KR101966566B1 - 열 처리 챔버를 위한 지지 실린더 - Google Patents

열 처리 챔버를 위한 지지 실린더 Download PDF

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Publication number
KR101966566B1
KR101966566B1 KR1020177005570A KR20177005570A KR101966566B1 KR 101966566 B1 KR101966566 B1 KR 101966566B1 KR 1020177005570 A KR1020177005570 A KR 1020177005570A KR 20177005570 A KR20177005570 A KR 20177005570A KR 101966566 B1 KR101966566 B1 KR 101966566B1
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South Korea
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peripheral surface
support cylinder
inner peripheral
substrate
outer peripheral
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Korean (ko)
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KR20170026647A (ko
Inventor
메란 베드자트
아론 무어 헌터
조셉 엠. 라니쉬
노만 엘. 탐
제프리 토빈
지핑 리
마틴 트란
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어플라이드 머티어리얼스, 인코포레이티드
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67115—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Mechanical Engineering (AREA)
KR1020177005570A 2013-08-15 2014-06-12 열 처리 챔버를 위한 지지 실린더 Active KR101966566B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201361866379P 2013-08-15 2013-08-15
US61/866,379 2013-08-15
US14/298,389 US9385004B2 (en) 2013-08-15 2014-06-06 Support cylinder for thermal processing chamber
US14/298,389 2014-06-06
PCT/US2014/042025 WO2015023352A1 (en) 2013-08-15 2014-06-12 Support cylinder for thermal processing chamber

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020167006801A Division KR101713078B1 (ko) 2013-08-15 2014-06-12 열 처리 챔버를 위한 지지 실린더

Publications (2)

Publication Number Publication Date
KR20170026647A KR20170026647A (ko) 2017-03-08
KR101966566B1 true KR101966566B1 (ko) 2019-04-05

Family

ID=52467142

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020177005570A Active KR101966566B1 (ko) 2013-08-15 2014-06-12 열 처리 챔버를 위한 지지 실린더
KR1020167006801A Active KR101713078B1 (ko) 2013-08-15 2014-06-12 열 처리 챔버를 위한 지지 실린더

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020167006801A Active KR101713078B1 (ko) 2013-08-15 2014-06-12 열 처리 챔버를 위한 지지 실린더

Country Status (6)

Country Link
US (3) US9385004B2 (enExample)
JP (2) JP6453882B2 (enExample)
KR (2) KR101966566B1 (enExample)
CN (3) CN107342253B (enExample)
TW (3) TWI656598B (enExample)
WO (1) WO2015023352A1 (enExample)

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SG11201508512PA (en) * 2013-05-23 2015-12-30 Applied Materials Inc A coated liner assembly for a semiconductor processing chamber
US9385004B2 (en) * 2013-08-15 2016-07-05 Applied Materials, Inc. Support cylinder for thermal processing chamber
US9330955B2 (en) * 2013-12-31 2016-05-03 Applied Materials, Inc. Support ring with masked edge
CN108352297B (zh) * 2015-12-07 2023-04-28 应用材料公司 合并式盖环
TWI776859B (zh) * 2017-03-06 2022-09-11 美商應用材料股份有限公司 旋轉器蓋
US11004704B2 (en) 2017-03-17 2021-05-11 Applied Materials, Inc. Finned rotor cover
CN110071064A (zh) * 2018-01-22 2019-07-30 上海新昇半导体科技有限公司 一种改善外延片污染印记的方法
CN111819679A (zh) * 2018-03-13 2020-10-23 应用材料公司 具有等离子体喷涂涂层的支撑环
CN109148353A (zh) * 2018-08-15 2019-01-04 深圳市华星光电技术有限公司 一种基板承托盘
JP7178823B2 (ja) * 2018-08-17 2022-11-28 東京応化工業株式会社 基板加熱装置および基板処理システム
DE102019104433A1 (de) * 2019-02-21 2020-08-27 Aixtron Se CVD-Reaktor mit Mitteln zur lokalen Beeinflussung der Suszeptortemperatur
JP7461214B2 (ja) * 2020-05-19 2024-04-03 株式会社Ｓｃｒｅｅｎホールディングス 熱処理装置
KR102787323B1 (ko) 2020-09-24 2025-03-27 삼성전자주식회사 플라즈마 처리 장치 및 플라즈마 처리 방법
US20240247404A1 (en) * 2023-01-25 2024-07-25 Applied Materials, Inc. Pre-heat rings and processing chambers including black quartz, and related methods

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US960555A (en) * 1906-02-08 1910-06-07 Joseph Johnson Basket.
US5960555A (en) 1996-07-24 1999-10-05 Applied Materials, Inc. Method and apparatus for purging the back side of a substrate during chemical vapor processing
US6395363B1 (en) * 1996-11-05 2002-05-28 Applied Materials, Inc. Sloped substrate support
US6133152A (en) 1997-05-16 2000-10-17 Applied Materials, Inc. Co-rotating edge ring extension for use in a semiconductor processing chamber
US6200388B1 (en) 1998-02-11 2001-03-13 Applied Materials, Inc. Substrate support for a thermal processing chamber
US6048403A (en) 1998-04-01 2000-04-11 Applied Materials, Inc. Multi-ledge substrate support for a thermal processing chamber
JP2000256037A (ja) * 1999-03-05 2000-09-19 Tosoh Corp 透明部を有する黒色石英ガラス及びその製造方法
JP4969732B2 (ja) * 2001-03-14 2012-07-04 東京エレクトロン株式会社 加熱装置、熱処理装置及びランプ冷却方法
KR100913116B1 (ko) 2002-04-04 2009-08-19 토소가부시키가이샤 석영유리 용사부품 및 그 제조방법
US7704327B2 (en) * 2002-09-30 2010-04-27 Applied Materials, Inc. High temperature anneal with improved substrate support
US7241345B2 (en) 2003-06-16 2007-07-10 Applied Materials, Inc. Cylinder for thermal processing chamber
JP4348542B2 (ja) 2004-08-24 2009-10-21 信越半導体株式会社 石英治具及び半導体製造装置
JP2007042844A (ja) * 2005-08-03 2007-02-15 Furukawa Co Ltd 気相成長装置及びサセプタ
WO2008069194A1 (ja) 2006-12-05 2008-06-12 Shin-Etsu Quartz Products Co., Ltd. 合成不透明石英ガラス及びその製造方法
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JP5048445B2 (ja) * 2007-10-11 2012-10-17 信越石英株式会社 透明層付き黒色合成石英ガラス
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JP5583082B2 (ja) * 2011-06-21 2014-09-03 信越石英株式会社 透明層付き黒色合成石英ガラスの製造方法
US9385004B2 (en) * 2013-08-15 2016-07-05 Applied Materials, Inc. Support cylinder for thermal processing chamber

Also Published As

Publication number Publication date
US20150050819A1 (en) 2015-02-19
CN105453248A (zh) 2016-03-30
TWI604559B (zh) 2017-11-01
CN107342253B (zh) 2021-12-28
TW201507056A (zh) 2015-02-16
WO2015023352A1 (en) 2015-02-19
JP2019071439A (ja) 2019-05-09
CN107731718B (zh) 2022-05-17
CN107731718A (zh) 2018-02-23
TWI656598B (zh) 2019-04-11
TWI688040B (zh) 2020-03-11
KR20160044002A (ko) 2016-04-22
JP6688865B2 (ja) 2020-04-28
TW201816932A (zh) 2018-05-01
TW201931516A (zh) 2019-08-01
JP2016534558A (ja) 2016-11-04
US10128144B2 (en) 2018-11-13
US20160300752A1 (en) 2016-10-13
CN107342253A (zh) 2017-11-10
US9659809B2 (en) 2017-05-23
KR101713078B1 (ko) 2017-03-09
JP6453882B2 (ja) 2019-01-16
KR20170026647A (ko) 2017-03-08
US9385004B2 (en) 2016-07-05
CN105453248B (zh) 2019-12-10
US20170263493A1 (en) 2017-09-14

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