KR102035584B1 - 정전 척 및 반도체 제조 장치 - Google Patents

정전 척 및 반도체 제조 장치 Download PDF

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Publication number
KR102035584B1
KR102035584B1 KR1020140048657A KR20140048657A KR102035584B1 KR 102035584 B1 KR102035584 B1 KR 102035584B1 KR 1020140048657 A KR1020140048657 A KR 1020140048657A KR 20140048657 A KR20140048657 A KR 20140048657A KR 102035584 B1 KR102035584 B1 KR 102035584B1
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KR
South Korea
Prior art keywords
electrostatic chuck
wafer
electrostatic
oxide
mounting table
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KR1020140048657A
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English (en)
Korean (ko)
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KR20140133436A (ko
Inventor
마사쿠니 미야자와
가즈요시 미야모토
Original Assignee
신꼬오덴기 고교 가부시키가이샤
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Publication of KR20140133436A publication Critical patent/KR20140133436A/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
KR1020140048657A 2013-05-09 2014-04-23 정전 척 및 반도체 제조 장치 Active KR102035584B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013099269A JP6088346B2 (ja) 2013-05-09 2013-05-09 静電チャック及び半導体製造装置
JPJP-P-2013-099269 2013-05-09

Publications (2)

Publication Number Publication Date
KR20140133436A KR20140133436A (ko) 2014-11-19
KR102035584B1 true KR102035584B1 (ko) 2019-10-24

Family

ID=51864613

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140048657A Active KR102035584B1 (ko) 2013-05-09 2014-04-23 정전 척 및 반도체 제조 장치

Country Status (4)

Country Link
US (1) US9418884B2 (https=)
JP (1) JP6088346B2 (https=)
KR (1) KR102035584B1 (https=)
TW (1) TWI623056B (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9853579B2 (en) * 2013-12-18 2017-12-26 Applied Materials, Inc. Rotatable heated electrostatic chuck
JP2017103389A (ja) * 2015-12-03 2017-06-08 新光電気工業株式会社 静電チャック及び半導体製造装置
JP6531693B2 (ja) * 2016-03-30 2019-06-19 住友大阪セメント株式会社 静電チャック装置、静電チャック装置の製造方法
JP6858035B2 (ja) * 2017-02-27 2021-04-14 新光電気工業株式会社 基板固定具及び基板固定装置
JP6830030B2 (ja) * 2017-04-27 2021-02-17 新光電気工業株式会社 静電チャック及び基板固定装置
US11289355B2 (en) 2017-06-02 2022-03-29 Lam Research Corporation Electrostatic chuck for use in semiconductor processing
JP7378210B2 (ja) * 2019-01-17 2023-11-13 新光電気工業株式会社 セラミック部材の製造方法
KR20230096465A (ko) 2021-12-23 2023-06-30 주식회사 미코세라믹스 세라믹 서셉터의 제조 방법
JP7194306B1 (ja) * 2022-07-27 2022-12-21 黒崎播磨株式会社 アルミナ焼結体及び静電チャック

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002231796A (ja) 2001-01-30 2002-08-16 Kyocera Corp 静電チャック
JP2005104746A (ja) 2003-09-29 2005-04-21 Shinko Electric Ind Co Ltd アルミナ質セラミック板及びその製造方法
JP2011222793A (ja) 2010-04-12 2011-11-04 Sumitomo Electric Ind Ltd 静電チャック

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4248833B2 (ja) * 2002-09-12 2009-04-02 株式会社ソディック セラミックス及びその製造方法
US6982125B2 (en) * 2002-12-23 2006-01-03 Saint-Gobain Ceramics & Plastics, Inc. ALN material and electrostatic chuck incorporating same
KR100918190B1 (ko) * 2005-04-22 2009-09-22 주식회사 코미코 치밀질 질화알루미늄 소결체, 그 제조 방법 및 상기소결체를 이용한 반도체 제조용 부재
JP5042886B2 (ja) 2008-03-06 2012-10-03 太平洋セメント株式会社 静電チャック
JP5593299B2 (ja) * 2011-11-25 2014-09-17 東京エレクトロン株式会社 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002231796A (ja) 2001-01-30 2002-08-16 Kyocera Corp 静電チャック
JP2005104746A (ja) 2003-09-29 2005-04-21 Shinko Electric Ind Co Ltd アルミナ質セラミック板及びその製造方法
JP2011222793A (ja) 2010-04-12 2011-11-04 Sumitomo Electric Ind Ltd 静電チャック

Also Published As

Publication number Publication date
KR20140133436A (ko) 2014-11-19
JP2014220408A (ja) 2014-11-20
US20140334059A1 (en) 2014-11-13
US9418884B2 (en) 2016-08-16
JP6088346B2 (ja) 2017-03-01
TW201501234A (zh) 2015-01-01
TWI623056B (zh) 2018-05-01

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