KR101991191B1 - 이방성 도전 접속 구조체, 이방성 도전 접속 방법 및 이방성 도전 접착제 - Google Patents

이방성 도전 접속 구조체, 이방성 도전 접속 방법 및 이방성 도전 접착제 Download PDF

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KR101991191B1
KR101991191B1 KR1020177024611A KR20177024611A KR101991191B1 KR 101991191 B1 KR101991191 B1 KR 101991191B1 KR 1020177024611 A KR1020177024611 A KR 1020177024611A KR 20177024611 A KR20177024611 A KR 20177024611A KR 101991191 B1 KR101991191 B1 KR 101991191B1
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KR
South Korea
Prior art keywords
anisotropic conductive
terminal
base substrate
conductive adhesive
protective film
Prior art date
Application number
KR1020177024611A
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English (en)
Korean (ko)
Other versions
KR20170113622A (ko
Inventor
히로키 오제키
Original Assignee
데쿠세리아루즈 가부시키가이샤
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Application filed by 데쿠세리아루즈 가부시키가이샤 filed Critical 데쿠세리아루즈 가부시키가이샤
Publication of KR20170113622A publication Critical patent/KR20170113622A/ko
Application granted granted Critical
Publication of KR101991191B1 publication Critical patent/KR101991191B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J171/00—Adhesives based on polyethers obtained by reactions forming an ether link in the main chain; Adhesives based on derivatives of such polymers
    • C09J171/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C09J171/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C09J171/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/005—Presence of polyester in the release coating

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Combinations Of Printed Boards (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
KR1020177024611A 2015-03-20 2016-03-09 이방성 도전 접속 구조체, 이방성 도전 접속 방법 및 이방성 도전 접착제 KR101991191B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2015-058068 2015-03-20
JP2015058068A JP2016178225A (ja) 2015-03-20 2015-03-20 異方性導電接続構造体、異方性導電接続方法、及び異方性導電接着剤
PCT/JP2016/057473 WO2016152543A1 (ja) 2015-03-20 2016-03-09 異方性導電接続構造体、異方性導電接続方法、及び異方性導電接着剤

Publications (2)

Publication Number Publication Date
KR20170113622A KR20170113622A (ko) 2017-10-12
KR101991191B1 true KR101991191B1 (ko) 2019-06-19

Family

ID=56977311

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020177024611A KR101991191B1 (ko) 2015-03-20 2016-03-09 이방성 도전 접속 구조체, 이방성 도전 접속 방법 및 이방성 도전 접착제

Country Status (6)

Country Link
JP (1) JP2016178225A (zh)
KR (1) KR101991191B1 (zh)
CN (2) CN115151035A (zh)
HK (1) HK1245567A1 (zh)
TW (1) TWI690250B (zh)
WO (1) WO2016152543A1 (zh)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6604035B2 (ja) * 2015-05-27 2019-11-13 ブラザー工業株式会社 液体吐出装置、及び液体吐出装置の製造方法
GB2539684B (en) * 2015-06-24 2018-04-04 Dst Innovations Ltd Method of surface-mounting components
JP2018088498A (ja) * 2016-11-29 2018-06-07 デクセリアルズ株式会社 異方性導電接着剤
CN113168935B (zh) * 2018-11-21 2023-06-30 三井化学株式会社 各向异性导电片、各向异性导电复合片、各向异性导电片组、电气检查装置及电气检查方法
JP2021036575A (ja) * 2018-12-17 2021-03-04 東芝ホクト電子株式会社 発光装置、接合部の保護方法、発光装置の製造方法、及び、車両用灯具
WO2023171294A1 (ja) * 2022-03-08 2023-09-14 株式会社村田製作所 伸縮性デバイス

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000165009A (ja) * 1998-11-30 2000-06-16 Optrex Corp 電極端子接続構造
JP2010199527A (ja) * 2009-03-31 2010-09-09 Sony Chemical & Information Device Corp 接合体及びその製造方法
JP2012175004A (ja) * 2011-02-23 2012-09-10 Sekisui Chem Co Ltd 接続構造体の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0541091U (ja) * 1991-10-31 1993-06-01 住友ベークライト株式会社 異方導電圧着装置
JP3792554B2 (ja) 2001-03-26 2006-07-05 シャープ株式会社 表示モジュール及びフレキシブル配線板の接続方法
JP3947532B2 (ja) * 2004-07-08 2007-07-25 住友ベークライト株式会社 異方導電性接着剤フィルム
JP2009135388A (ja) 2007-10-30 2009-06-18 Hitachi Chem Co Ltd 回路接続方法
WO2010038753A1 (ja) * 2008-09-30 2010-04-08 ソニーケミカル＆インフォメーションデバイス株式会社 異方性導電接着剤及びそれを用いた接続構造体の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000165009A (ja) * 1998-11-30 2000-06-16 Optrex Corp 電極端子接続構造
JP2010199527A (ja) * 2009-03-31 2010-09-09 Sony Chemical & Information Device Corp 接合体及びその製造方法
JP2012175004A (ja) * 2011-02-23 2012-09-10 Sekisui Chem Co Ltd 接続構造体の製造方法

Also Published As

Publication number Publication date
CN115151035A (zh) 2022-10-04
HK1245567A1 (zh) 2018-08-24
TWI690250B (zh) 2020-04-01
CN107432084A (zh) 2017-12-01
WO2016152543A1 (ja) 2016-09-29
TW201644337A (zh) 2016-12-16
KR20170113622A (ko) 2017-10-12
JP2016178225A (ja) 2016-10-06

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