KR101923274B1 - 다이 본더 및 본딩 방법 - Google Patents
다이 본더 및 본딩 방법 Download PDFInfo
- Publication number
- KR101923274B1 KR101923274B1 KR1020160153596A KR20160153596A KR101923274B1 KR 101923274 B1 KR101923274 B1 KR 101923274B1 KR 1020160153596 A KR1020160153596 A KR 1020160153596A KR 20160153596 A KR20160153596 A KR 20160153596A KR 101923274 B1 KR101923274 B1 KR 101923274B1
- Authority
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- South Korea
- Prior art keywords
- waveform
- die
- bonding
- recognition
- reproducibility
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims description 21
- 239000000758 substrate Substances 0.000 claims abstract description 40
- 238000003384 imaging method Methods 0.000 claims abstract description 26
- 238000012423 maintenance Methods 0.000 claims abstract description 19
- 238000004092 self-diagnosis Methods 0.000 claims description 44
- 238000012545 processing Methods 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 18
- 238000004519 manufacturing process Methods 0.000 description 13
- 230000002159 abnormal effect Effects 0.000 description 8
- 230000005856 abnormality Effects 0.000 description 5
- 238000003745 diagnosis Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 4
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- 238000005299 abrasion Methods 0.000 description 2
- 230000002238 attenuated effect Effects 0.000 description 2
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- 238000003754 machining Methods 0.000 description 1
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67712—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/03—Manufacturing methods
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/02—Bonding areas ; Manufacturing methods related thereto
- H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Die Bonding (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2016-053169 | 2016-03-17 | ||
JP2016053169A JP6667326B2 (ja) | 2016-03-17 | 2016-03-17 | ダイボンダおよびボンディング方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20170108786A KR20170108786A (ko) | 2017-09-27 |
KR101923274B1 true KR101923274B1 (ko) | 2018-11-28 |
Family
ID=59904684
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020160153596A KR101923274B1 (ko) | 2016-03-17 | 2016-11-17 | 다이 본더 및 본딩 방법 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP6667326B2 (zh) |
KR (1) | KR101923274B1 (zh) |
CN (1) | CN107204302B (zh) |
TW (1) | TWI598968B (zh) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7018341B2 (ja) * | 2018-03-26 | 2022-02-10 | ファスフォードテクノロジ株式会社 | ダイボンディング装置および半導体装置の製造方法 |
US11069555B2 (en) | 2018-09-03 | 2021-07-20 | Assembleon B.V. | Die attach systems, and methods of attaching a die to a substrate |
JP7291586B2 (ja) * | 2019-09-19 | 2023-06-15 | ファスフォードテクノロジ株式会社 | ダイボンディング装置および半導体装置の製造方法 |
KR102377826B1 (ko) * | 2020-03-06 | 2022-03-23 | 세메스 주식회사 | 다이 이송 모듈 및 이를 포함하는 다이 본딩 장치 |
KR102377825B1 (ko) * | 2020-03-06 | 2022-03-23 | 세메스 주식회사 | 다이 이송 모듈 및 이를 포함하는 다이 본딩 장치 |
KR102654727B1 (ko) * | 2021-07-21 | 2024-04-03 | 세메스 주식회사 | 다이 본딩 방법 및 다이 본딩 장치 |
WO2024018937A1 (ja) * | 2022-07-21 | 2024-01-25 | ボンドテック株式会社 | 接合方法および接合装置 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120075079A1 (en) | 2010-09-24 | 2012-03-29 | Hitachi High-Tech Instruments Co., Ltd. | Tool Management Method of Die Bonder and Die Bonder |
JP2012234952A (ja) * | 2011-04-28 | 2012-11-29 | Shibaura Mechatronics Corp | 電子部品の実装装置及び実装方法 |
US20130068823A1 (en) | 2011-09-15 | 2013-03-21 | Hitachi High-Tech Instruments Co., Ltd. | Die Bonder and Bonding Method |
JP2014011287A (ja) * | 2012-06-29 | 2014-01-20 | Ohashi Seisakusho:Kk | 半導体チップの送り装置 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006156550A (ja) * | 2004-11-26 | 2006-06-15 | Tsukuba Seiko Co Ltd | ダイボンディング装置 |
JP5150155B2 (ja) * | 2007-02-23 | 2013-02-20 | 株式会社東芝 | リニアアクチュエータおよびリニアアクチュエータを利用した装置 |
WO2009119193A1 (ja) * | 2008-03-28 | 2009-10-01 | 芝浦メカトロニクス株式会社 | 電子部品の実装装置及び実装方法 |
JP5666246B2 (ja) * | 2010-10-29 | 2015-02-12 | 株式会社日立ハイテクインスツルメンツ | ダイボンダ装置およびダイボンダ方法 |
KR101850738B1 (ko) * | 2011-05-19 | 2018-04-24 | 주식회사 탑 엔지니어링 | 실시간 동작 데이터의 ui화면을 구성하는 다이본더 |
JP5771466B2 (ja) * | 2011-07-12 | 2015-09-02 | ファスフォードテクノロジ株式会社 | ダイボンダ及びダイボンダの接合材供給方法 |
-
2016
- 2016-03-17 JP JP2016053169A patent/JP6667326B2/ja active Active
- 2016-11-04 TW TW105135965A patent/TWI598968B/zh active
- 2016-11-17 KR KR1020160153596A patent/KR101923274B1/ko active IP Right Grant
- 2016-11-18 CN CN201611028983.5A patent/CN107204302B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120075079A1 (en) | 2010-09-24 | 2012-03-29 | Hitachi High-Tech Instruments Co., Ltd. | Tool Management Method of Die Bonder and Die Bonder |
JP2012234952A (ja) * | 2011-04-28 | 2012-11-29 | Shibaura Mechatronics Corp | 電子部品の実装装置及び実装方法 |
US20130068823A1 (en) | 2011-09-15 | 2013-03-21 | Hitachi High-Tech Instruments Co., Ltd. | Die Bonder and Bonding Method |
JP2014011287A (ja) * | 2012-06-29 | 2014-01-20 | Ohashi Seisakusho:Kk | 半導体チップの送り装置 |
Also Published As
Publication number | Publication date |
---|---|
TWI598968B (zh) | 2017-09-11 |
TW201810457A (zh) | 2018-03-16 |
CN107204302A (zh) | 2017-09-26 |
KR20170108786A (ko) | 2017-09-27 |
CN107204302B (zh) | 2020-06-30 |
JP2017168693A (ja) | 2017-09-21 |
JP6667326B2 (ja) | 2020-03-18 |
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