KR102040224B1 - 절연층 제조방법 및 다층인쇄회로기판 제조방법 - Google Patents

절연층 제조방법 및 다층인쇄회로기판 제조방법 Download PDF

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Publication number
KR102040224B1
KR102040224B1 KR1020170097282A KR20170097282A KR102040224B1 KR 102040224 B1 KR102040224 B1 KR 102040224B1 KR 1020170097282 A KR1020170097282 A KR 1020170097282A KR 20170097282 A KR20170097282 A KR 20170097282A KR 102040224 B1 KR102040224 B1 KR 102040224B1
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KR
South Korea
Prior art keywords
group
resin layer
alkali
photosensitive resin
insulating layer
Prior art date
Application number
KR1020170097282A
Other languages
English (en)
Korean (ko)
Other versions
KR20180018337A (ko
Inventor
정우재
경유진
최병주
최보윤
이광주
정민수
Original Assignee
주식회사 엘지화학
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 엘지화학 filed Critical 주식회사 엘지화학
Priority to JP2018518421A priority Critical patent/JP6735819B2/ja
Priority to CN201780002770.1A priority patent/CN107926125B/zh
Priority to PCT/KR2017/008568 priority patent/WO2018030761A1/ko
Priority to TW106126934A priority patent/TWI659998B/zh
Publication of KR20180018337A publication Critical patent/KR20180018337A/ko
Application granted granted Critical
Publication of KR102040224B1 publication Critical patent/KR102040224B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
    • H05K3/4667—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders characterized by using an inorganic intermediate insulating layer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0023—Etching of the substrate by chemical or physical means by exposure and development of a photosensitive insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H05K3/287—Photosensitive compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Ceramic Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Materials For Photolithography (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
KR1020170097282A 2016-08-09 2017-07-31 절연층 제조방법 및 다층인쇄회로기판 제조방법 KR102040224B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2018518421A JP6735819B2 (ja) 2016-08-09 2017-08-08 絶縁層の製造方法および多層印刷回路基板の製造方法
CN201780002770.1A CN107926125B (zh) 2016-08-09 2017-08-08 用于制造绝缘层和多层印刷电路板的方法
PCT/KR2017/008568 WO2018030761A1 (ko) 2016-08-09 2017-08-08 절연층 제조방법 및 다층인쇄회로기판 제조방법
TW106126934A TWI659998B (zh) 2016-08-09 2017-08-09 製造絕緣層及多層印刷電路板的方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR20160101420 2016-08-09
KR1020160101420 2016-08-09

Publications (2)

Publication Number Publication Date
KR20180018337A KR20180018337A (ko) 2018-02-21
KR102040224B1 true KR102040224B1 (ko) 2019-11-06

Family

ID=61525523

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170097282A KR102040224B1 (ko) 2016-08-09 2017-07-31 절연층 제조방법 및 다층인쇄회로기판 제조방법

Country Status (4)

Country Link
JP (1) JP6735819B2 (ja)
KR (1) KR102040224B1 (ja)
CN (1) CN107926125B (ja)
TW (1) TWI659998B (ja)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019200244A (ja) * 2018-05-14 2019-11-21 三菱瓦斯化学株式会社 リソグラフィー用膜形成材料、リソグラフィー用膜形成用組成物、リソグラフィー用下層膜及びパターン形成方法
JP7415310B2 (ja) * 2018-11-21 2024-01-17 三菱瓦斯化学株式会社 リソグラフィー用膜形成材料、リソグラフィー用膜形成用組成物、リソグラフィー用下層膜及びパターン形成方法
KR20210000655A (ko) * 2019-06-25 2021-01-05 엘지이노텍 주식회사 회로기판
KR102711612B1 (ko) * 2019-10-31 2024-09-30 주식회사 엘지화학 절연층 제조 방법 및 다층 인쇄 회로기판 제조 방법
TWI823259B (zh) * 2022-02-17 2023-11-21 李家銘 無膜式乾式光阻曝光製程

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003264370A (ja) * 2002-03-11 2003-09-19 Kyocera Chemical Corp 多層プリント配線板とその製造方法、およびそれに用いるプリント配線板用銅箔付き樹脂シート

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JPH05226243A (ja) * 1991-07-09 1993-09-03 Oki Electric Ind Co Ltd 高速素子実装用回路基板の製造方法
JP3151964B2 (ja) * 1992-10-23 2001-04-03 富士電機株式会社 半導体装置用樹脂膜の窓明け方法
JPH06268378A (ja) * 1993-03-12 1994-09-22 Oki Electric Ind Co Ltd 多層配線基板のビアホールの形成方法
JP2000124217A (ja) * 1998-10-14 2000-04-28 Murata Mfg Co Ltd 配線パターンの構造及び配線パターンの形成方法
JP5298462B2 (ja) * 2006-06-06 2013-09-25 日立化成株式会社 酸性置換基と不飽和マレイミド基を有する硬化剤の製造法並びに熱硬化性樹脂組成物、プリプレグ及び積層板
JP5277867B2 (ja) * 2007-10-29 2013-08-28 日立化成デュポンマイクロシステムズ株式会社 ポジ型感光性樹脂組成物、パタ−ンの製造方法及び電子部品
KR101831912B1 (ko) * 2010-10-05 2018-02-26 바스프 에스이 벤조카르바졸 화합물의 옥심 에스테르 유도체 및 광중합성 조성물에서의 광개시제로서의 그의 용도
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KR20160042981A (ko) * 2013-08-13 2016-04-20 다이요 잉키 세이조 가부시키가이샤 알칼리 현상형 광경화성 열경화성 수지 조성물 및 그것을 사용한 프린트 배선판
KR101734425B1 (ko) * 2013-09-24 2017-05-11 주식회사 엘지화학 드라이 필름 솔더 레지스트의 제조 방법과, 이에 사용되는 필름 적층체
KR101792755B1 (ko) * 2014-10-28 2017-11-01 주식회사 엘지화학 광경화성 및 열경화성을 갖는 수지 조성물 및 드라이 필름 솔더 레지스트
KR102622165B1 (ko) * 2014-12-04 2024-01-08 닛산 가가쿠 가부시키가이샤 포지티브형 감광성 수지 조성물

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JP2003264370A (ja) * 2002-03-11 2003-09-19 Kyocera Chemical Corp 多層プリント配線板とその製造方法、およびそれに用いるプリント配線板用銅箔付き樹脂シート

Also Published As

Publication number Publication date
CN107926125B (zh) 2020-12-25
TW201815947A (zh) 2018-05-01
TWI659998B (zh) 2019-05-21
JP2018532270A (ja) 2018-11-01
KR20180018337A (ko) 2018-02-21
JP6735819B2 (ja) 2020-08-05
CN107926125A (zh) 2018-04-17

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