JP2002341550A - Laser exposure device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laser exposure device, with which the throughput of a carrying processing is improved and the occupancy area of the device is reduced. SOLUTION: Since the carry-in position and carry-out position of a processing object W in a surface plotting device 2 are individually different, a first carrier can stand by at the carry-in position (upstream side) inside the surface plotting device 2 and a second carrier can stand by at the carry-out position (downstream side) inside the surface plotting device 2 respectively, the throughput of the carrying processing is improved. Also, since the moving direction of the processing object W in the surface plotting device 2 and the carrying direction of the processing object W among the devices such as a loader 1, the surface plotting device 2 and an unloader 5 are the same, the surface plotting device 2 is not projected to the loader 1 and the unloader 5 and the occupancy area of the device is reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for irradiating a processing object such as a printed wiring board with a laser beam.
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser exposure apparatus that draws a desired pattern on a processing target, and more particularly, to a technique for improving a throughput of a transfer processing of the processing target.

[0002]

2. Description of the Related Art As a conventional apparatus of this kind, for example, there is a laser exposure apparatus which irradiates a laser beam onto a base material for a mask plate for printing a pattern on a printed wiring board to draw a desired pattern.

In recent years, a photosensitive photoresist film is formed on the surface of a substrate to be a printed wiring board, and a desired pattern such as a wiring pattern is drawn by scanning a laser beam on the photoresist film. Laser exposure apparatuses have been developed. Such a laser exposure apparatus is called a direct drawing (direct drawing) type laser exposure apparatus because it draws a pattern on a base material for a printed wiring board instead of the base material for a mask plate described above.

[0004] As the above-mentioned laser exposure apparatus, there is one described in, for example, JP-A-2000-131852. As shown in FIG. 16, this laser exposure apparatus scans a processing object W (for example, a base material for a printed wiring board on which a photosensitive photoresist is formed) to be laser-drawn by scanning a laser beam to a desired one. Drawing unit 10 for drawing a pattern
1 is provided. The drawing unit 101 includes a drawing stage 102 on which a processing target object W is placed. The drawing stage 102 can move between an upstream position and a downstream position in the drawing unit 101. The loader 103 for supplying the loaded processing target W to the drawing unit 101 and the unloader 104 for loading the laser-drawn processing target W from the drawing unit 101 are located upstream of the drawing unit 101. It is arranged so as to sandwich a certain drawing stage 102. Loading and unloading of the processing object W to and from the drawing stage 102 are performed in a state where the drawing stage 102 is at the upstream position. While moving the drawing stage 102 on which the processing target W is mounted from the upstream position to the downstream position, the processing target W on the drawing stage 102 is moved.
Is aligned by the alignment camera unit 110 as a one-dimensional line sensor, and after performing alignment correction at the downstream position, the drawing stage 102 on which the processing target object W is mounted is conversely moved from the downstream position. The laser beam is scanned by the exposure head 111 on the processing target W on the drawing stage 102 while moving to the upstream position, and a desired pattern is drawn. Thus, the drawing unit 10
The moving direction (X direction, reciprocating direction between the upstream position and the downstream position) of the processing target W in 1 is orthogonal to the transport direction (Y direction) in which the processing target W is moved to each part. I have.

Further, as shown in FIG. 17, two above-described laser exposure apparatuses are arranged via a reversing unit 105 for reversing the upper and lower surfaces of the object to be processed, and both upper and lower surfaces of the object to be processed are laser-drawn. There is a laser exposure apparatus (hereinafter, referred to as a double-sided laser exposure apparatus).

[0006]

However, the prior art having such a configuration has the following problems. That is, in the conventional laser exposure apparatus and the double-sided laser exposure apparatus, the drawing stage 1 at the upstream position is used.
02, the loading / unloading operation of the processing object W is performed.
If the processing object W is not unloaded from the drawing stage 102, a mechanism for carrying in the next processing object W cannot enter the drawing stage 102, and the throughput of the transfer processing of the processing object W cannot be improved. There is.

In the conventional laser exposure apparatus shown in FIG. 16, a loader 103, a drawing stage 102 at an upstream position, and an unloader 104 are arranged in a straight line. Is orthogonal to the moving direction of the lens, the overall arrangement is substantially convex in plan view. Similarly, the two-sided laser exposure apparatus shown in FIG. 17 has a substantially “π” shape in plan view. As described above, there is a problem that the occupation area of the device is increased as a result of the protrusion of the entire arrangement.

The present invention has been made in view of such circumstances, and an object of the present invention is to provide a laser exposure apparatus capable of improving the throughput of a transport process and reducing the area occupied by the apparatus.

[0009]

The present invention has the following configuration in order to achieve the above object. That is, the invention according to claim 1 is a laser exposure apparatus that irradiates a laser beam onto a main surface of a plate-shaped processing object and draws a desired pattern on the main surface of the processing object. A stage on which an object is placed, a stage moving means for linearly moving the stage, and a laser for scanning a main surface of the processing object placed on the stage linearly moved by the stage moving means with a laser beam A writing unit having a beam scanning unit, an upstream unit disposed upstream of the writing unit in a moving direction of the stage moved by the stage moving unit, and the stage moved by the stage moving unit In the moving direction, the downstream unit disposed downstream of the drawing unit and the object to be processed of the upstream unit are stored. Carrying means for carrying an object to be processed onto the stage in the drawing unit so as to move the object in the carrying direction which is the same direction as the moving direction of the stage; and processing on the stage in the drawing unit. An unloading unit that unloads the processing target object to the downstream unit so as to hold the target object and move the processing target object in the transport direction, and scans the main surface of the processing target object with the laser beam by the laser beam scanning unit. When, the stage moving means to move the stage from the upstream side to the downstream side in the transport direction, the loading means, loading the processing object to the stage located on the upstream side, the unloading means, The processing object is carried out from the stage located on the downstream side.

[0010] The invention described in claim 2 is the same as the claim 1.
In the laser exposure apparatus according to the above, the laser beam scanning means is arranged at a predetermined space from the stage located on the upstream side or the downstream side, and the laser beam scanning means is arranged on the upstream side in case of,
The carrying-in means enters the space and carries the object to be processed to the stage, and when the laser beam scanning means is arranged on the downstream side, the carrying-out means enters the space. The object to be processed is carried out from the stage.

[0011] The invention according to claim 3 is based on claim 1.
Alternatively, in the laser exposure apparatus according to claim 2, alignment is performed with respect to the processing target placed on the stage in a stationary state located on the upstream side.

Further, according to a fourth aspect of the present invention, both main surfaces of the plate-like processing object are irradiated with a laser beam.
In a laser exposure apparatus that draws a desired pattern on both main surfaces of a processing target, an upstream unit into which the processing target to be laser-drawn is loaded, and a desired pattern is drawn on one main surface of the processing target. A first drawing unit, a reversing unit for reversing the processing target to draw a pattern on the other main surface of the processing target, and drawing a desired pattern on the other main surface of the processing target. The second drawing unit and the downstream unit into which the object to be processed after the laser writing on both main surfaces is loaded are linearly arranged so that the object to be processed is transported in a linear transport direction. A drawing unit, a first stage on which the processing target is placed, a first stage moving unit that moves the first stage in the transport direction, and the first stage that is linearly moved by the first stage moving unit. First laser beam scanning means for scanning a laser beam on one main surface of the processing object mounted on the stage, wherein the second drawing unit includes a second stage on which the processing object is mounted. A second stage moving means for moving the second stage in the transport direction; and a main surface on the other side of the processing object mounted on the second stage linearly moved by the second stage moving means. A second laser beam scanning unit for scanning a laser beam, wherein the processing unit holds the object to be processed in the upstream unit and moves the object in the transport direction so as to move the object to be processed on the first stage in the first drawing unit. First carrying-in means for carrying a processing object into the processing unit; and holding and moving the processing object on the first stage in the first drawing unit in the transport direction. First unloading means for unloading the object to be processed, and moving the object to be processed in the reversing unit in the transport direction while holding the object to be processed on the second stage in the second drawing unit. Second carrying-in means for carrying the object, and carrying out the object to be processed to the downstream unit by holding the object to be processed on the second stage in the second drawing unit and moving the object in the transport direction. A second carrying-out unit, wherein when the first laser beam scanning unit scans the main surface on one side of the processing object with the laser beam in the first drawing unit, the first stage moving unit 1
When the stage is moved from the upstream side to the downstream side in the transport direction and the second laser beam scanning means scans the other main surface of the processing object with the laser beam in the second drawing unit, The second stage is moved from the upstream side to the downstream side in the transport direction by a two-stage moving unit, and the first carrying-in unit carries the object to be processed into the first stage located on the upstream side, and The unloading means unloads the processing object from the first stage located downstream, the second loading means loads the processing object into the second stage positioned upstream, and the second unloading means Is characterized in that an object to be processed is carried out from the second stage located on the downstream side.

[0013] The invention described in claim 5 is the invention according to claim 4.
In the laser exposure apparatus described in the above, the first laser beam scanning means is disposed with a first space as a predetermined space separated from the first stage located on the upstream side or the downstream side, and the first laser beam When the scanning means is arranged on the upstream side, the first loading means enters the first space and loads the object to be processed into the first stage, and the first laser beam scanning means When is disposed on the downstream side, the first unloading means enters the first space and unloads the processing target from the first stage, and the second laser beam scanning means, A second space as a predetermined space is arranged with respect to the second stage located on the upstream side or the downstream side,
When the second laser beam scanning means is arranged on the upstream side, the second carrying means enters the second space and carries the object to be processed into the second stage, and When the beam scanning means is disposed on the downstream side, the second unloading means enters the second space and unloads the processing object from the second stage. It is.

[0014] Further, the invention according to claim 6 is based on claim 4.
6. The laser exposure apparatus according to claim 5, wherein the first stage and the second stage in a stationary state located on the upstream side are arranged.
It is characterized in that alignment is performed with respect to a processing target placed on a stage.

[0015]

The operation of the first aspect of the invention is as follows. An upstream unit to which a processing object to be laser-drawn is supplied, and a processing object to be laser-drawn to be drawn from the upstream unit, which is irradiated with a laser beam to form a desired pattern on the processing object. And a downstream unit to which a processing object laser-drawn by the drawing unit is supplied are linearly arranged in that order. The drawing unit is a stage on which the object to be processed is mounted, a stage moving unit that linearly moves the stage in a moving direction that is the same direction as the arrangement direction, and is linearly moved from the upstream side to the downstream side by the stage moving unit. Laser beam scanning means for scanning the main surface of the processing object placed on the stage with a laser beam. The loading means holds the processing target of the upstream unit and transfers the processing target onto the stage in the drawing unit by moving the processing target in the transport direction that is the same direction as the moving direction of the stage, that is, in the arrangement direction. I do. The unloading means holds the object to be processed on the stage in the drawing unit in the transport direction, that is,
The processing object is carried out to the downstream unit so as to be moved in the arrangement direction. Therefore, the processing target is transported in a linear arrangement direction of these units. further,
The carrying-in means carries in the object to be processed to the stage located on the upstream side in the drawing unit, and the carrying-out means takes out the object to be processed from the stage located in the downstream side in the drawing unit.

Therefore, the carry-in position and the carry-out position of the object to be processed in the drawing unit are individually different, and the carry-in means can stand by at the carry-in position in the drawing unit and the carry-out means can stand by at the carry-out position in the drawing unit. Processing throughput is improved. In addition, since the moving direction of the processing target in the drawing unit is the same as the transport direction of the processing target between the units, the drawing unit is moved upward and downward.
The occupation area of the apparatus can be reduced without protruding to the downstream unit.

According to the second aspect of the present invention, the laser beam scanning means is disposed at a predetermined space from the stage located on the upstream side or the downstream side. Further, when the laser beam scanning means is arranged on the upstream side, the carrying means enters the space and carries the object to be processed to the stage, and the laser beam scanning means is arranged on the downstream side. If there is, the carrying-out means enters the space and carries out the processing object from the stage.
Therefore, the carrying-in means or the carrying-out means is provided in the space,
That is, since the object to be processed is carried in or carried out by entering the space between the stage and the laser beam scanning means in the drawing unit, the length of each unit in the arrangement direction can be shortened, and the carrying means is moved upstream. It can be made to stand by directly above the stage located on the side, and the carrying-out means can be made to stand by directly above the stage located on the downstream side.

According to the third aspect of the present invention, the alignment is performed with respect to the processing object placed on the stationary stage located on the upstream side, so that the stage is aligned for alignment of the processing object. No need to move.

According to the fourth aspect of the present invention, an upstream unit into which a processing target to be laser-drawn is loaded, and a first unit for writing a desired pattern on one main surface of the processing target. A drawing unit, a reversing unit for reversing the processing object to draw a pattern on the other main surface of the processing object, and a second drawing for drawing a desired pattern on the other main surface of the processing object The unit and the downstream unit to which the object to be processed after the laser writing on both main surfaces is supplied are linearly arranged in this order so that the object to be processed is transported in a linear transport direction. The first drawing unit includes a first stage on which the object to be processed is mounted, a first stage moving unit that linearly moves the first stage in the transport direction, and a first stage moving unit that moves the first stage from the upstream side to the downstream side. A first laser beam scanning means for scanning a laser beam on a main surface on one side of the processing object placed on the stage which is linearly moved; The second drawing unit includes a second stage on which the object to be processed is placed, a second stage moving unit that linearly moves the second stage in the transport direction, and a second stage moving unit that moves the second stage from the upstream side to the downstream side. A second laser beam scanning unit for scanning the main surface on the other side of the processing target placed on the stage that is linearly moved with a laser beam;

The first carrying-in means carries the object to be processed onto the first stage in the first drawing unit while holding the object to be processed in the upstream unit and moving it in the transport direction. The first unloading unit unloads the processing object to the reversing unit while holding the processing object on the first stage in the first drawing unit and moving the processing object in the transport direction. The second carrying-in means carries the processing target onto the second stage in the second drawing unit while holding the processing target of the reversing unit and moving the processing target in the transport direction. The second unloading unit unloads the processing object to the downstream unit while holding the processing object on the second stage in the second drawing unit and moving the processing object in the transport direction. Therefore, the processing target is transported in a linear arrangement direction of these units. Further, the first carrying-in means carries in the object to be processed to the first stage located on the upstream side in the first drawing unit, and the first carrying-out means takes up the first object located on the downstream side in the first drawing unit. The processing object is unloaded from one stage, the second loading means loads the processing object to the second stage located on the upstream side in the second drawing unit, and the second unloading means includes:
An object to be processed is carried out from a second stage located downstream in the second drawing unit.

Therefore, the carry-in position and the carry-out position of the object to be processed are individually different in the first and second drawing units.
The first and second carrying-in means can stand by at the carry-in position in the first and second drawing units, and the first and second carrying-out means can stand by at the carry-out position in the first and second drawing units. In addition, the throughput of the transport process is improved. In addition, since the moving direction of the processing target in the first and second drawing units is the same as the transport direction of the processing target between the units, the first and second drawing units may protrude from other units. Therefore, even in the case of a double-sided laser exposure apparatus, the area occupied by this apparatus can be reduced.

According to the fifth aspect of the present invention, the first laser beam scanning means is arranged with the first space as a predetermined space separated from the first stage located on the upstream side or the downstream side. You. When the first laser beam scanning means is disposed on the upstream side, the first carrying-in means enters the first space and carries the object to be processed into the first stage. When the beam scanning means is arranged on the downstream side, the first unloading means enters the front first space and unloads the processing target from the first stage, and the second laser beam scanning means The second stage, which is located upstream or downstream, is disposed with a second space as a predetermined space. Also, when the second laser beam scanning means is arranged on the upstream side,
The second carry-in means enters the second space and carries the object to be processed into the second stage. When the second laser beam scanning means is arranged on the downstream side, the second carry-out means is provided. The object to be processed enters the second space and is carried out of the second stage. Therefore, the first carrying-in means or the first carrying-out means is moved into the first space between the first stage and the first laser beam scanning means in the first drawing unit to carry in or carry out the processing object. The second carrying-in means or the second carrying-out means enter the second space between the second stage and the second laser beam scanning means in the second drawing unit to carry in or carry out the processing object. , The length of each unit in the arrangement direction can be shortened, and the first and second carrying-in means can be made to stand by directly above the first and second stages located on the upstream side, etc. It is possible to wait just above the first and second stages located on the downstream side.

According to the sixth aspect of the present invention, since the alignment is performed with respect to the processing object mounted on the first and second stages in the stationary state located on the upstream side, the alignment of the processing object is improved. Therefore, there is no need to move the first and second stages.

[0024]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing a schematic configuration of a double-sided laser exposure apparatus which is an example of a laser exposure apparatus according to the present invention, FIG. 2 is a front view thereof, FIG. 3 is a plan view thereof, and FIG. It is. FIG. 5 is a block diagram showing a schematic configuration of the laser exposure apparatus shown in FIGS. This double-sided laser exposure apparatus is an apparatus for drawing a desired pattern on both surfaces of a plate-like processing target W (for example, a substrate for a printed wiring board on which a photosensitive photoresist is formed).

The double-sided laser exposure apparatus according to the present embodiment includes a loader 1 into which a processing object W to be laser-drawn is loaded.
And a surface drawing apparatus 2 for drawing a desired pattern on one main surface of the processing object W, and inverting the processing object W to draw a pattern on the other main surface of the processing object W A 180 ° reversing device 3, a back surface drawing device 4 for drawing a desired pattern on the other main surface of the processing object W, and an unloader 5 into which the processing object W after laser writing on both main surfaces is loaded are provided. , These loaders 1 and the surface drawing devices 2 and 1
The 80 ° reversing device 3, the back surface drawing device 4, and the unloader 5 are linearly arranged so that the processing target object W is transported in a linear transport direction.

The above-mentioned loader 1 corresponds to the upstream unit in the present invention, and the above-described surface drawing apparatus 2 corresponds to the first drawing unit in the present invention.
The 0 ° reversing device 3 corresponds to a reversing unit in the present invention, the above-described back surface drawing device 4 corresponds to a second drawing unit in the present invention, and the unloader 5 corresponds to a downstream unit in the present invention.

The double-sided laser exposure apparatus includes a first transfer device 6A for moving the processing object W from the loader 1 to the surface drawing device 2, and a 180 ° rotation from the surface drawing device 2.
A second transport device 6B for moving the processing target W to the reversing device 3, a third transport device 6C for moving the processing target W from the 180 ° reversing device 3 to the back surface drawing device 4,
A fourth transfer device 6D for moving the processing target object W from the back surface drawing device 4 to the unloader 5 is provided. In addition,
The first transport device 6A described above corresponds to a first loading device in the present invention, the second transport device 6B described above corresponds to a first unloading device in the present invention, and the third transport device 6C described above corresponds to a third transport device in the present invention. The fourth carrying device 6D corresponds to the second carrying-out means in the present invention.
Hereinafter, each of the above-described configurations will be described in detail.

The loader 1 carries the object W to be laser-drawn on the mounting surface.

Here, the configuration of the surface drawing apparatus 2 will be described. FIG. 6 is a perspective view showing a schematic configuration of the surface drawing apparatus of the present embodiment, FIG. 7 is a plan view thereof, and FIG. 8 is a side view thereof. FIG. 9 is a block diagram illustrating a schematic configuration of the surface drawing apparatus of the present embodiment.

As shown in FIG. 6 and FIG.
A pair of guide rails 8 is arranged on the upper surface of
A feed screw 9a rotated by a servomotor 9 is provided between the guide rails 8. A drawing stage 14 is screwed into the lower part of the feed screw 9a. The drawing stage 14 includes a stage base 10 to which a feed screw 9a is screwed and slidably mounted along the guide rail 8, and a rotation about a vertical z-axis (θ rotation).
A rotating mechanism 11 for raising and lowering in the vertical z direction is provided in order from the bottom, and a mounting table 15 for suction-loading the processing object W is provided at the top.

The above-described drawing stage 14 corresponds to the first stage in the present invention, and the above-described guide rail 8, servo motor 9, feed screw 9a, and the like correspond to the first stage moving means in the present invention.

In the y direction (sub-scanning direction) in which the drawing stage 14 is moved by the drive of the servomotor 9, the drawing laser beam LB is deflected in the x direction (main scanning direction) at the processing position EP while moving downward. An optical system processing unit 21 for irradiating light toward is provided. The optical system processing unit 21 is disposed above the base 7 with a gate-shaped frame.
When the servo motor 9 is driven, the drawing stage 14 moves forward and backward with respect to the optical system processing unit 21. Note that the above-described optical processing unit 21 corresponds to a first laser beam scanning unit in the present invention.

As shown in FIG. 8, an alignment scope unit 31 is provided on the base 7 so as to cover the drawing stage 14 at the standby position. The alignment scope unit 31 includes four alignment scopes 33, each of which can move independently in a horizontal plane.
35, 37 and 39 are provided. Each of the alignment scopes 33, 35, 37, and 39 is a CCD camera 33a, 3
5a, 37a, 39a and lens portions 33b, 35b, 37
b, 39b. These alignment scopes 33, 35, 37, and 39 measure the positions of alignment holes formed at four corners of the printed wiring board S mounted on the drawing stage 14, and are mounted on the drawing stage 14. It is used to determine the amount of positional shift of the printed wiring board S and correct the "shift".

Next, the optical system processing section 21 will be described. The laser light source 41 is, for example, a solid-state laser having a wavelength of 532 nm using a semiconductor as an excitation light source. The direction of the laser beam LBa emitted from the laser light source 41 is changed by approximately 90 ° by the corner mirror 43,
The light enters the beam expander 45. The laser beam LBa adjusted to a predetermined beam diameter by the beam expander 45 is split into, for example, eight laser beams LBb by a beam splitter 47 (not shown in the drawing). The laser beam LBb divided into eight beams is condensed by a condenser lens 49 and a corner mirror 51.
Are incident on the acousto-optic modulator 53 in parallel, form an image in the crystal in the acousto-optic modulator 53, and are independently modulated based on raster data by a control signal from the system control unit. It is supposed to be.

The laser beam LBc modulated by the acousto-optic modulator 53 is reflected by a corner mirror 55 and enters a relay lens system 57. The laser beam LBc emitted from the relay lens system 57 is converted into an anamorphic lens 59, a corner mirror 61, and a spherical lens 63.
And a polygon mirror 67 via a corner mirror 65
It is led to. Then, a linear spot long in the main scanning direction (x direction) is formed on each surface of the polygon mirror 67.

The linear laser beam LBc that has been deflected and scanned in the horizontal plane by the rotation of the polygon mirror 67 is represented by f
After passing through the θ lens 68, the light is folded downward by a long folding mirror 69 in the main scanning direction. After being corrected by the field lens 71 so that the angle of incidence on the exposure surface is substantially vertical, the mounting stage 1 is passed through a cylindrical lens 73 which is a type of anamorphic lens.
5 is applied. The cylindrical lens 73 is long in the main scanning direction, and has power only in the sub scanning direction. Of course, instead of the cylindrical lens 73, an anamorphic lens that is long in the main scanning direction and has stronger power in the sub-scanning direction than in the main scanning direction can be used.

The linear spot on the polygon mirror 67 is divided into an fθ lens 68, a field lens 71,
The laser beam LB (maximum 8) moves in the main scanning direction (x direction) by rotating the polygon mirror 67 by forming a spot with a predetermined diameter on the mounting stage 15 by the action with the cylindrical lens 73. (Comprising a laser beam).

As described above, the processing object W on the drawing stage 14 is irradiated with the laser beam LB moving in the main scanning direction (x direction) while being moved in the sub-scanning direction (y direction). The pattern is laser drawn.

Next, the 180 ° reversing device 3 will be described. 10A to 10D are schematic front views for explaining the operation of the 180 ° reversing device. FIG.
As shown in (d), the 180 ° reversing device 3 includes first and second reversing machines 81 and 82 for sandwiching the processing target object W conveyed from the surface drawing device 2 and reversing the front and back thereof.
It has. The first and second reversing machines 81 and 82 are provided from the upstream side in the above-described linear transport direction (y direction).
The reversing units 81 and 82 are arranged side by side in this order. For example, the reversing units 81 and 82 have a flat plate shape in which a plurality of suction holes are suitably provided on a mounting surface on which the processing object W is mounted. The apparatus is provided with a suction mechanism (not shown) for sucking the mounted processing target object W on the mounting surface side by suctioning air from a suction hole by a suction mechanism. An x-direction support shaft 83 to which one end of each of the first and second reversing machines 81 and 82 is connected is provided between the first and second reversing machines 81 and 82. The first and second reversing machines 81 and 82 are rotatably supported around a support shaft 83 (about the x axis), and receive power from a first and second reversing machine rotating mechanism (not shown). And rotates about the support shaft 83 (around the x-axis).

Here, the operation of the 180 ° reversing device 3 for reversing the object W from one main surface (front surface) to the other main surface (back surface) will be described. FIG.
As shown in (a), the processing object W is placed on the mounting surface of the first reversing machine 81 in a state where the first reversing machine 81 is located at the origin position in a horizontal posture (first reversing machine reference state). Is placed. Then, the processing object W is sucked and held on the mounting surface of the first reversing machine 81. Then, in a state where the processing target object W is suction-held on the mounting surface of the first reversing device 81, as shown in FIG. 10B, the first reversing device 81 is moved to a predetermined first angle (the first reversing device 81). 81, a predetermined first inclination angle 所 定 with respect to the xy plane
In FIG. 10, the second reversing machine 82 is rotated about the support shaft 83 in the counterclockwise direction in FIG. Is moved, and the processing object W is processed by the first and second reversing machines 81 and 82.
In between. As shown in FIG. 10C, the first and second reversing machines 81 and 82 are moved toward the second reversing machine 82 with the processing object W sandwiched between the first and second reversing machines 81 and 82. In FIG. 10, it is rotated clockwise. When the first and second reversing devices 81 and 82 are at a predetermined second angle (xy of the first reversing device 81).
When the first reversing device 81 is tilted to a predetermined second tilt angle ψ2) with respect to the plane, as shown in FIG.
At 0, it is rotated counterclockwise around the support shaft 83 to return to the first reversing machine reference state, and the second reversing machine 82 is moved in FIG.
10 is rotated clockwise around the support shaft 83, and FIG.
The state is returned to the state where the second reversing machine 82 is located at the origin position in a horizontal posture as shown in FIG.
The suction of the processing object W by the reversing device 82 is released. In this embodiment, the processing object W is rotated around the x axis and inverted, but the processing object W may be rotated around the y axis and inverted.

The back surface drawing device 4 is the same as the front surface drawing device 2 described above.
Is the same as The drawing stage 1 in the back surface drawing device 4 corresponding to the drawing stage 14 of the front surface drawing device 2
4 corresponds to a second stage in the present invention, and includes a guide rail 8, a servo motor 9, and a feed screw 9a of the surface drawing apparatus 2.
The guide rail 8, the servo motor 9, the feed screw 9 a and the like of the back surface drawing device 4 corresponding to the above correspond to the second stage moving means in the present invention, and the back surface drawing device corresponding to the optical system processing unit 21 of the front surface drawing device 2. The fourth optical system processing unit 21 corresponds to a second laser beam scanning unit in the present invention.

The unloader 5 carries the object to be processed W after laser writing on both main surfaces onto its mounting surface.

Next, the first to fourth transfer devices 6A to 6D will be described. Since the first to fourth transfer devices 6A to 6D have the same configuration, the first transfer device 6A will be described as an example. FIG. 11 is a plan view of the first transfer device 6A, and FIG. 12 is a left side view thereof. FIG. 11, FIG.
As shown in FIG. 1, the first transfer device 6A includes a left column portion 91L erected on a base 1a of the loader 1 shown in FIG.
And an LM guide 92 as a linear guide member in the y-direction fixed to the right column 91R erected on the base 2a of the surface drawing device 2 shown in FIG. Slide member 93 attached to
A linear z-direction guide 94 provided in the slide member 93 in the z-direction; an L-shaped arm 96 having one end attached to the slide member 93 and the suction unit 95 attached to the other side; A y-direction moving actuator 97 such as a rodless cylinder for moving the 93 in the y-direction along the LM guide 92, and an air cylinder for moving the L-shaped arm 96 in the z-direction along the z-direction guide 94 , And an adsorption unit 95 for adsorbing and holding the processing target object W. The suction unit 95 includes a plurality of suction pads 95a so as to be able to suction and hold the processing object W of various sizes. As described above, the first transfer device 6 </ b> A uses the suction unit 95 to
The suction unit 95 can be vertically moved in the z direction by a z-direction moving actuator or the like, and the suction unit 95 can be horizontally moved in the y direction by a y-direction moving actuator 97 or the like (for example, in FIG. 3). As shown in FIG.

Further, the first transporting device 6A has the structure shown in FIGS.
As shown in FIG. 4, a first space as a predetermined space between the optical system processing unit 21 and the drawing stage 14 located on the upstream side in the surface drawing device 2, more specifically, in the surface drawing device 2. , A processing target W can be carried into the drawing stage 14 by entering the space between the alignment scope unit 31 shown in FIGS. 6 to 8 and the drawing stage 14 located on the upstream side. Further, the third transport device 6C for transporting the processing target object W from the 180 ° reversing device 3 to the back surface drawing device 4 is also driven in the same manner as the above-described first transport device 6A, for example, as shown in FIG. A in the direction
By horizontally moving by three strokes, the object W enters the space between the alignment scope unit 31 and the drawing stage 14 in the surface drawing device 4 and can be carried into the drawing stage 14 in the surface drawing device 4. It has become.

The second transfer device 6B transfers the workpiece W from the drawing stage 14 located on the downstream side in the surface drawing device 2 onto the mounting surface of the first reversing device 81 of the 180 ° reversing device 3. Then, for example, as shown in FIG. The fourth transporting device 6D transports the processing target object W from the rendering stage 14 located on the downstream side in the back surface rendering device 4 to the unloader 5 by, for example, a4 strokes in the y direction as shown in FIG. Move horizontally.

Next, the processing operation of the double-sided laser exposure apparatus configured as described above will be described.

As shown in FIG. 1, first, the processing object W is mounted on the mounting surface of the loader 1. First transfer device 6A
Transports the processing target object W on the mounting surface of the loader 1 onto the drawing stage 14 located on the upstream side in the surface drawing apparatus 2 as described below. The suction unit 95 of the first transfer device 6A is moved onto the processing object W placed on the mounting surface of the loader 1 and then lowered toward the mounting surface, and the processing object W on the loader 1 is moved down. Is suction-held by the suction unit 95. Then, the suction unit 95 is lifted from the mounting surface in a state where the processing target object W is suction-held, and is conveyed onto the drawing stage 14 located on the upstream side in the surface drawing apparatus 2, for example, as shown in FIG. As shown in (5), it is moved horizontally by a1 stroke in the y direction. Then, the suction unit 95 is
Drawing stage 14 located on the upstream side in surface drawing device 2
To the processing object W on the drawing stage 14.
Abuts on the suction unit 95, the suction unit 95 is released, and the suction unit 95 is lifted from the drawing stage 14, so that the processing target object W is placed and carried on the drawing stage 14 located on the upstream side. .

The alignment scope unit 31 of the surface drawing apparatus 2 shown in FIGS. 6 to 8 aligns the alignment holes at the four corners of the processing object W placed on the drawing stage 14. Specifically, by moving the four alignment scopes 33, 35, 37, and 39 independently in the horizontal plane (in the xy plane), the stationary processing target W placed on the drawing stage 14 is moved. Is aligned with Based on such an alignment, correction of an error in the x and y directions and an error in the θ direction of the processing target W on the drawing stage 14 is performed. Specifically, the error in the x direction of the processing target W on the drawing stage 14 is eliminated by adjusting the timing of starting the laser beam irradiation by the optical system processing unit 21, and the error in the y direction is eliminated. For the error, the drawing stage 14
The error is eliminated by adjusting the drawing start position of the rotation mechanism 11.
By adjusting the rotation in the θ direction, the error is eliminated.

Next, when the above-described alignment correction is completed, laser beam scanning for drawing a desired pattern on one main surface (front surface) of the processing object W by the optical system processing unit 21 of the surface drawing device 2 is performed. Is performed. In particular,
Drawing stage 14 on which workpiece W is placed by guide rail 8, servo motor 9, feed screw 9a, and the like.
In the sub-scanning direction (y-direction), for example, as shown in FIG.
The laser beam scanning is performed by the optical system processing unit 21 on the surface of the processing target object W on the drawing stage 14 in the main scanning direction (x direction) while moving horizontally by the stroke. In this way, a desired pattern is laser-drawn on the surface of the processing target W.

Subsequently, when the laser drawing on the surface of the processing object W is completed and the drawing stage 14 is located on the downstream side, as shown in FIG. The object W to be processed of the drawing stage 14 located at
It is carried out so as to be horizontally moved by a2 strokes in the direction. Specifically, the suction unit 9 of the second transfer device 6B
5 is a drawing stage 1 located downstream of the surface drawing device 2
4 is moved onto the processing target W placed on the mounting surface of the surface drawing device 4 and then lowered toward the mounting surface, and the processing target W on the drawing stage 14 located on the downstream side of the surface drawing device 2 is moved. Is suction-held by the suction unit 95. Then, the suction unit 95 is lifted from the mounting surface while holding the processing object W by suction, and is horizontally moved by a2 strokes in the y direction so as to be conveyed onto the first reversing device 81 of the 180 ° reversing device 3. Move. Then, the suction unit 95 is lowered toward the first reversing device 81 of the 180 ° reversing device 3 so that the first reversing device 81
When the processing object W comes into contact with the processing object W, the suction of the suction unit 95 is released, and the processing object W is placed on the first reversing device 81 such that the suction unit 95 is lifted from the first reversing device 81. Place.

Next, the first reversing machine 8 of the 180 ° reversing device 3
As shown in FIG. 10, the processing target W placed on the first processing target W is sandwiched between the processing target W by the first and second reversing machines 81 and 82, and the processing target W is laser-drawn. The main surface (front surface) on one side is reversed to the main surface (back surface) on the other side where laser drawing is to be performed.

Next, the second reversing machine 8 of the 180 ° reversing device 3
As shown in FIG. 3, the processing object W placed on the upper surface 2 and inverted on the back side is subjected to the 180
° It is carried from the second reversing device 82 of the reversing device 3 to the drawing stage 14 located on the upstream side in the back surface drawing device 4. Third
The carrying-in operation of the transfer device 6C from the second reversing device 82 of the 180 ° reversing device 3 to the drawing stage 14 located on the upstream side in the back surface drawing device 4 is performed in the same manner as the above-described first transfer device 6A. .

Next, alignment, laser drawing, and the like in the back surface drawing device 4 are performed in the same manner as in the front surface drawing device 2 described above. Note that the third transport device 6C is a second space as a predetermined space between the optical system processing unit 21 and the drawing stage 14 located on the upstream side in the back surface drawing device 4, more specifically, the back surface drawing device. 4, an alignment scope unit 3 as shown in FIGS.
The object W to be processed can be carried into the drawing stage 14 by entering the space between the drawing stage 14 and the drawing stage 14 located on the upstream side.

Subsequently, the laser drawing on the back surface of the processing object W is completed, and the drawing stage 14 of the back surface drawing device 4 is completed.
Is located on the downstream side, as shown in FIG. 3, the fourth transporting device 6D moves the processing target W of the drawing stage 14 located on the downstream side of the back surface drawing device 4 to the unloader 5 by, for example, an a4 stroke in the y direction. And carry it out horizontally.
In this way, laser drawing is performed on both surfaces of the processing target object W.

In the above description of the processing operation, a state in which only a single processing object W is supplied has been described as an example in order to explain the processing operation of each apparatus of the double-sided laser exposure apparatus. In a normal use state, the front surface drawing device 2, the 180 ° inverting device 3, the back surface drawing device 4, the first
Each of the devices such as the fourth to sixth transfer devices 6A to 6D is simultaneously performing the parallel processing on each of the processing objects W. Hereinafter, the processing operation of the double-sided laser exposure apparatus in the normal use state will be described with reference to FIG. FIG. 13 is a time chart for explaining the processing operation by the double-sided laser exposure apparatus.

For example, while moving the drawing stage 14 from the upstream side to the downstream side in the surface drawing device 2, a laser beam is scanned on the surface of the processing object W on the drawing stage 14 to draw a desired pattern. At time t1
If the drawing stage 14 is located on the downstream side in
The transport device 6B is positioned on the drawing stage 14 located on the downstream side and is on standby, and sucks and holds the processing target W on the drawing stage 14 on the downstream side of the surface drawing device 2 by time t2. Receive at. At this time, the backside drawing device 4
Also, in the same manner as in the above-described surface drawing apparatus 2, laser drawing is performed on the back surface of another processing target object W, and the fourth drawing is performed.
The transport device 6D is on standby on the drawing stage 14 located on the downstream side in the back surface drawing device 4, and waits at time t1.
The processing object W on the drawing stage 14 on the downstream side in the back surface drawing device 4 is received by suction during t2 to t2.

During the period from time t2 to time t3, the second transporting device 6B moves the first reversing device 81 of the 180 ° reversing device 3 from above the drawing stage 14 (upstream side) on the downstream side of the surface drawing device 2.
Moving up (downstream), the drawing stage 14 of the surface drawing device 2 moves from downstream to upstream, and the first transfer device 6A
Moves from the upper side of the loader 1 (upstream side) to the upper side of the drawing stage 14 of the surface drawing apparatus 2 (downstream side) while holding the processing object W on the loader 1 by suction. At this time, the drawing stage 14 of the first conveying device 6A and the surface drawing device 2 described above are also used for the third conveying device 6C, the downstream drawing stage 14 in the back surface drawing device 4, and the fourth conveying device 6D.
4 and the same operation as the second transfer device 6B.

Between times t3 and t4, the second transfer device 6B transfers the object to be processed W to the first reversing device 81 of the 180 ° reversing device 3, and the first transfer device 6A transfers the object W to the surface drawing device 2. It passes to the drawing stage 14 on the upstream side. At this time, the third transporting device 6C and the fourth transporting device 6D also perform the above-described first transporting.
Operations similar to those of the transfer device 6A and the second transfer device 6B are performed.

During the period from time t4 to time t5, the second transfer device 6B moves from above the first reversing device 81 (downstream) of the 180 ° reversing device 3 to above the drawing stage 14 (upstream) on the downstream side of the surface drawing device 2. Side), the first transport device 6A moves from above the drawing stage 14 (downstream side) on the upstream side of the surface drawing device 2 to above the mounting surface of the loader 1 (upstream side). In this way, each apparatus is simultaneously processing each processing target object W.

As described above, according to the present embodiment, the carry-in position and the carry-out position of the object to be processed W are individually different in the front surface drawing device 2 and the back surface drawing device 4, and the first and third transfer devices 6A and 6C are provided. Can stand by at the carry-in position in the front surface drawing device 2 and the back surface drawing device 4, respectively, and can stand by at the carry-out position in the front surface drawing device 2 and the back surface drawing device 4 by the second and fourth transport devices 6B and 6D. In the case of the exposure apparatus, the throughput of the transport processing can be improved. Further, since the moving direction of the processing object W in the front surface drawing device 2 and the back surface drawing device 4 is the same as the transport direction of the processing object W between the devices, the front surface drawing device 2 and the back surface drawing device 4 It does not stick out to other devices, and in the case of a double-sided laser exposure device, the area occupied by this device can be reduced.

The first transfer device 6A is moved into the space (first space) between the drawing stage 14 and the optical system processing section 21 in the surface drawing device 2 to carry in the processing object W. The third transfer device 6C is moved into the space (second space) between the drawing stage 14 and the optical system processing unit 21 in the back surface drawing device 4 to carry in the processing object W. Can be shortened in the arrangement direction, and the first transfer device 6A can be moved to the drawing stage 14 located on the upstream side.
, And the third transfer device 6C can be
It is possible to wait just above the drawing stage 14 located on the downstream side.

Specifically, in the conventional laser exposure apparatus, as shown in FIG. 14 (b), the loading / unloading operation of the processing object W is performed on the drawing stage 102 at the upstream position. If the processing object W is not unloaded from the stage 102 by the transfer device (right), a transfer device (left) for loading the next processing object W is provided by the drawing stage 10.
2, there is a tact delay (t4 to t5 hours) of the waiting time (t3 to t4 hours) when the drawing stage 102 is in a waiting state, and laser drawing is started from time t5. I have. On the other hand, in the laser exposure apparatus of the present embodiment, the loading position and the unloading position of the processing target W are individually different in the front surface drawing device 2 and the back surface drawing device 4, and as shown in FIG. When the drawing stage 14 returns from the downstream side to the upstream side (time t3)
In addition, the first and third transfer devices 6A and 6C can stand by at the carry-in positions in the front surface drawing device 2 and the back surface drawing device 4, respectively. At the carry-out position (until time t2), and the first to fourth transport devices can be simultaneously moved from time t2 to time t3, so that the drawing stage shown in FIG. Tact delay (t4 to t4) for waiting time (t3 to t4 hours)
(For 5 hours), laser drawing can be started from time t4, and the throughput of the transport processing can be improved.

Further, since alignment is performed with respect to the processing object W placed on the stationary drawing stage 14 located on the upstream side in the front surface drawing device 2 and the back surface drawing device 4, the alignment of the processing object W can be improved. Therefore, there is no need to move these drawing stages 14. For example, in the conventional example, since the alignment operation is performed during the movement of performing alignment while moving the processing target object W, the alignment operation can be performed only once (open loop control). However, according to the present embodiment, since alignment is performed on the processing target object W in a stationary state, alignment operations can be performed a plurality of times, and alignment accuracy can be improved (closed loop control).

The present invention can be modified as follows.

(1) In the above-described embodiment, the optical system processing unit 21 is provided on the upstream side in the front surface drawing device 2 and the back surface drawing device 4.
However, the optical system processing unit 21 may be arranged downstream in the front surface drawing device 2 and the back surface drawing device 4. Also in this case, similarly to the above-described embodiment, while moving the drawing stage 14 from the upstream side to the downstream side so that the drawing stage 14 enters a position below the optical system processing unit 21,
Laser drawing is performed on the processing target W on the drawing stage 14. In this case, the second transport device is placed in a first space as a space between the downstream optical system processing unit 21 in the surface drawing device 2 and the drawing stage 14 located in the surface drawing device 2 on the downstream side. 6B enters and unloads the processing target object W from the drawing stage 14 located on the downstream side. The optical system processing unit 21 on the downstream side in the backside drawing device 4 and the downstream side in the backside drawing device 4 The fourth transporting device 6D enters the second space as a space between the drawing stage 14 located on the side, and unloads the processing target object W from the drawing stage 14 located on the downstream side. Therefore, the second transfer device 6B is
By entering the first space between the drawing stage 14 and the optical system processing unit 21 in the surface drawing apparatus 2, the processing target W
Is carried out, and the fourth transporting device 6D is caused to enter the second space between the drawing stage and the optical system processing unit in the back surface drawing device 4 to carry out the processing target object W. The length in the arrangement direction can be reduced, and the second transport device 6
B can be made to stand by just above the drawing stage 14 located on the upstream side, and the fourth transport device 6D can be made to stand by just above the drawing stage 14 located on the downstream side.

(2) In the above-described embodiment, a double-sided laser exposure apparatus is described as an example. However, as shown in FIG. 15, a laser exposure apparatus that performs laser drawing only on one main surface of the processing object W is used. In this case, the same effects as those of the above embodiment can be obtained.

(3) In the above-described embodiment, the processing target W placed on the stationary drawing stage located on the upstream side
However, the drawing stage may be moved from the upstream side to the downstream side (in the y direction) while being aligned with the processing target W on the drawing stage.

[0068]

As is apparent from the above description, according to the first aspect of the present invention, the carrying-in position and the carrying-out position of the object to be processed in the drawing unit are individually different from each other, and the carrying-in means is provided in the drawing unit. Since the carrying-out means can stand by at the carrying-out position at the carrying-out position in the drawing unit, the throughput of the carrying process can be improved. Further, since the moving direction of the processing target in the drawing unit and the transport direction of the processing target between the units are the same direction, the drawing unit does not protrude with respect to the upstream and downstream units, thereby occupying the apparatus. The area can be reduced.

According to the second aspect of the present invention, the carrying-in means or the carrying-out means is caused to enter the space between the stage and the laser beam scanning means in the drawing unit to carry in or carry out the processing object. Therefore, the length of each unit in the arrangement direction can be shortened, and the carrying-in means can be made to stand by directly above the stage located on the upstream side, and the carrying-out means can be placed directly above the stage located on the downstream side. And so on.

According to the third aspect of the present invention, the alignment is performed with respect to the processing object mounted on the stationary stage located upstream, so that the stage is aligned for alignment of the processing object. No need to move.

According to the fourth aspect of the present invention, the carry-in position and the carry-out position of the object to be processed are individually different in the first and second drawing units, and the first and second carry-in means are different from each other.
Since the first and second unloading units can stand by at the unloading positions in the first and second drawing units at the loading position in the drawing unit, the throughput of the transfer process can be improved even in the case of a double-sided laser exposure apparatus. . A moving direction of the processing target in the first and second drawing units;
Since the transport direction of the object to be processed between the units is the same direction, the first and second drawing units do not protrude with respect to the other units. Can be reduced.

According to the fifth aspect of the present invention, the first loading means or the first unloading means is provided in the first space between the first stage and the first laser beam scanning means in the first drawing unit. To carry in or carry out the object to be processed, and move the second carrying-in means or the second carrying-out means into the second space between the second stage and the second laser beam scanning means in the second drawing unit. As the object to be processed is carried in or carried out, the length of each unit in the arrangement direction can be shortened.
The first and second unloading units can be made to stand by, for example, directly above the first and second stages located on the downstream side, and the like.

According to the invention described in claim 6, since the alignment is performed with respect to the processing object mounted on the first and second stationary stages located on the upstream side, the alignment of the processing object is performed. There is no need to move the first and second stages.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a schematic configuration of a double-sided laser exposure apparatus which is an example of a laser exposure apparatus according to the present invention.

FIG. 2 is a front view showing a schematic configuration of the double-sided laser exposure apparatus shown in FIG.

FIG. 3 is a plan view showing a schematic configuration of the double-sided laser exposure apparatus shown in FIG.

FIG. 4 is a left side view showing a schematic configuration of the double-sided laser exposure apparatus shown in FIG.

FIG. 5 is a block diagram illustrating a schematic configuration of a laser exposure apparatus of the present embodiment.

FIG. 6 is a perspective view illustrating a schematic configuration of a surface drawing apparatus according to the present embodiment.

FIG. 7 is a plan view showing a schematic configuration of the surface drawing apparatus shown in FIG. 6;

8 is a side view showing a schematic configuration of the surface drawing apparatus shown in FIG.

FIG. 9 is a block diagram illustrating a schematic configuration of a surface drawing apparatus according to the present embodiment.

FIGS. 10A to 10D are schematic front views illustrating the operation of the 180 ° reversing device.

FIG. 11 is a plan view of the first transfer device.

FIG. 12 is a left side view of the first transfer device shown in FIG. 11;

FIG. 13 is a time chart for explaining a processing operation by the double-sided laser exposure apparatus.

FIG. 14A is a time chart illustrating a processing operation of the apparatus according to the present embodiment, and FIG. 14B is a time chart illustrating a processing operation of the conventional apparatus.

FIG. 15 is a block diagram showing a schematic configuration of a device different from the device of the present embodiment.

FIG. 16 is a block diagram showing a schematic configuration of a conventional laser exposure apparatus.

FIG. 17 is a block diagram showing a schematic configuration of a conventional double-sided laser exposure apparatus.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Loader 2 ... Surface drawing device 3 ... 180 degree reversing device 4 ... Backside drawing device 5 ... Unloader 6A-6D ... 1st-4th conveyance device 8 ... Guide rail 9 ... Servo motor 9a ... Feed screw 14 ... Drawing stage 21 … Optical system processing 31… Alignment scope unit W… Processing target

Continuation of the front page (72) Inventor Kenichi Nakamura 4-chome Tenjin Kitamachi 1-chome, Horikawa-dori Teranouchi, Kamigyo-ku, Kyoto F-term (reference) 2H097 AA01 AA03 CA17 GB04 KA28 LA09

Claims (6)

[Claims] 1. A laser exposure apparatus that irradiates a laser beam onto a main surface of a plate-like processing target to draw a desired pattern on the main surface of the processing target, wherein the processing target is placed. A stage, stage moving means for linearly moving the stage, and laser beam scanning means for scanning the main surface of the processing target placed on the stage linearly moved by the stage moving means with a laser beam; A drawing unit; an upstream unit disposed upstream of the drawing unit in a moving direction of the stage moved by the stage moving means; and a moving direction of the stage moved by the stage moving means. A downstream unit arranged downstream of the drawing unit; and the stage holding an object to be processed of the upstream unit. Loading means for loading a processing target object on the stage in the drawing unit so as to move the processing target object on the stage in the drawing unit, and holding the processing target object on the stage in the drawing unit. Carrying out the object to be processed to the downstream unit, so as to move the main surface of the object to be processed by the laser beam scanning means, The stage is moved from the upstream side to the downstream side in the transport direction by a stage moving unit, the carrying-in unit carries the object to be processed into the stage located on the upstream side, and the carrying-out unit is located on the downstream side A laser exposure apparatus, wherein an object to be processed is carried out from the stage. 2. The laser exposure apparatus according to claim 1, wherein the laser beam scanning means is arranged at a predetermined space from the stage located on an upstream side or a downstream side, and the laser beam scanning means is provided. Is arranged on the upstream side, the carrying means enters the space and carries the object to be processed to the stage, and when the laser beam scanning means is arranged on the downstream side, Wherein the unloading means enters the space and unloads the processing object from the stage. 3. The laser exposure apparatus according to claim 1, wherein the laser is aligned with a processing object mounted on the stationary stage located upstream. Exposure equipment. 4. A laser exposure apparatus which irradiates a laser beam onto both principal surfaces of a plate-shaped object to be processed and draws a desired pattern on both main surfaces of the object to be processed. An upstream unit into which the object is loaded, a first drawing unit for writing a desired pattern on one main surface of the object to be processed, and this processing for drawing a pattern on the other main surface of the object to be processed. A reversing unit for reversing the object, a second drawing unit for drawing a desired pattern on the other main surface of the processing object, and a downstream unit into which the processing object after laser writing on both main surfaces is carried in; , The processing object is linearly arranged so as to be transported in a linear transport direction, and the first drawing unit includes a first drawing unit on which the processing object is placed.
A stage, first stage moving means for moving the first stage in the transport direction, and a main surface on one side of the processing object mounted on the first stage which is linearly moved by the first stage moving means A first laser beam scanning unit that scans a laser beam, wherein the second drawing unit has a second laser unit on which a processing target is placed.
A stage, a second stage moving means for moving the second stage in the transport direction, and a main surface on the other side of the processing object mounted on the second stage linearly moved by the second stage moving means And a second laser beam scanning means for scanning a laser beam on the first stage in the first drawing unit so as to hold and move the processing object of the upstream unit in the transport direction. A first loading unit for loading a processing target object on the top, a processing target object on the first stage in the first drawing unit is held and moved in the transport direction,
A first unloading unit that unloads the processing target object to the reversing unit; and a processing unit that holds the processing target object of the reversing unit and moves the processing target in the transport direction, on the second stage in the second drawing unit. A second loading means for loading the processing target object, and a processing target object on the second stage in the second drawing unit is held and moved in the transport direction,
A second unloading unit that unloads the object to be processed to the downstream unit, wherein the first laser beam scanning unit scans the main surface on one side of the object with the laser beam in the first drawing unit. Moving the first stage from the upstream side to the downstream side in the transport direction by the first stage moving means; and moving the first stage from the upstream side to the downstream side in the second drawing unit by the second laser beam scanning means. When scanning the surface with a laser beam, the second stage moving means moves the second stage from the upstream side to the downstream side in the transport direction, and the first loading means moves the first stage positioned on the upstream side. Loading the processing object into the stage, the first unloading means unloads the processing object from the first stage located on the downstream side, and the second loading means includes the upstream side Position carries the processing object in the second stage, the second discharge means, a laser exposure apparatus, characterized by unloading the processed object from the second stage located downstream. 5. The laser exposure apparatus according to claim 4, wherein the first laser beam scanning unit is separated from the first stage positioned upstream or downstream by a first space as a predetermined space. When the first laser beam scanning means is arranged on the upstream side, the first carrying-in means enters the first space and carries the object to be processed into the first stage. When the first laser beam scanning means is arranged on the downstream side, the first unloading means enters the first space and unloads the processing target from the first stage; The second laser beam scanning means is arranged with a second space as a predetermined space separated from the second stage located on the upstream side or the downstream side, and the second laser beam scanning means is arranged on the upstream side. In the case where the second carrying-in means enters the second space and carries the object to be processed into the second stage, and the laser beam scanning means is disposed on the downstream side, Wherein the second unloading means enters the second space and unloads the processing object from the second stage. 6. The laser exposure apparatus according to claim 4, wherein alignment is performed with respect to a processing object mounted on the stationary first stage and second stage located upstream. A laser exposure apparatus, comprising: