KR101973823B1 - 이방성 도전 접속 재료, 필름 적층체, 접속 방법 및 접속 구조체 - Google Patents

이방성 도전 접속 재료, 필름 적층체, 접속 방법 및 접속 구조체 Download PDF

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Publication number
KR101973823B1
KR101973823B1 KR1020137032613A KR20137032613A KR101973823B1 KR 101973823 B1 KR101973823 B1 KR 101973823B1 KR 1020137032613 A KR1020137032613 A KR 1020137032613A KR 20137032613 A KR20137032613 A KR 20137032613A KR 101973823 B1 KR101973823 B1 KR 101973823B1
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KR
South Korea
Prior art keywords
anisotropic conductive
adhesive
terminal
film
electronic component
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KR1020137032613A
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English (en)
Korean (ko)
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KR20140035391A (ko
Inventor
야스시 아쿠츠
Original Assignee
데쿠세리아루즈 가부시키가이샤
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Publication of KR20140035391A publication Critical patent/KR20140035391A/ko
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Publication of KR101973823B1 publication Critical patent/KR101973823B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)
  • Conductive Materials (AREA)
  • Laminated Bodies (AREA)
  • Wire Bonding (AREA)
KR1020137032613A 2011-05-12 2012-05-11 이방성 도전 접속 재료, 필름 적층체, 접속 방법 및 접속 구조체 KR101973823B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2011-107457 2011-05-12
JP2011107457A JP5816456B2 (ja) 2011-05-12 2011-05-12 異方性導電接続材料、フィルム積層体、接続方法及び接続構造体
PCT/JP2012/062194 WO2012153849A1 (ja) 2011-05-12 2012-05-11 異方性導電接続材料、フィルム積層体、接続方法及び接続構造体

Publications (2)

Publication Number Publication Date
KR20140035391A KR20140035391A (ko) 2014-03-21
KR101973823B1 true KR101973823B1 (ko) 2019-04-29

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137032613A KR101973823B1 (ko) 2011-05-12 2012-05-11 이방성 도전 접속 재료, 필름 적층체, 접속 방법 및 접속 구조체

Country Status (6)

Country Link
JP (1) JP5816456B2 (zh)
KR (1) KR101973823B1 (zh)
CN (1) CN103502379B (zh)
HK (1) HK1189389A1 (zh)
TW (1) TWI539470B (zh)
WO (1) WO2012153849A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102413690B1 (ko) * 2014-02-04 2022-06-27 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름 및 그의 제조 방법
JP6608147B2 (ja) * 2015-02-23 2019-11-20 デクセリアルズ株式会社 多層接着フィルム、および接続構造体
JP7305957B2 (ja) * 2016-10-03 2023-07-11 株式会社レゾナック 導電性フィルム、巻回体、接続構造体、及び接続構造体の製造方法
CN106371250A (zh) * 2016-10-21 2017-02-01 芜湖赋兴光电有限公司 一种acf胶热压工艺

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4736280B2 (ja) * 2001-08-30 2011-07-27 日立化成工業株式会社 回路接続用接着剤及びそれを用いた回路接続構造体
JP2003313533A (ja) * 2002-04-23 2003-11-06 Sumitomo Bakelite Co Ltd 異方導電性接着剤
KR101039978B1 (ko) * 2004-06-09 2011-06-13 히다치 가세고교 가부시끼가이샤 접착제 조성물, 회로접속재료, 회로부재의 접속구조 및 반도체 장치
JP4381967B2 (ja) * 2004-12-07 2009-12-09 電気化学工業株式会社 接着剤組成物とそれを用いた接合体、接着剤組成物の製造方法
KR101035810B1 (ko) * 2005-10-18 2011-05-20 히다치 가세고교 가부시끼가이샤 접착제 조성물, 회로 접속 재료, 회로 접속 부재의 접속구조 및 반도체 장치
JP5000695B2 (ja) 2009-09-01 2012-08-15 日立化成工業株式会社 回路板装置の製造法

Also Published As

Publication number Publication date
JP2011204685A (ja) 2011-10-13
CN103502379A (zh) 2014-01-08
JP5816456B2 (ja) 2015-11-18
CN103502379B (zh) 2016-02-10
KR20140035391A (ko) 2014-03-21
WO2012153849A1 (ja) 2012-11-15
TWI539470B (zh) 2016-06-21
TW201301300A (zh) 2013-01-01
HK1189389A1 (zh) 2014-06-06

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