KR102037226B1 - 발광 표시 장치의 유체 조립 시스템 및 방법 - Google Patents

발광 표시 장치의 유체 조립 시스템 및 방법 Download PDF

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Publication number
KR102037226B1
KR102037226B1 KR1020170118680A KR20170118680A KR102037226B1 KR 102037226 B1 KR102037226 B1 KR 102037226B1 KR 1020170118680 A KR1020170118680 A KR 1020170118680A KR 20170118680 A KR20170118680 A KR 20170118680A KR 102037226 B1 KR102037226 B1 KR 102037226B1
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KR
South Korea
Prior art keywords
light emitting
well
providing
emitting device
liquid suspension
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KR1020170118680A
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English (en)
Korean (ko)
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KR20180030454A (ko
Inventor
켄지 사사키
존 슈 렐레 폴
울머 커트
중-짠 이
Original Assignee
일룩스 아이엔씨.
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Priority claimed from US15/266,796 external-priority patent/US9917226B1/en
Priority claimed from US15/410,195 external-priority patent/US10236279B2/en
Priority claimed from US15/410,001 external-priority patent/US9825202B2/en
Priority claimed from US15/412,731 external-priority patent/US10418527B2/en
Application filed by 일룩스 아이엔씨. filed Critical 일룩스 아이엔씨.
Publication of KR20180030454A publication Critical patent/KR20180030454A/ko
Application granted granted Critical
Publication of KR102037226B1 publication Critical patent/KR102037226B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/95053—Bonding environment
    • H01L2224/95085—Bonding environment being a liquid, e.g. for fluidic self-assembly

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Theoretical Computer Science (AREA)
  • Led Device Packages (AREA)
  • Wire Bonding (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
KR1020170118680A 2016-09-15 2017-09-15 발광 표시 장치의 유체 조립 시스템 및 방법 KR102037226B1 (ko)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
US15/266,796 US9917226B1 (en) 2016-09-15 2016-09-15 Substrate features for enhanced fluidic assembly of electronic devices
US15/266,796 2016-09-15
US15/410,195 US10236279B2 (en) 2014-10-31 2017-01-19 Emissive display with light management system
US15/410,001 2017-01-19
US15/410,001 US9825202B2 (en) 2014-10-31 2017-01-19 Display with surface mount emissive elements
US15/410,195 2017-01-19
US15/412,731 US10418527B2 (en) 2014-10-31 2017-01-23 System and method for the fluidic assembly of emissive displays
US15/412,731 2017-01-23

Publications (2)

Publication Number Publication Date
KR20180030454A KR20180030454A (ko) 2018-03-23
KR102037226B1 true KR102037226B1 (ko) 2019-10-28

Family

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KR1020170118680A KR102037226B1 (ko) 2016-09-15 2017-09-15 발광 표시 장치의 유체 조립 시스템 및 방법

Country Status (4)

Country Link
JP (1) JP6578332B2 (zh)
KR (1) KR102037226B1 (zh)
CN (1) CN107833525B (zh)
TW (1) TWI664710B (zh)

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WO2022119018A1 (ko) * 2020-12-04 2022-06-09 엘지전자 주식회사 디스플레이 장치
WO2022168998A1 (ko) * 2021-02-03 2022-08-11 엘지전자 주식회사 반도체 발광소자의 전사용 롤러부의 전극구조 및 이를 포함하는 지능형 조립전사 통합장치

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CN109585342B (zh) * 2018-11-30 2020-10-16 天马微电子股份有限公司 一种微发光二极管的转移方法及显示面板
KR102145016B1 (ko) * 2019-02-28 2020-08-18 엘지전자 주식회사 반도체 발광 소자를 디스플레이 패널에 조립하는 조립 장치
JP6694222B1 (ja) * 2019-03-18 2020-05-13 アルディーテック株式会社 半導体チップ集積装置の製造方法、半導体チップ集積装置、半導体チップインクおよび半導体チップインク吐出装置
KR20200124799A (ko) * 2019-04-24 2020-11-04 삼성디스플레이 주식회사 표시 장치 및 그의 제조 방법
KR20200026669A (ko) * 2019-05-22 2020-03-11 엘지전자 주식회사 반도체 발광소자의 자가조립 장치 및 방법
KR102695965B1 (ko) * 2019-06-20 2024-08-16 엘지전자 주식회사 디스플레이 장치 제조를 위한 기판 및 디스플레이 장치의 제조방법
KR102687815B1 (ko) 2019-06-20 2024-07-24 엘지전자 주식회사 디스플레이 장치 및 반도체 발광소자의 자가조립 방법
KR20190104276A (ko) * 2019-08-20 2019-09-09 엘지전자 주식회사 마이크로 led를 이용한 디스플레이 장치 및 이의 제조 방법
KR20200026725A (ko) * 2019-08-28 2020-03-11 엘지전자 주식회사 반도체 발광소자 수거 장치 및 수거 방법
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WO2021054508A1 (ko) * 2019-09-19 2021-03-25 엘지전자 주식회사 반도체 발광소자의 자가조립 장치
CN110600590B (zh) * 2019-09-25 2021-02-02 深圳市华星光电半导体显示技术有限公司 微型发光二极管的转移方法和显示面板
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WO2022168998A1 (ko) * 2021-02-03 2022-08-11 엘지전자 주식회사 반도체 발광소자의 전사용 롤러부의 전극구조 및 이를 포함하는 지능형 조립전사 통합장치

Also Published As

Publication number Publication date
KR20180030454A (ko) 2018-03-23
TW201826490A (zh) 2018-07-16
JP2018061017A (ja) 2018-04-12
CN107833525B (zh) 2020-10-27
CN107833525A (zh) 2018-03-23
TWI664710B (zh) 2019-07-01
JP6578332B2 (ja) 2019-09-18

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