KR101906509B1 - 접합장치 및 접합방법 - Google Patents

접합장치 및 접합방법 Download PDF

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Publication number
KR101906509B1
KR101906509B1 KR1020147014634A KR20147014634A KR101906509B1 KR 101906509 B1 KR101906509 B1 KR 101906509B1 KR 1020147014634 A KR1020147014634 A KR 1020147014634A KR 20147014634 A KR20147014634 A KR 20147014634A KR 101906509 B1 KR101906509 B1 KR 101906509B1
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KR
South Korea
Prior art keywords
original plate
plate
pressure
disk
diameter
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KR1020147014634A
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English (en)
Korean (ko)
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KR20140099463A (ko
Inventor
고사쿠 사이노
미쓰루 다나베
Original Assignee
다즈모 가부시키가이샤
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Publication of KR20140099463A publication Critical patent/KR20140099463A/ko
Application granted granted Critical
Publication of KR101906509B1 publication Critical patent/KR101906509B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020147014634A 2011-12-07 2012-11-28 접합장치 및 접합방법 KR101906509B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011267432 2011-12-07
JPJP-P-2011-267432 2011-12-07
PCT/JP2012/080675 WO2013084761A1 (ja) 2011-12-07 2012-11-28 貼り合せ装置および貼り合せ方法

Publications (2)

Publication Number Publication Date
KR20140099463A KR20140099463A (ko) 2014-08-12
KR101906509B1 true KR101906509B1 (ko) 2018-10-10

Family

ID=48574133

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147014634A KR101906509B1 (ko) 2011-12-07 2012-11-28 접합장치 및 접합방법

Country Status (4)

Country Link
JP (1) JP5792831B2 (ja)
KR (1) KR101906509B1 (ja)
TW (1) TWI503232B (ja)
WO (1) WO2013084761A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105957817A (zh) * 2016-07-12 2016-09-21 武汉新芯集成电路制造有限公司 一种晶圆键合方法
CN109545692B (zh) * 2018-11-22 2020-06-26 武汉新芯集成电路制造有限公司 一种降低晶圆键合边缘扭曲度的方法
KR20200134708A (ko) 2019-05-23 2020-12-02 삼성전자주식회사 웨이퍼 본딩 장치
JP7394638B2 (ja) 2020-01-28 2023-12-08 東京エレクトロン株式会社 研削装置、及び研削方法
KR102345736B1 (ko) * 2020-02-28 2022-01-03 대한민국 밸브 연마장치 및 방법
JP7488738B2 (ja) * 2020-09-18 2024-05-22 日機装株式会社 真空積層装置及び積層体の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009032082A (ja) 2007-07-27 2009-02-12 Canon Inc データ処理装置、制御方法、及びプログラム
WO2009022457A1 (ja) 2007-08-10 2009-02-19 Nikon Corporation 基板貼り合わせ装置及び基板貼り合わせ方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090017248A1 (en) * 2007-07-13 2009-01-15 3M Innovative Properties Company Layered body and method for manufacturing thin substrate using the layered body
JP5798721B2 (ja) * 2010-04-07 2015-10-21 株式会社ニコン 基板位置合せ装置、基板貼り合せ装置、基板位置合せ方法および積層半導体の製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009032082A (ja) 2007-07-27 2009-02-12 Canon Inc データ処理装置、制御方法、及びプログラム
WO2009022457A1 (ja) 2007-08-10 2009-02-19 Nikon Corporation 基板貼り合わせ装置及び基板貼り合わせ方法

Also Published As

Publication number Publication date
WO2013084761A1 (ja) 2013-06-13
JPWO2013084761A1 (ja) 2015-04-27
JP5792831B2 (ja) 2015-10-14
TWI503232B (zh) 2015-10-11
KR20140099463A (ko) 2014-08-12
TW201341194A (zh) 2013-10-16

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