KR101942602B1 - 도전성 입자, 도전 재료 및 접속 구조체 - Google Patents

도전성 입자, 도전 재료 및 접속 구조체 Download PDF

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Publication number
KR101942602B1
KR101942602B1 KR1020137029906A KR20137029906A KR101942602B1 KR 101942602 B1 KR101942602 B1 KR 101942602B1 KR 1020137029906 A KR1020137029906 A KR 1020137029906A KR 20137029906 A KR20137029906 A KR 20137029906A KR 101942602 B1 KR101942602 B1 KR 101942602B1
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KR
South Korea
Prior art keywords
particles
conductive layer
conductive
core material
base
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KR1020137029906A
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English (en)
Korean (ko)
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KR20140106384A (ko
Inventor
게이조 니시오까
Original Assignee
세키스이가가쿠 고교가부시키가이샤
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Publication of KR20140106384A publication Critical patent/KR20140106384A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/18—Non-metallic particles coated with metal
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/52—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1662—Use of incorporated material in the solution or dispersion, e.g. particles, whiskers, wires
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Chemically Coating (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Powder Metallurgy (AREA)
KR1020137029906A 2011-12-21 2012-12-19 도전성 입자, 도전 재료 및 접속 구조체 KR101942602B1 (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2011280083 2011-12-21
JPJP-P-2011-280083 2011-12-21
JP2011280084 2011-12-21
JPJP-P-2011-280082 2011-12-21
JPJP-P-2011-280084 2011-12-21
JP2011280082 2011-12-21
PCT/JP2012/082910 WO2013094636A1 (ja) 2011-12-21 2012-12-19 導電性粒子、導電材料及び接続構造体

Publications (2)

Publication Number Publication Date
KR20140106384A KR20140106384A (ko) 2014-09-03
KR101942602B1 true KR101942602B1 (ko) 2019-01-25

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KR1020137029906A KR101942602B1 (ko) 2011-12-21 2012-12-19 도전성 입자, 도전 재료 및 접속 구조체

Country Status (5)

Country Link
JP (2) JP6049461B2 (zh)
KR (1) KR101942602B1 (zh)
CN (2) CN103748636A (zh)
TW (1) TWI615858B (zh)
WO (1) WO2013094636A1 (zh)

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* Cited by examiner, † Cited by third party
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JP6470518B2 (ja) * 2013-07-16 2019-02-13 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6352103B2 (ja) * 2013-08-12 2018-07-04 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6355474B2 (ja) * 2013-08-12 2018-07-11 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6453032B2 (ja) * 2013-10-21 2019-01-16 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6445833B2 (ja) * 2013-10-21 2018-12-26 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6345075B2 (ja) * 2013-10-23 2018-06-20 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP6739894B2 (ja) * 2013-11-18 2020-08-12 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
JP2015195178A (ja) * 2014-03-26 2015-11-05 デクセリアルズ株式会社 導電性粒子、導電性接着剤、接続体の製造方法、電子部品の接続方法、及び接続体
JP6340876B2 (ja) * 2014-03-31 2018-06-13 日立化成株式会社 導電粒子
JP6684052B2 (ja) * 2014-06-11 2020-04-22 積水化学工業株式会社 導電性粒子、導電性粒子の製造方法、導電材料及び接続構造体
JP6379761B2 (ja) * 2014-07-09 2018-08-29 日立化成株式会社 導電粒子、絶縁被覆導電粒子、異方導電性接着剤、接続構造体及び導電粒子の製造方法
JP6507551B2 (ja) * 2014-10-03 2019-05-08 日立化成株式会社 導電粒子
CN106605273A (zh) * 2014-10-22 2017-04-26 积水化学工业株式会社 导电性粒子、导电材料及连接结构体
JP2016089153A (ja) * 2014-10-29 2016-05-23 デクセリアルズ株式会社 導電材料
TWI740807B (zh) * 2014-10-29 2021-10-01 日商迪睿合股份有限公司 導電材料、連接構造體、及連接構造體之製造方法
CN111508635B (zh) * 2016-02-08 2021-12-28 积水化学工业株式会社 导电性粒子、导电材料及连接结构体
CN108701508B (zh) * 2016-02-10 2020-03-24 日立化成株式会社 导电粒子、绝缘被覆导电粒子、各向异性导电性粘接剂、连接结构体和导电粒子的制造方法
CN114951647A (zh) * 2022-05-31 2022-08-30 安徽安坤新材科技有限公司 一种铜铝复合材料的制备方法

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JP2010027569A (ja) * 2008-07-24 2010-02-04 Sony Chemical & Information Device Corp 導電性粒子、異方性導電フィルム、及び接合体、並びに、接続方法
JP2011204531A (ja) * 2010-03-26 2011-10-13 Sekisui Chem Co Ltd 導電性粒子、導電性粒子の製造方法、異方性導電材料及び接続構造体

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JP3696429B2 (ja) 1999-02-22 2005-09-21 日本化学工業株式会社 導電性無電解めっき粉体とその製造方法並びに該めっき粉体からなる導電性材料
CN100437838C (zh) * 2003-07-07 2008-11-26 积水化学工业株式会社 包覆导电性粒子、各向异性导电材料以及导电连接结构体
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JP4563110B2 (ja) * 2004-08-20 2010-10-13 積水化学工業株式会社 導電性微粒子の製造方法
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JP5589361B2 (ja) 2009-11-16 2014-09-17 日立化成株式会社 導電粒子及びその製造方法
CN102272863B (zh) * 2010-03-17 2013-09-04 积水化学工业株式会社 导电性粒子、导电性粒子的制造方法、各向异性导电材料及连接结构体
JP5476210B2 (ja) * 2010-05-19 2014-04-23 積水化学工業株式会社 導電性粒子、異方性導電材料及び接続構造体
JP5940760B2 (ja) * 2010-05-19 2016-06-29 積水化学工業株式会社 導電性粒子、異方性導電材料及び接続構造体

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Publication number Priority date Publication date Assignee Title
JP2010027569A (ja) * 2008-07-24 2010-02-04 Sony Chemical & Information Device Corp 導電性粒子、異方性導電フィルム、及び接合体、並びに、接続方法
CN102089832A (zh) 2008-07-24 2011-06-08 索尼化学&信息部件株式会社 导电性粒子、各向异性导电膜、接合体以及连接方法
JP2011204531A (ja) * 2010-03-26 2011-10-13 Sekisui Chem Co Ltd 導電性粒子、導電性粒子の製造方法、異方性導電材料及び接続構造体

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Publication number Publication date
CN108806824A (zh) 2018-11-13
KR20140106384A (ko) 2014-09-03
CN108806824B (zh) 2023-07-25
JPWO2013094636A1 (ja) 2015-04-27
TWI615858B (zh) 2018-02-21
CN103748636A (zh) 2014-04-23
WO2013094636A1 (ja) 2013-06-27
TW201333980A (zh) 2013-08-16
JP6049461B2 (ja) 2016-12-21
JP6247371B2 (ja) 2017-12-13
JP2017084794A (ja) 2017-05-18

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