KR101934164B1 - 감광성 수지 적층체 - Google Patents
감광성 수지 적층체 Download PDFInfo
- Publication number
- KR101934164B1 KR101934164B1 KR1020160162816A KR20160162816A KR101934164B1 KR 101934164 B1 KR101934164 B1 KR 101934164B1 KR 1020160162816 A KR1020160162816 A KR 1020160162816A KR 20160162816 A KR20160162816 A KR 20160162816A KR 101934164 B1 KR101934164 B1 KR 101934164B1
- Authority
- KR
- South Korea
- Prior art keywords
- photosensitive resin
- resin layer
- layer
- resin laminate
- alkali
- Prior art date
Links
Images
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2053—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser
- G03F7/2055—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using a laser for the production of printing plates; Exposure of liquid photohardening compositions
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/34—Imagewise removal by selective transfer, e.g. peeling away
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Materials For Photolithography (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2016-001382 | 2016-01-06 | ||
JP2016001382A JP2017122818A (ja) | 2016-01-06 | 2016-01-06 | 感光性樹脂積層体 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20170082446A KR20170082446A (ko) | 2017-07-14 |
KR101934164B1 true KR101934164B1 (ko) | 2018-12-31 |
Family
ID=59305664
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020160162816A KR101934164B1 (ko) | 2016-01-06 | 2016-12-01 | 감광성 수지 적층체 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2017122818A (ja) |
KR (1) | KR101934164B1 (ja) |
TW (1) | TWI646393B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI780648B (zh) * | 2020-04-03 | 2022-10-11 | 日商旭化成股份有限公司 | 感光性元件、及抗蝕圖案之形成方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007041216A (ja) | 2005-08-02 | 2007-02-15 | Hitachi Chem Co Ltd | 感光性フィルム、感光性フィルムの製造方法及びプリント配線板の製造方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3397231B2 (ja) * | 1997-07-16 | 2003-04-14 | 日立化成工業株式会社 | 感光性エレメント |
JP2008134474A (ja) * | 2006-11-28 | 2008-06-12 | Tokyo Ohka Kogyo Co Ltd | 厚膜用化学増幅型ドライフィルム及び厚膜レジストパターンの製造方法 |
JP2007302003A (ja) * | 2007-06-15 | 2007-11-22 | Mitsui Chemicals Inc | ポリイミド金属箔積層板及びその製造方法 |
JP5799570B2 (ja) * | 2011-05-06 | 2015-10-28 | 日立化成株式会社 | 感光性エレメント、レジストパターンの形成方法及びプリント配線板の製造方法 |
JP2015219336A (ja) * | 2014-05-16 | 2015-12-07 | 旭化成イーマテリアルズ株式会社 | レジスト材料用感光性樹脂組成物及び感光性樹脂積層体 |
CN104834182B (zh) * | 2015-05-20 | 2019-05-03 | 杭州福斯特应用材料股份有限公司 | 一种具有高分辨率和优异掩孔性能的感光干膜 |
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2016
- 2016-01-06 JP JP2016001382A patent/JP2017122818A/ja active Pending
- 2016-11-09 TW TW105136387A patent/TWI646393B/zh active
- 2016-12-01 KR KR1020160162816A patent/KR101934164B1/ko active IP Right Grant
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007041216A (ja) | 2005-08-02 | 2007-02-15 | Hitachi Chem Co Ltd | 感光性フィルム、感光性フィルムの製造方法及びプリント配線板の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20170082446A (ko) | 2017-07-14 |
TW201725449A (zh) | 2017-07-16 |
JP2017122818A (ja) | 2017-07-13 |
TWI646393B (zh) | 2019-01-01 |
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Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant |