KR102004238B1 - 칩 전자부품 및 그 제조방법 - Google Patents

칩 전자부품 및 그 제조방법 Download PDF

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Publication number
KR102004238B1
KR102004238B1 KR1020140001659A KR20140001659A KR102004238B1 KR 102004238 B1 KR102004238 B1 KR 102004238B1 KR 1020140001659 A KR1020140001659 A KR 1020140001659A KR 20140001659 A KR20140001659 A KR 20140001659A KR 102004238 B1 KR102004238 B1 KR 102004238B1
Authority
KR
South Korea
Prior art keywords
insulating substrate
inner coil
exposed
magnetic body
bridge pattern
Prior art date
Application number
KR1020140001659A
Other languages
English (en)
Korean (ko)
Other versions
KR20150081802A (ko
Inventor
최민성
Original Assignee
삼성전기주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전기주식회사 filed Critical 삼성전기주식회사
Priority to KR1020140001659A priority Critical patent/KR102004238B1/ko
Priority to JP2014050380A priority patent/JP6351155B2/ja
Priority to CN201410131854.3A priority patent/CN104766691B/zh
Publication of KR20150081802A publication Critical patent/KR20150081802A/ko
Priority to JP2018022181A priority patent/JP6552072B2/ja
Application granted granted Critical
Publication of KR102004238B1 publication Critical patent/KR102004238B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/2804—Printed windings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F10/00—Thin magnetic films, e.g. of one-domain structure
    • H01F10/26—Thin magnetic films, e.g. of one-domain structure characterised by the substrate or intermediate layers
    • H01F10/28—Thin magnetic films, e.g. of one-domain structure characterised by the substrate or intermediate layers characterised by the composition of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00—Details of transformers or inductances, in general
    • H01F27/28—Coils; Windings; Conductive connections
    • H01F27/29—Terminals; Tapping arrangements for signal inductances
    • H01F27/292—Surface mounted devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
KR1020140001659A 2014-01-07 2014-01-07 칩 전자부품 및 그 제조방법 KR102004238B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020140001659A KR102004238B1 (ko) 2014-01-07 2014-01-07 칩 전자부품 및 그 제조방법
JP2014050380A JP6351155B2 (ja) 2014-01-07 2014-03-13 チップ電子部品及びその製造方法
CN201410131854.3A CN104766691B (zh) 2014-01-07 2014-04-02 芯片电子组件及其制造方法
JP2018022181A JP6552072B2 (ja) 2014-01-07 2018-02-09 チップ電子部品及びチップ電子部品の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020140001659A KR102004238B1 (ko) 2014-01-07 2014-01-07 칩 전자부품 및 그 제조방법

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020190088124A Division KR102118489B1 (ko) 2019-07-22 2019-07-22 칩 전자부품의 제조방법

Publications (2)

Publication Number Publication Date
KR20150081802A KR20150081802A (ko) 2015-07-15
KR102004238B1 true KR102004238B1 (ko) 2019-07-26

Family

ID=53648465

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140001659A KR102004238B1 (ko) 2014-01-07 2014-01-07 칩 전자부품 및 그 제조방법

Country Status (3)

Country Link
JP (2) JP6351155B2 (zh)
KR (1) KR102004238B1 (zh)
CN (1) CN104766691B (zh)

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KR101719914B1 (ko) * 2015-07-31 2017-03-24 삼성전기주식회사 코일 전자부품 및 그 제조방법
KR101792365B1 (ko) * 2015-12-18 2017-11-01 삼성전기주식회사 코일 부품 및 그 제조 방법
KR102419961B1 (ko) * 2016-02-18 2022-07-13 삼성전기주식회사 인덕터
KR101883081B1 (ko) * 2016-12-21 2018-07-27 삼성전기주식회사 인덕터
US10755847B2 (en) 2017-03-07 2020-08-25 Samsung Electro-Mechanics Co., Ltd. Coil electronic component
KR102148831B1 (ko) * 2018-10-02 2020-08-27 삼성전기주식회사 코일 부품
KR102100347B1 (ko) * 2018-10-30 2020-04-13 주식회사 코엠고 파워 인덕터 및 그 제조방법
US20200135374A1 (en) * 2018-10-31 2020-04-30 Samsung Electro-Mechanics Co., Ltd. Coil component and manufacturing method of coil component
KR102120198B1 (ko) * 2019-02-28 2020-06-08 삼성전기주식회사 코일 부품
KR20200117700A (ko) 2019-04-05 2020-10-14 삼성전기주식회사 코일 부품
EP3770930B1 (en) * 2019-07-25 2023-03-08 Würth Elektronik Eisos Gmbh & CO. KG Electronic component and method for manufacturing an electronic component
JP2021064669A (ja) * 2019-10-11 2021-04-22 株式会社村田製作所 コイル及び該コイルを備えたインダクタ
JP2022092857A (ja) * 2020-12-11 2022-06-23 Tdk株式会社 コイル部品

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US20130300529A1 (en) * 2012-04-24 2013-11-14 Cyntec Co., Ltd. Coil structure and electromagnetic component using the same

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JP5375878B2 (ja) * 2011-05-26 2013-12-25 Ｔｄｋ株式会社 コイル部品の製造方法及びコイル部品
JP5382064B2 (ja) * 2011-05-26 2014-01-08 Ｔｄｋ株式会社 コイル部品及びその製造方法
JP6215518B2 (ja) * 2011-08-26 2017-10-18 ローム株式会社 磁性金属基板およびインダクタンス素子
EP2606821A1 (fr) * 2011-12-20 2013-06-26 Marc Rocklinger Capteur de pression inductif
CN103377811B (zh) * 2012-04-24 2016-08-10 乾坤科技股份有限公司 电磁器件及其线圈结构

Patent Citations (1)

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Publication number Priority date Publication date Assignee Title
US20130300529A1 (en) * 2012-04-24 2013-11-14 Cyntec Co., Ltd. Coil structure and electromagnetic component using the same

Also Published As

Publication number Publication date
JP2018101797A (ja) 2018-06-28
JP6351155B2 (ja) 2018-07-04
KR20150081802A (ko) 2015-07-15
JP2015130469A (ja) 2015-07-16
JP6552072B2 (ja) 2019-07-31
CN104766691A (zh) 2015-07-08
CN104766691B (zh) 2018-10-02

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