns on the first and second surfaces may be performed.

26, an example of the planar layout of each station of the board | substrate manufacturing apparatus by modified example of Example 15 is shown. As shown in FIG. 26, the board | substrate stocker 93 for carrying in, the 1st coating station 3, this hardening part 4B, the inversion part 4C, the 2nd coating station 6, and carrying out are Substrate stockers 97 are disposed along the circumference. The conveying apparatus 100 is arrange | positioned at the center of this circumference. As the conveying apparatus 100, for example, a rotary stretching arm can be used.

Although the present invention has been described in accordance with the above embodiments, the present invention is not limited thereto. For example, it will be apparent to those skilled in the art that various changes, improvements, combinations, and the like are possible.

1: exit
2: alignment station
3: dispensing station
4: reversing station
4A: Import
4B: Home Economics Department
4C: invert
4D: Export
5: alignment station
6: dispensing station
7: Exit entrance
8, 9: UV irradiation device
11-14: Lifter
15, 16: conveyor
17: outlet
18: casing
20: controller
20a, 20b, 20c: memory
21 ~ 27: substrate
22a-22d: alignment mark
31: base
32: Y stage
33: θ stage
34: Chuck Plate
35 ~ 38: CCD camera
41: base
42: frame
42a, 42b: prop
42c: beam
43: X stage
44: Y stage
45: chuck plate
46: connecting member
47a ~ 47f: nozzle unit
47a1 ~ 47a4: nozzle head
47a5 ~ 47a9: ultraviolet light source
47ac: nozzle holder
48: temporary stage
49: θ stage
50: substrate inverter
51: substrate support
52: support member
53: vacuum adsorption pad
54: push roller
55: clamp mechanism
56: guide
60: ultraviolet irradiation device
61: support member
62: ultraviolet light source
63 ~ 66: CCD camera
70: liquid droplet discharge device
80A: first sorghum zone
80B: second delivery area
81A: first alignment area
81B: second alignment area
82: application area
83: imaging device
85A: First Coating Stage
85B: second coating stage
90: roller conveyor
90A: first roller
90B: second roller
91, 92: light source for hardening
93: substrate stocker
94: Main Gyeonghwa Station
95: temporary storage device
96: Main Gyeonghwa Station
97: substrate stocker
98: middle stalker
99A, 99B: Mobile Stalker
100: conveying device

Claims (6)

An import-side substrate stocker on which untreated substrates are accumulated;
A first coating station which applies a liquid thin film material to one side of the substrate substrate conveyed from the carry-in substrate stocker, and irradiates light on the thin film material applied to the substrate substrate to cure the surface layer portion of the thin film material;
An inverting station to which the base substrate coated with the thin film material is carried in the first coating station, and irradiates light on the thin film material coated on the base substrate to cure the inside of the thin film material, and inverts the front and back of the base substrate; ,
A second coating station for coating a liquid thin film material on one side of the base substrate via the inversion station and curing the surface layer portion of the thin film material applied to the base substrate;
An export-side substrate stocker to which the substrate is conveyed from the second coating station;
It is disposed between the inversion station and the second coating station, it is possible to accumulate a plurality of base substrates, and to be able to carry out the accumulated base substrates to the outside of the substrate manufacturing apparatus, the base substrate to the outside of the substrate manufacturing apparatus An intermediate stocker configured to be fetchable from
A conveying apparatus for conveying the base substrate between the carrying-in substrate stocker, the first coating station, the reversing station, the second coating station, the carrying-out substrate stocker and the intermediate stocker;
A control device for controlling the first dispensing station, the reversing station, the second dispensing station, and the conveying device;
The conveying apparatus conveys the substrate substrate inverted in the inversion station to the second coating station or the intermediate stocker,
The control device,
If the first dispensing station and the second dispensing station are not broken, the conveying apparatus is controlled to convey the substrate substrate processed at the first dispensing station to the reversing station, and at the reversing station. The inverted substrate is returned to the second coating station for processing at the second coating station,
When the first coating station is not broken and the second coating station is broken, the conveying apparatus is controlled to convey the substrate substrate processed by the first coating station to the inverting station. The substrate reversed at the inversion station is transferred to the intermediate stocker, and the processed substrate is taken out of the substrate manufacturing apparatus from the intermediate stocker.
When the first coating station is broken and the second coating station is not broken, the conveying apparatus is controlled to convey the base substrate accumulated in the intermediate stocker to the second coating station, Substrate manufacturing apparatus to be processed in the second coating station. The method of claim 1,
And the inversion station hardens the inside of the thin film material coated on the base substrate, and then reverses the front and back of the base substrate. delete The method according to claim 1 or 2,
The substrate manufacturing apparatus of which the energy density of the light irradiated to the thin film material applied to the base substrate at the inversion station is higher than the energy density of the light irradiated to the thin film material applied to the base substrate at the first coating station. . delete delete

Images