KR101979181B1 - 고해상도 유기 발광 다이오드 장치 - Google Patents
고해상도 유기 발광 다이오드 장치 Download PDFInfo
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- KR101979181B1 KR101979181B1 KR1020187034660A KR20187034660A KR101979181B1 KR 101979181 B1 KR101979181 B1 KR 101979181B1 KR 1020187034660 A KR1020187034660 A KR 1020187034660A KR 20187034660 A KR20187034660 A KR 20187034660A KR 101979181 B1 KR101979181 B1 KR 101979181B1
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- 239000000758 substrate Substances 0.000 claims abstract description 132
- 239000007788 liquid Substances 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims description 180
- 238000000034 method Methods 0.000 claims description 95
- 230000008021 deposition Effects 0.000 claims description 29
- 239000011159 matrix material Substances 0.000 claims description 4
- 230000005012 migration Effects 0.000 claims description 2
- 238000013508 migration Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 52
- 238000007641 inkjet printing Methods 0.000 abstract description 47
- 239000010410 layer Substances 0.000 description 594
- 238000000151 deposition Methods 0.000 description 50
- 238000012876 topography Methods 0.000 description 48
- 239000000976 ink Substances 0.000 description 42
- 230000005855 radiation Effects 0.000 description 39
- 239000004020 conductor Substances 0.000 description 38
- 239000010408 film Substances 0.000 description 34
- 230000008569 process Effects 0.000 description 31
- 238000000576 coating method Methods 0.000 description 28
- 238000001035 drying Methods 0.000 description 28
- 239000011248 coating agent Substances 0.000 description 23
- 230000015572 biosynthetic process Effects 0.000 description 20
- 230000000903 blocking effect Effects 0.000 description 20
- 238000007639 printing Methods 0.000 description 20
- 238000002347 injection Methods 0.000 description 19
- 239000007924 injection Substances 0.000 description 19
- 239000012530 fluid Substances 0.000 description 18
- 230000000670 limiting effect Effects 0.000 description 17
- 230000036961 partial effect Effects 0.000 description 16
- 238000011068 loading method Methods 0.000 description 15
- 238000002207 thermal evaporation Methods 0.000 description 15
- 230000002829 reductive effect Effects 0.000 description 14
- 239000003086 colorant Substances 0.000 description 11
- 230000000875 corresponding effect Effects 0.000 description 11
- 230000000694 effects Effects 0.000 description 11
- 230000000873 masking effect Effects 0.000 description 11
- 229910052751 metal Inorganic materials 0.000 description 11
- 239000002184 metal Substances 0.000 description 11
- 238000000059 patterning Methods 0.000 description 11
- 229920002120 photoresistant polymer Polymers 0.000 description 11
- 238000004020 luminiscence type Methods 0.000 description 10
- 239000000203 mixture Substances 0.000 description 10
- 238000011161 development Methods 0.000 description 9
- 230000018109 developmental process Effects 0.000 description 9
- 230000005525 hole transport Effects 0.000 description 9
- 230000006872 improvement Effects 0.000 description 9
- 238000004544 sputter deposition Methods 0.000 description 9
- 239000011149 active material Substances 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 7
- 238000001312 dry etching Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 7
- 239000012044 organic layer Substances 0.000 description 7
- 238000005240 physical vapour deposition Methods 0.000 description 7
- 238000004528 spin coating Methods 0.000 description 7
- 238000001039 wet etching Methods 0.000 description 7
- 238000003491 array Methods 0.000 description 6
- 230000008859 change Effects 0.000 description 6
- 238000012986 modification Methods 0.000 description 6
- 230000004048 modification Effects 0.000 description 6
- 238000000206 photolithography Methods 0.000 description 6
- 239000011540 sensing material Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 206010073306 Exposure to radiation Diseases 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 5
- -1 biimidazole Chemical compound 0.000 description 5
- 238000005229 chemical vapour deposition Methods 0.000 description 5
- URQUNWYOBNUYJQ-UHFFFAOYSA-N diazonaphthoquinone Chemical compound C1=CC=C2C(=O)C(=[N]=[N])C=CC2=C1 URQUNWYOBNUYJQ-UHFFFAOYSA-N 0.000 description 5
- 230000009467 reduction Effects 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 239000010409 thin film Substances 0.000 description 5
- 239000002253 acid Substances 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 229910044991 metal oxide Inorganic materials 0.000 description 4
- 150000004706 metal oxides Chemical class 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 239000004926 polymethyl methacrylate Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 150000003254 radicals Chemical class 0.000 description 4
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- 230000002596 correlated effect Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 229920001568 phenolic resin Polymers 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 238000005507 spraying Methods 0.000 description 3
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- 125000001637 1-naphthyl group Chemical group [H]C1=C([H])C([H])=C2C(*)=C([H])C([H])=C([H])C2=C1[H] 0.000 description 2
- GKWLILHTTGWKLQ-UHFFFAOYSA-N 2,3-dihydrothieno[3,4-b][1,4]dioxine Chemical compound O1CCOC2=CSC=C21 GKWLILHTTGWKLQ-UHFFFAOYSA-N 0.000 description 2
- DKCRDQKHMMPWPG-UHFFFAOYSA-N 3-methylpiperidine-2,6-dione Chemical compound CC1CCC(=O)NC1=O DKCRDQKHMMPWPG-UHFFFAOYSA-N 0.000 description 2
- 229920001621 AMOLED Polymers 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 229920000144 PEDOT:PSS Polymers 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000002800 charge carrier Substances 0.000 description 2
- 230000021615 conjugation Effects 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 239000007888 film coating Substances 0.000 description 2
- 238000009501 film coating Methods 0.000 description 2
- 125000003709 fluoroalkyl group Chemical group 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000012447 hatching Effects 0.000 description 2
- 230000002209 hydrophobic effect Effects 0.000 description 2
- NLHUEOQYIDKBSL-UHFFFAOYSA-N indium;manganese;oxotin Chemical compound [Mn].[In].[Sn]=O NLHUEOQYIDKBSL-UHFFFAOYSA-N 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 150000002734 metacrylic acid derivatives Chemical class 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 238000010943 off-gassing Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920001467 poly(styrenesulfonates) Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 230000003595 spectral effect Effects 0.000 description 2
- 238000000859 sublimation Methods 0.000 description 2
- 230000008022 sublimation Effects 0.000 description 2
- GHAKYKGFKFZYSJ-UHFFFAOYSA-N sulfonylmethanone Chemical compound O=C=S(=O)=O GHAKYKGFKFZYSJ-UHFFFAOYSA-N 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 1
- VNQXSTWCDUXYEZ-UHFFFAOYSA-N 1,7,7-trimethylbicyclo[2.2.1]heptane-2,3-dione Chemical compound C1CC2(C)C(=O)C(=O)C1C2(C)C VNQXSTWCDUXYEZ-UHFFFAOYSA-N 0.000 description 1
- NLGDWWCZQDIASO-UHFFFAOYSA-N 2-hydroxy-1-(7-oxabicyclo[4.1.0]hepta-1,3,5-trien-2-yl)-2-phenylethanone Chemical compound OC(C(=O)c1cccc2Oc12)c1ccccc1 NLGDWWCZQDIASO-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- HHAZUISNXJLXHR-UHFFFAOYSA-N 2-morpholin-4-ylbenzamide Chemical compound NC(=O)C1=CC=CC=C1N1CCOCC1 HHAZUISNXJLXHR-UHFFFAOYSA-N 0.000 description 1
- CDSULTPOCMWJCM-UHFFFAOYSA-N 4h-chromene-2,3-dione Chemical compound C1=CC=C2OC(=O)C(=O)CC2=C1 CDSULTPOCMWJCM-UHFFFAOYSA-N 0.000 description 1
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 1
- 238000012935 Averaging Methods 0.000 description 1
- POUXCZFBIBTXOL-UHFFFAOYSA-N C=CC(=O)C(=O)C(=O)C=C Chemical compound C=CC(=O)C(=O)C(=O)C=C POUXCZFBIBTXOL-UHFFFAOYSA-N 0.000 description 1
- LYDODUOPDJULET-UHFFFAOYSA-N CC1=C(C(=C(C(=O)[PH2]=O)C=C1)C)C Chemical class CC1=C(C(=C(C(=O)[PH2]=O)C=C1)C)C LYDODUOPDJULET-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- BEMYGMNGZLBNNB-UHFFFAOYSA-N bis(2-methyl-2-thiophen-2-ylmorpholin-4-yl)methanone Chemical compound C1COC(C)(C=2SC=CC=2)CN1C(=O)N(C1)CCOC1(C)C1=CC=CS1 BEMYGMNGZLBNNB-UHFFFAOYSA-N 0.000 description 1
- 229930006711 bornane-2,3-dione Natural products 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 238000011278 co-treatment Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 239000012769 display material Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical class I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- GZUCQIMKDHLSEH-UHFFFAOYSA-N manganese silver Chemical compound [Mn][Ag][Ag] GZUCQIMKDHLSEH-UHFFFAOYSA-N 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920001470 polyketone Polymers 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 230000000284 resting effect Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000012776 robust process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 231100000489 sensitizer Toxicity 0.000 description 1
- 239000010802 sludge Substances 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium Chemical compound [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000002230 thermal chemical vapour deposition Methods 0.000 description 1
- 238000012719 thermal polymerization Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/17—Carrier injection layers
-
- H01L51/56—
-
- H01L27/3211—
-
- H01L27/3216—
-
- H01L27/3218—
-
- H01L27/3246—
-
- H01L51/0005—
-
- H01L51/5088—
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
- H10K59/352—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels the areas of the RGB subpixels being different
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/30—Devices specially adapted for multicolour light emission
- H10K59/35—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels
- H10K59/353—Devices specially adapted for multicolour light emission comprising red-green-blue [RGB] subpixels characterised by the geometrical arrangement of the RGB subpixels
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
- H10K71/135—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing using ink-jet printing
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
-
- H01L2227/32—
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- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201361753713P | 2013-01-17 | 2013-01-17 | |
US201361753692P | 2013-01-17 | 2013-01-17 | |
US61/753,692 | 2013-01-17 | ||
US61/753,713 | 2013-01-17 | ||
US14/030,776 | 2013-09-18 | ||
US14/030,776 US9614191B2 (en) | 2013-01-17 | 2013-09-18 | High resolution organic light-emitting diode devices, displays, and related methods |
PCT/US2014/011723 WO2014113497A1 (en) | 2013-01-17 | 2014-01-15 | High resolution organic light-emitting diode devices |
Related Parent Applications (1)
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---|---|---|---|
KR1020157021869A Division KR101926225B1 (ko) | 2013-01-17 | 2014-01-15 | 고해상도 유기 발광 다이오드 장치 |
Related Child Applications (1)
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---|---|---|---|
KR1020197013404A Division KR102095174B1 (ko) | 2013-01-17 | 2014-01-15 | 고해상도 유기 발광 다이오드 장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20180130015A KR20180130015A (ko) | 2018-12-05 |
KR101979181B1 true KR101979181B1 (ko) | 2019-05-15 |
Family
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Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
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KR1020187034660A KR101979181B1 (ko) | 2013-01-17 | 2014-01-15 | 고해상도 유기 발광 다이오드 장치 |
KR1020157021869A KR101926225B1 (ko) | 2013-01-17 | 2014-01-15 | 고해상도 유기 발광 다이오드 장치 |
KR1020197013404A KR102095174B1 (ko) | 2013-01-17 | 2014-01-15 | 고해상도 유기 발광 다이오드 장치 |
Family Applications After (2)
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---|---|---|---|
KR1020157021869A KR101926225B1 (ko) | 2013-01-17 | 2014-01-15 | 고해상도 유기 발광 다이오드 장치 |
KR1020197013404A KR102095174B1 (ko) | 2013-01-17 | 2014-01-15 | 고해상도 유기 발광 다이오드 장치 |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP2946423A4 (ja) |
JP (3) | JP6494525B2 (ja) |
KR (3) | KR101979181B1 (ja) |
CN (2) | CN110120469A (ja) |
WO (1) | WO2014113497A1 (ja) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111497448B (zh) * | 2015-12-07 | 2022-07-26 | 科迪华公司 | 用于以改进的均匀性和打印速度制造薄膜的技术 |
JP6727844B2 (ja) * | 2016-02-25 | 2020-07-22 | 株式会社ジャパンディスプレイ | 表示装置 |
CN106207012B (zh) * | 2016-08-15 | 2018-07-06 | 京东方科技集团股份有限公司 | 像素打印结构及其制作方法、显示装置和喷墨打印方法 |
JP2018049805A (ja) * | 2016-09-23 | 2018-03-29 | 東京エレクトロン株式会社 | 塗布装置、塗布方法、および有機elディスプレイ |
CN106564315B (zh) | 2016-10-21 | 2018-11-09 | 纳晶科技股份有限公司 | 涂布方法、涂布设备及发光器件 |
CN207320118U (zh) | 2017-08-31 | 2018-05-04 | 昆山国显光电有限公司 | 像素结构、掩膜版及显示装置 |
KR20190072108A (ko) * | 2017-12-15 | 2019-06-25 | 조율호 | 피라미드 서브 픽셀 배열 구조를 갖는 표시 장치 |
CN108987431B (zh) * | 2017-12-21 | 2021-07-20 | 广东聚华印刷显示技术有限公司 | 像素结构及其制作方法 |
US10985226B2 (en) | 2018-01-09 | 2021-04-20 | Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Ink jet printing organic light emitting diode display panel and manufacturing method thereof |
CN108336110A (zh) * | 2018-01-09 | 2018-07-27 | 深圳市华星光电半导体显示技术有限公司 | 一种喷墨打印的oled显示面板及其制备方法 |
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Also Published As
Publication number | Publication date |
---|---|
EP2946423A4 (en) | 2016-11-30 |
CN105051932B (zh) | 2019-03-05 |
JP2016507131A (ja) | 2016-03-07 |
EP2946423A1 (en) | 2015-11-25 |
JP6564478B2 (ja) | 2019-08-21 |
KR101926225B1 (ko) | 2018-12-06 |
KR20180130015A (ko) | 2018-12-05 |
JP2019145523A (ja) | 2019-08-29 |
KR20150116857A (ko) | 2015-10-16 |
KR102095174B1 (ko) | 2020-03-30 |
JP6494525B2 (ja) | 2019-04-03 |
CN110120469A (zh) | 2019-08-13 |
WO2014113497A1 (en) | 2014-07-24 |
KR20190053295A (ko) | 2019-05-17 |
CN105051932A (zh) | 2015-11-11 |
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