KR102025371B1 - 부품 장착기의 부품 지지 헤드 조립체 - Google Patents

부품 장착기의 부품 지지 헤드 조립체 Download PDF

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Publication number
KR102025371B1
KR102025371B1 KR1020140169979A KR20140169979A KR102025371B1 KR 102025371 B1 KR102025371 B1 KR 102025371B1 KR 1020140169979 A KR1020140169979 A KR 1020140169979A KR 20140169979 A KR20140169979 A KR 20140169979A KR 102025371 B1 KR102025371 B1 KR 102025371B1
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KR
South Korea
Prior art keywords
nozzle
spindle
light
component
support head
Prior art date
Application number
KR1020140169979A
Other languages
English (en)
Korean (ko)
Other versions
KR20160040408A (ko
Inventor
마사키 노리유키
타쿠야 츠츠미
타니자키 마사히로
스스무 키타다
오사무 스기오
히데마사 코레에다
테츠오 후지하라
Original Assignee
한화정밀기계 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 한화정밀기계 주식회사 filed Critical 한화정밀기계 주식회사
Publication of KR20160040408A publication Critical patent/KR20160040408A/ko
Application granted granted Critical
Publication of KR102025371B1 publication Critical patent/KR102025371B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
KR1020140169979A 2014-10-03 2014-12-01 부품 장착기의 부품 지지 헤드 조립체 KR102025371B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014205016A JP6417173B2 (ja) 2014-10-03 2014-10-03 表面実装機の部品保持ヘッド
JPJP-P-2014-205016 2014-10-03

Publications (2)

Publication Number Publication Date
KR20160040408A KR20160040408A (ko) 2016-04-14
KR102025371B1 true KR102025371B1 (ko) 2019-09-25

Family

ID=55801393

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140169979A KR102025371B1 (ko) 2014-10-03 2014-12-01 부품 장착기의 부품 지지 헤드 조립체

Country Status (2)

Country Link
JP (1) JP6417173B2 (ja)
KR (1) KR102025371B1 (ja)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006100594A (ja) 2004-09-29 2006-04-13 Matsushita Electric Ind Co Ltd 部品実装方法及び部品実装装置
JP2006196618A (ja) 2005-01-12 2006-07-27 Fuji Mach Mfg Co Ltd 電子部品装着装置
JP2007019296A (ja) 2005-07-08 2007-01-25 Matsushita Electric Ind Co Ltd 電子部品の実装装置
JP2009130334A (ja) 2007-11-28 2009-06-11 Yamaha Motor Co Ltd 部品移載装置
JP2014063837A (ja) 2012-09-20 2014-04-10 Samsung Techwin Co Ltd 表面実装機の部品保持ヘッド

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS604809B2 (ja) 1977-06-07 1985-02-06 久光製薬株式会社 新規な２‐（ｍ‐ベンゾイル）フエニルプロピオン酸エステル誘導体

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006100594A (ja) 2004-09-29 2006-04-13 Matsushita Electric Ind Co Ltd 部品実装方法及び部品実装装置
JP2006196618A (ja) 2005-01-12 2006-07-27 Fuji Mach Mfg Co Ltd 電子部品装着装置
JP2007019296A (ja) 2005-07-08 2007-01-25 Matsushita Electric Ind Co Ltd 電子部品の実装装置
JP2009130334A (ja) 2007-11-28 2009-06-11 Yamaha Motor Co Ltd 部品移載装置
JP2014063837A (ja) 2012-09-20 2014-04-10 Samsung Techwin Co Ltd 表面実装機の部品保持ヘッド

Also Published As

Publication number Publication date
JP6417173B2 (ja) 2018-10-31
JP2016076550A (ja) 2016-05-12
KR20160040408A (ko) 2016-04-14

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