KR101939129B1 - 에피택셜 실리콘 웨이퍼의 제조 방법 - Google Patents

에피택셜 실리콘 웨이퍼의 제조 방법 Download PDF

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KR101939129B1
KR101939129B1 KR1020177000133A KR20177000133A KR101939129B1 KR 101939129 B1 KR101939129 B1 KR 101939129B1 KR 1020177000133 A KR1020177000133 A KR 1020177000133A KR 20177000133 A KR20177000133 A KR 20177000133A KR 101939129 B1 KR101939129 B1 KR 101939129B1
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heat treatment
silicon wafer
atoms
wafer
epitaxial
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Korean (ko)
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KR20170013984A (ko
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준 후지세
토시아키 오노
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가부시키가이샤 사무코
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H01L21/20—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P36/00—Gettering within semiconductor bodies
    • H10P36/03—Gettering within semiconductor bodies within silicon bodies
    • H01L21/322—
    • H01L21/324—
    • H01L21/67098—
    • H01L21/67248—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/50—Physical imperfections
    • H10D62/53—Physical imperfections the imperfections being within the semiconductor body 
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P36/00—Gettering within semiconductor bodies
    • H10P36/20—Intrinsic gettering, i.e. thermally inducing defects by using oxygen present in the silicon body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/90—Thermal treatments, e.g. annealing or sintering
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C30B15/20—Controlling or regulating
    • C30B15/203—Controlling or regulating the relationship of pull rate (v) to axial thermal gradient (G)
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
    • C30B33/02—Heat treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P36/00—Gettering within semiconductor bodies

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  • Crystals, And After-Treatments Of Crystals (AREA)
  • Recrystallisation Techniques (AREA)
KR1020177000133A 2014-07-09 2015-04-21 에피택셜 실리콘 웨이퍼의 제조 방법 Active KR101939129B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2014-141551 2014-07-09
JP2014141551A JP6241381B2 (ja) 2014-07-09 2014-07-09 エピタキシャルシリコンウェーハの製造方法
PCT/JP2015/002157 WO2016006145A1 (ja) 2014-07-09 2015-04-21 エピタキシャルシリコンウェーハおよびその製造方法

Publications (2)

Publication Number Publication Date
KR20170013984A KR20170013984A (ko) 2017-02-07
KR101939129B1 true KR101939129B1 (ko) 2019-01-16

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KR1020177000133A Active KR101939129B1 (ko) 2014-07-09 2015-04-21 에피택셜 실리콘 웨이퍼의 제조 방법

Country Status (5)

Country Link
US (1) US10192754B2 (https=)
JP (1) JP6241381B2 (https=)
KR (1) KR101939129B1 (https=)
CN (1) CN106663628B (https=)
WO (1) WO2016006145A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108505114B (zh) * 2017-02-28 2021-03-05 胜高股份有限公司 外延生长晶圆及其制造方法
KR102798350B1 (ko) 2019-01-30 2025-04-23 삼성전자주식회사 에피택셜 웨이퍼 및 그의 제조 방법
JP6867718B1 (ja) * 2020-02-20 2021-05-12 Ｅａｇｌｙｓ株式会社 情報処理システム、情報処理装置、情報処理方法、および、情報処理プログラム
CN114937595B (zh) * 2022-04-29 2025-07-25 郑州合晶硅材料有限公司 一种改善外延片面内电阻率均匀性的方法
TWI828442B (zh) * 2022-11-25 2024-01-01 日商Ｓｕｍｃｏ股份有限公司 磊晶晶圓

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011243923A (ja) * 2010-05-21 2011-12-01 Sumco Corp シリコンウェーハの製造方法
KR101102336B1 (ko) 2009-05-15 2012-01-03 가부시키가이샤 사무코 실리콘 웨이퍼 및 그 제조 방법

Family Cites Families (12)

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Publication number Priority date Publication date Assignee Title
US5994761A (en) 1997-02-26 1999-11-30 Memc Electronic Materials Spa Ideal oxygen precipitating silicon wafers and oxygen out-diffusion-less process therefor
EP1983562A2 (en) 2001-07-10 2008-10-22 Shin-Etsu Handotai Company Limited Silicon wafer manufacturing method
JP4682508B2 (ja) * 2003-11-14 2011-05-11 信越半導体株式会社 シリコンエピタキシャルウェーハの製造方法
JP2006054350A (ja) * 2004-08-12 2006-02-23 Komatsu Electronic Metals Co Ltd 窒素ドープシリコンウェーハとその製造方法
KR20100036155A (ko) * 2008-09-29 2010-04-07 매그나칩 반도체 유한회사 실리콘 웨이퍼 및 그의 제조방법
US7977216B2 (en) 2008-09-29 2011-07-12 Magnachip Semiconductor, Ltd. Silicon wafer and fabrication method thereof
JP5163459B2 (ja) * 2008-12-05 2013-03-13 株式会社Ｓｕｍｃｏ シリコン単結晶の育成方法及びシリコンウェーハの検査方法
US8890291B2 (en) 2009-03-25 2014-11-18 Sumco Corporation Silicon wafer and manufacturing method thereof
KR101461531B1 (ko) 2010-02-08 2014-11-13 가부시키가이샤 사무코 실리콘 웨이퍼 및 그 제조 방법, 그리고, 반도체 디바이스의 제조 방법
DE102010034002B4 (de) * 2010-08-11 2013-02-21 Siltronic Ag Siliciumscheibe und Verfahren zu deren Herstellung
JP6458551B2 (ja) 2015-02-25 2019-01-30 株式会社Sumco シリコンウェーハの良否判定方法、該方法を用いたシリコンウェーハの製造方法およびシリコンウェーハ
JP6413952B2 (ja) 2015-06-26 2018-10-31 株式会社Sumco シリコンウェーハの良否判定方法、該方法を用いたシリコンウェーハの製造方法およびシリコンウェーハ

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101102336B1 (ko) 2009-05-15 2012-01-03 가부시키가이샤 사무코 실리콘 웨이퍼 및 그 제조 방법
JP2011243923A (ja) * 2010-05-21 2011-12-01 Sumco Corp シリコンウェーハの製造方法

Also Published As

Publication number Publication date
US10192754B2 (en) 2019-01-29
JP6241381B2 (ja) 2017-12-06
KR20170013984A (ko) 2017-02-07
WO2016006145A1 (ja) 2016-01-14
JP2016018927A (ja) 2016-02-01
CN106663628A (zh) 2017-05-10
CN106663628B (zh) 2019-07-16
US20170076959A1 (en) 2017-03-16

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