TWI623056B - 靜電夾頭及半導體製造裝置 - Google Patents

靜電夾頭及半導體製造裝置 Download PDF

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Publication number
TWI623056B
TWI623056B TW103113016A TW103113016A TWI623056B TW I623056 B TWI623056 B TW I623056B TW 103113016 A TW103113016 A TW 103113016A TW 103113016 A TW103113016 A TW 103113016A TW I623056 B TWI623056 B TW I623056B
Authority
TW
Taiwan
Prior art keywords
electrostatic chuck
ceramic
content
wafer
electrostatic
Prior art date
Application number
TW103113016A
Other languages
English (en)
Chinese (zh)
Other versions
TW201501234A (zh
Inventor
宮澤昌邦
宮本和佳
Original Assignee
新光電氣工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 新光電氣工業股份有限公司 filed Critical 新光電氣工業股份有限公司
Publication of TW201501234A publication Critical patent/TW201501234A/zh
Application granted granted Critical
Publication of TWI623056B publication Critical patent/TWI623056B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
TW103113016A 2013-05-09 2014-04-09 靜電夾頭及半導體製造裝置 TWI623056B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013099269A JP6088346B2 (ja) 2013-05-09 2013-05-09 静電チャック及び半導体製造装置
JP2013-099269 2013-05-09

Publications (2)

Publication Number Publication Date
TW201501234A TW201501234A (zh) 2015-01-01
TWI623056B true TWI623056B (zh) 2018-05-01

Family

ID=51864613

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103113016A TWI623056B (zh) 2013-05-09 2014-04-09 靜電夾頭及半導體製造裝置

Country Status (4)

Country Link
US (1) US9418884B2 (https=)
JP (1) JP6088346B2 (https=)
KR (1) KR102035584B1 (https=)
TW (1) TWI623056B (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9853579B2 (en) * 2013-12-18 2017-12-26 Applied Materials, Inc. Rotatable heated electrostatic chuck
JP2017103389A (ja) * 2015-12-03 2017-06-08 新光電気工業株式会社 静電チャック及び半導体製造装置
JP6531693B2 (ja) * 2016-03-30 2019-06-19 住友大阪セメント株式会社 静電チャック装置、静電チャック装置の製造方法
JP6858035B2 (ja) * 2017-02-27 2021-04-14 新光電気工業株式会社 基板固定具及び基板固定装置
JP6830030B2 (ja) * 2017-04-27 2021-02-17 新光電気工業株式会社 静電チャック及び基板固定装置
US11289355B2 (en) 2017-06-02 2022-03-29 Lam Research Corporation Electrostatic chuck for use in semiconductor processing
JP7378210B2 (ja) * 2019-01-17 2023-11-13 新光電気工業株式会社 セラミック部材の製造方法
KR20230096465A (ko) 2021-12-23 2023-06-30 주식회사 미코세라믹스 세라믹 서셉터의 제조 방법
JP7194306B1 (ja) * 2022-07-27 2022-12-21 黒崎播磨株式会社 アルミナ焼結体及び静電チャック

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002231796A (ja) * 2001-01-30 2002-08-16 Kyocera Corp 静電チャック
US20040121192A1 (en) * 2002-12-23 2004-06-24 Lacourse Brian C ALN material and electrostatic chuck incorporating same
US20040266606A1 (en) * 2002-09-12 2004-12-30 Sodick Co., Ltd. Enhanced ceramic material for precision alignment mechanism
JP2005104746A (ja) * 2003-09-29 2005-04-21 Shinko Electric Ind Co Ltd アルミナ質セラミック板及びその製造方法
JP2011222793A (ja) * 2010-04-12 2011-11-04 Sumitomo Electric Ind Ltd 静電チャック

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100918190B1 (ko) * 2005-04-22 2009-09-22 주식회사 코미코 치밀질 질화알루미늄 소결체, 그 제조 방법 및 상기소결체를 이용한 반도체 제조용 부재
JP5042886B2 (ja) 2008-03-06 2012-10-03 太平洋セメント株式会社 静電チャック
JP5593299B2 (ja) * 2011-11-25 2014-09-17 東京エレクトロン株式会社 接合装置、接合システム、接合方法、プログラム及びコンピュータ記憶媒体

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002231796A (ja) * 2001-01-30 2002-08-16 Kyocera Corp 静電チャック
US20040266606A1 (en) * 2002-09-12 2004-12-30 Sodick Co., Ltd. Enhanced ceramic material for precision alignment mechanism
US20040121192A1 (en) * 2002-12-23 2004-06-24 Lacourse Brian C ALN material and electrostatic chuck incorporating same
JP2005104746A (ja) * 2003-09-29 2005-04-21 Shinko Electric Ind Co Ltd アルミナ質セラミック板及びその製造方法
JP2011222793A (ja) * 2010-04-12 2011-11-04 Sumitomo Electric Ind Ltd 静電チャック

Also Published As

Publication number Publication date
KR20140133436A (ko) 2014-11-19
JP2014220408A (ja) 2014-11-20
US20140334059A1 (en) 2014-11-13
US9418884B2 (en) 2016-08-16
JP6088346B2 (ja) 2017-03-01
KR102035584B1 (ko) 2019-10-24
TW201501234A (zh) 2015-01-01

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