KR101932996B1 - 플립 칩 led를 위한 p-n 분리 금속 충진 - Google Patents

플립 칩 led를 위한 p-n 분리 금속 충진 Download PDF

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KR101932996B1
KR101932996B1 KR1020137033889A KR20137033889A KR101932996B1 KR 101932996 B1 KR101932996 B1 KR 101932996B1 KR 1020137033889 A KR1020137033889 A KR 1020137033889A KR 20137033889 A KR20137033889 A KR 20137033889A KR 101932996 B1 KR101932996 B1 KR 101932996B1
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electrode
layer
metal layer
led
flip chip
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KR20140030264A (ko
Inventor
지푸 레이
야준 웨이
알렉산더 에이치. 닉켈
스테파노 스키아피노
다니엘 알렉산더 스테이거월드
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루미리즈 홀딩 비.브이.
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    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
    • H10H20/018—Bonding of wafers
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    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
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    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
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    • H01L24/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
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    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
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    • H10H20/80—Constructional details
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    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
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    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
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    • H01L2224/17515—Bump connectors having different functions
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  • Engineering & Computer Science (AREA)
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  • Led Devices (AREA)
KR1020137033889A 2011-05-24 2012-04-25 플립 칩 led를 위한 p-n 분리 금속 충진 Active KR101932996B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161489280P 2011-05-24 2011-05-24
US61/489,280 2011-05-24
PCT/IB2012/052062 WO2012160455A1 (en) 2011-05-24 2012-04-25 P-n separation metal fill for flip chip leds

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Publication Number Publication Date
KR20140030264A KR20140030264A (ko) 2014-03-11
KR101932996B1 true KR101932996B1 (ko) 2018-12-27

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US (3) US9219209B2 (enExample)
EP (1) EP2715813B1 (enExample)
JP (1) JP5990574B2 (enExample)
KR (1) KR101932996B1 (enExample)
CN (1) CN103548162B (enExample)
BR (1) BR112013029686A2 (enExample)
RU (1) RU2597071C2 (enExample)
TW (1) TWI569469B (enExample)
WO (1) WO2012160455A1 (enExample)

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