WO2013084761A1 - 貼り合せ装置および貼り合せ方法 - Google Patents
貼り合せ装置および貼り合せ方法 Download PDFInfo
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- WO2013084761A1 WO2013084761A1 PCT/JP2012/080675 JP2012080675W WO2013084761A1 WO 2013084761 A1 WO2013084761 A1 WO 2013084761A1 JP 2012080675 W JP2012080675 W JP 2012080675W WO 2013084761 A1 WO2013084761 A1 WO 2013084761A1
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- disk
- pressure
- bonding
- diameter dimension
- vacuum
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Definitions
- the present invention relates to a laminating apparatus and a laminating method for laminating two discs to produce a disc laminate, and more specifically, thinning a circular workpiece such as a semiconductor substrate by surface grinding / polishing.
- the present invention relates to a laminating apparatus and a laminating method in which a circular support having substantially the same diameter is centered and angle-adjusted in advance with respect to the circular workpiece.
- a technique for thinning a circular workpiece such as a semiconductor substrate by surface grinding and polishing is indispensable.
- thinning is required to reduce the thickness to 30 to 50 ⁇ m for a silicon wafer having a diameter of 300 mm.
- the circular workpiece having an extremely thin thickness with respect to the planar dimension cannot maintain the planar shape alone due to internal stress and own weight with its own rigidity. Therefore, as described in Patent Document 1, a step of bonding the circular support to the non-processed surface side of the circular workpiece in advance through an adhesive is required before the surface grinding / polishing process.
- a liquid adhesive is uniformly applied to the entire non-processed surface side of the circular workpiece before the flake processing or the adhesive surface side of the circular support.
- the adhesive a thermosetting resin or a UV curable resin is generally used, and it can be fixed by heat treatment after bonding and UV irradiation.
- the circular support is processed in advance precisely in flatness, and heat-resistant glass or silicon wafer having the same diameter as the circular workpiece and the same thickness as that of the circular workpiece before thinning is used.
- the bonding process is performed in a vacuum chamber in which a circular workpiece and a circular support are sandwiched between a stage on the lower side and a pressure disk on the upper side.
- each of the stage and the pressure disk is processed with a high degree of flatness, and the parallelism is also precisely adjusted in the vacuum chamber.
- the diameter of the stage and the pressure disc is reduced with respect to the circular workpiece and the circular support having the same diameter as that of the circular workpiece so as not to be contaminated by the sticking out of the adhesive generated at the outer edge during bonding. It has been devised.
- the diameter of the pressure disk has been empirically used as a dimension value that prevents the adhesive protruding from the outer edge from adhering or fouling.
- the total thickness of the laminated body composed of a circular support, an adhesive layer and a circular workpiece is approximately 10% of the thickness of the circular workpiece after laminating. It is required to suppress in-plane variation.
- JP 2004-268113 A see paragraphs 0033 to 0050
- the outer edge portion of the circular workpiece in the pressurizing process is a free end with respect to the flow characteristics of the adhesive layer, and the boundary conditions in the radial direction are different from the inner side. For this reason, the volume reduction between the circular workpiece and the circular support caused by the protrusion to the edge of the adhesive layer directly reduces the local thickness at the same site.
- the radial extent of this thickness reduction has been found to extend up to 10 mm inside the outer peripheral edge and exhibit a -8 ⁇ m to -14 ⁇ m thickness drop compared to the center.
- the inventor of the present application scrutinized the thickness profile in the radial direction of the laminated body after bonding, and ascertained that the higher-order concavo-convex shape mode (waving) was found in the profile, and the concavo-convex shape mode was a pressurized circle. It was confirmed that the diameter of the plate was changed by varying it, and the present invention was made.
- the present invention aims at optimizing the uneven shape mode found in the radial thickness profile of the laminated body after bonding by adjusting the diameter dimension of the pressure disk, and thereby by an inexpensive apparatus configuration. It aims at improving the in-plane variation of the total thickness of the laminated body after bonding.
- the first disk and the second disk are pre-centered, and the adhesive is uniformly applied to the upper surface of the first disk or the lower surface of the second disk. Then, by pressing the first disk and the second disk in the vertical direction, a disk laminate in which the second disk is bonded onto the first disk via an adhesive layer is manufactured. To do.
- Such a bonding apparatus has, as a specific configuration, a processing chamber having airtightness, a stage disposed in the processing chamber and supporting the first disc, and facing above the stage in the processing chamber.
- a pressure disk that is disposed and centered with respect to the first disk and the second disk, a lifting mechanism that supports the pressure disk so as to be movable up and down, and the second disk.
- a holding mechanism that is detachably held above the stage and below the pressure disk.
- the diameter dimension of the pressure disk is smaller than the diameter dimension of the second disk, and the thickness profile in the radial direction of the disk stack is Are set to dimensions that optimize the uneven shape mode.
- the upper surface of the second disk is A disk laminate in which the pressure disk is pressed with an equal force on the stage, and the upper surface of the first disk and the lower surface of the second disk are bonded via an adhesive layer.
- the first disk, the second disk, and the pressure disk are pre-centered, and the diameter dimension of the pressure disk can be seen in the radial thickness profile of the disk stack.
- the dimensions are set to optimize the uneven shape mode. For this reason, the in-plane dispersion
- the holding mechanism includes one movable pin that comes into contact with one place on the side surface of the second disc, and a plurality of stationary pins that comes into contact with a plurality of places on the side surface of the second disc.
- the movable pin is pressed against the side surface of the second disc by moving the movable pin in the forward direction and moving the movable pin in the direction approaching the center in the radial direction of the second disc, The side surface of the second disk is gripped by the movable pin and the stationary pin. Conversely, by moving the moving mechanism in the backward direction to move the movable pin away from the center of the second disk, the movable pin is separated from the side surface of the second disk, and the side surface of the second disk is gripped. Is released and the second disk is removed.
- the angular position of the second disk is determined simultaneously with the gripping of the second disk.
- the holding mechanism may include a suction mechanism that adsorbs the upper surface of the second disk to the pressure surface of the pressure disk. According to this, by operating the suction mechanism, the suction adsorption force acts on the second disk, and the upper surface of the second disk is adsorbed on the pressure surface of the pressure disk. Conversely, if the suction mechanism is stopped, the second disk is detached from the pressure disk. In this configuration of the holding mechanism, since the second disk is held by the pressure disk itself, another holding member is unnecessary, and the holding mechanism can be simplified.
- the vacuum is achieved so that the degree of vacuum achieved by the suction mechanism is smaller than the degree of vacuum in the vacuum chamber achieved by the pressure reducing mechanism. It is necessary to provide a pressure adjusting mechanism for adjusting the pressure in the chamber. Thereby, it is possible to prevent the holding force by the suction mechanism from being weakened before the pressurizing process and the second disc is dropped.
- the pressure disk when equipped with an attachment / detachment mechanism that positions the center of the pressure disk and detachably supports it on the lifting mechanism, the pressure disk can be easily replaced, and it is easy to change lots of disk stacks. It becomes possible to do.
- the second disk with center alignment is held oppositely above the first disk that is supported on the stage and the adhesive is uniformly applied to the upper surface.
- the first disk and the second disk are bonded together by pressing the upper surface of the second disk with an equal force with a pressure disk centered on the first disk and the second disk.
- a disk laminate is produced.
- a pressure disk having an optimized diameter dimension of the uneven shape mode found in the thickness profile of the circular laminated body in the radial direction is used in the pressure treatment step.
- the adhesive layer applied to the upper surface of the first disk is applied to the first disk during the pressure treatment. Even if it protrudes to the outside, it flows to the outer edge of the lower surface of the second disk that is slightly larger than the first disk and stays there, so that the adhesive adheres to the side surface of the first disk. There is nothing. Therefore, it is possible to prevent the diameter of the first disc after bonding from becoming uneven in the circumferential direction.
- a silicon wafer is used as an example
- a glass support is used as an example.
- a photocurable resin or a thermosetting resin is used as an example of the adhesive.
- FIG. 4A is a side view for explaining the moving mechanism of the movable pin, and shows a state in which the movable pin is pressed against the side surface of the second disk to hold the second disk.
- 4B is a side view for explaining the moving mechanism of the movable pin, and shows a state where the movable pin is separated from the side surface of the second disk and the holding of the second disk is released. It is a figure which shows the thickness profile of the radial direction of the disk laminated body after bonding. It is a side view which shows schematic structure of the bonding apparatus which concerns on the 2nd Embodiment of this invention.
- FIG. 1 is a front view showing a schematic configuration of a bonding apparatus according to the first embodiment of the present invention.
- a disc stack is produced by laminating two kinds of first disc W1 and second disc W2 that are oppositely arranged with an adhesive uniformly applied to either one in advance.
- the first disk is, for example, a semiconductor circular workpiece such as a silicon wafer
- the second disk is, for example, a glass circular support.
- the bonding apparatus 10 includes a chamber (processing chamber) 20, a decompression mechanism 30, an opening / closing mechanism 40, a stage 50, a pressurizing disk 60, an elevating mechanism 70, and a holding mechanism 80 as main components. Is provided.
- the laminating apparatus 10 includes a base plate 11 and a gate-type support frame 12 fixed to the base plate 11.
- the base plate 11 and the support frame 12 are formed of a material having sufficiently high rigidity.
- a chamber 20 as a processing chamber is provided inside the support frame 12.
- the chamber 20 is divided into upper and lower parts, and is composed of an upper container 20A and a lower container 20B.
- An O-ring 21 is provided at the opening of the chamber 20, that is, at a place where the upper container 20 ⁇ / b> A and the lower container 20 ⁇ / b> B come into contact with each other to keep the inside of the chamber 20 airtight.
- the lower container 20B is supported by the base plate 11.
- the upper container 20 ⁇ / b> A is suspended and supported by the support frame 12, and can be moved up and down (moved up and down) by the opening / closing mechanism 40.
- the opening / closing mechanism 40 includes an actuator 41, a lifting plate 42, and a support 43.
- the actuator 41 has a piston 411 and a cylinder 412.
- the piston 411 is a non-moving portion of the actuator 41 and is erected vertically at the center of the upper surface of the ceiling wall of the support frame 12.
- the cylinder 412 is a movable part of the actuator 41 and is configured to be movable up and down along the piston 411.
- the actuator 41 is driven by solenoid, hydraulic pressure, pneumatic pressure, or the like as power, and is configured to be controllable by an electrical signal using a control mechanism (not shown).
- the elevating plate 42 is fixed to the cylinder 412 of the actuator 41 and can move up and down together with the cylinder 412 while keeping the level.
- the piston 411 is inserted through the center of the lifting plate 42.
- the upper ends of a plurality of vertically extending columns 43 are fixed to the outer edge of the lower surface of the elevating plate 42.
- the support 43 is penetrated through the ceiling wall of the support frame 12, and the lower end thereof is fixed to the upper surface of the upper container 20A.
- the upper container 20 ⁇ / b> A is suspended and supported by the elevating plate 42 via the column 43.
- FIG. 1 shows a state in which the chamber 20 is opened
- FIG. 2 shows a state in which the chamber 20 is closed.
- the decompression mechanism 30 includes a vacuum line 31, a vent line 32, a vacuum pump 33, a vacuum valve 34, and a vent valve 35.
- the vacuum line 31 is formed by piping made of a vacuum material, and the intake side is attached through the lower container 20B. As a result, the vacuum line 31 communicates with the chamber 20.
- the vacuum line 31 is provided with a vacuum pump 33 and a vacuum valve 34.
- the vent line 32 is branched from the vacuum line 31 on the upstream side of the vacuum valve 34, and is connected to a pressure-resistant container containing an inert gas (for example, nitrogen).
- the vent line 32 is formed by piping.
- a vent valve 35 is provided in the vent line 32.
- the vacuum valve 34 when the vacuum valve 34 is opened with the chamber 20 closed as shown in FIG. 2 and the vacuum pump 33 is driven, the air in the chamber 20 is exhausted through the vacuum line 31. The Thereby, the inside of the chamber 20 is depressurized and a high vacuum is obtained.
- the vent valve 35 is opened when an inert gas such as nitrogen is leaked into the chamber 20 through the vent line 32 to return the pressure in the chamber 20 to normal pressure.
- the pressure in the chamber 20 is monitored by a vacuum gauge 17 attached to the outside of the upper container 20A.
- a stage 50 as a support plate for supporting the first disc W1 and a pressurizing disc 60 for pressurizing the second disc W2 are arranged to face each other.
- the stage 50 has a mechanism for attracting and holding the first disk W1 by applying at least one of a suction attracting force or an electrostatic attracting force.
- the pressurizing disc 60 is supported by an elevating mechanism 70 provided in the upper container 20A so as to be elevable.
- the lifting mechanism 70 includes an actuator 71, a mounting base 72, a support shaft 73, and a disk magnet 74.
- the pressure disk 60 is mounted and adjusted with respect to the stage 50 with a parallelism of 4 ⁇ m or less.
- Actuator 71 has a piston 711 and a cylinder 712.
- the cylinder 712 is a non-moving portion of the actuator 71, and its axial direction is oriented vertically, and is attached to a mounting base 72 fixed to the ceiling wall of the upper container 20A.
- the piston 711 is a movable part of the actuator 71, and is configured to be movable in the axial direction of the cylinder 712, that is, vertically movable, through the mounting base 72.
- the actuator 71 is driven by a solenoid, hydraulic pressure, pneumatic pressure, or the like as power, and is configured to be controllable by an electrical signal using a control mechanism (not shown).
- the upper end of the support shaft 73 is coaxially fixed to the lower end of the piston 711 of the actuator 71.
- the support shaft 73 is formed in a columnar shape, and is inserted through a through hole provided at the center of the ceiling wall of the upper container 20A.
- a shaft seal 14 is provided in the through hole of the upper container 20A, and the shaft seal 14 seals between the upper container 20A and the support shaft 73.
- a disc magnet 74 is horizontally attached to the lower end of the support shaft 73. The disc magnet 74 is attached in a state of being precisely aligned with the axes of the piston 711 and the support shaft 73, the center of which is set coaxially.
- the pressure disk 60 is made of a magnetic material (for example, an alloy containing a magnetic material), and can be attracted and held by applying the magnetic attraction force of the disk magnet 74.
- the diameter dimension of the pressure disk 60 and the smoothness of the pressure surface (lower surface) are processed with extremely high accuracy.
- a plurality of positioning protrusions (not shown) are formed on the upper surface of the pressure disk 60 in the center and in the circumferential direction around the center.
- a plurality of positioning holes are formed at locations corresponding to the positioning protrusions on the lower surface of the disc magnet 74.
- the pressing disk 60 is attracted and held by the disk magnet 74 so that the positioning protrusions on the upper surface of the pressing disk 60 are fitted in the corresponding positioning holes on the lower surface of the disk magnet 74,
- the plate 60 is mounted in a state in which displacement is prevented and the center thereof is aligned with the axes of the piston 711 and the support shaft 73.
- the disk magnet 74 and its positioning hole, and the positioning protrusion of the pressure disk 60 are an example of an attachment / detachment mechanism that allows the pressure disk 60 to be attached and detached.
- this attachment / detachment mechanism using magnetic attraction fixing parts such as screws are unnecessary, and attachment / detachment work can be performed very easily with one touch.
- the pressurization method according to the present invention in which the pressurization disk 60 needs to be replaced for each lot of the disk stacks, can be easily replaced, and thus is a very useful attachment / detachment mechanism.
- the stage 50 is supported by the lower container 20B.
- a plurality of lift pins 13 are passed through the stage 50 from below.
- the plurality of lift pins 13 are erected vertically on the support member 16.
- the support member 16 can be moved up and down by an elevating mechanism 90, and thereby, the tip end portion of the lift pin 13 can be projected and retracted from the support surface (upper surface) of the stage 50.
- the structure of the raising / lowering mechanism 90 is the same as that of the raising / lowering mechanism 70 of the pressurization disc 60 mentioned above.
- the first disk W1 is transported above the stage 50 by a transport device (not shown) provided with a robot arm in a state in which the center and angle are adjusted in advance using an alignment device (not shown). Is supported by lift pins 13 projecting from the top. When the lift pin 13 is lowered in this state, the first disc W1 is supported at a fixed position on the support surface of the stage 50.
- the second disk W2 is detachably held above the stage 50 and below the pressure disk 60 by the holding mechanism 80.
- the holding mechanism 80 is configured to be able to grip the side surface of the second disc W2.
- the holding mechanism 80 includes a movable pin 81, a stationary pin 82, and a moving mechanism (device) 83.
- FIG. 3 is a plan view for explaining the holding mechanism 80.
- 4A and 4B are side views illustrating the moving mechanism 83 of the movable pin 81.
- FIG. Details of the holding mechanism 80 will be described with reference to FIGS. 3, 4 (A), and 4 (B).
- the movable pin 81 is engaged with an angle adjusting notch N formed at one place on the side surface of the second disk W2, and the two stationary pins 82 are on the side surface of the second disk W2. Are abutted at two locations.
- One movable pin 81 and two stationary pins 82 are provided in a planar arrangement in which the circumference of the second disk W2 is equally divided into three at a central angle of 120 °.
- the movable pin and the stationary pin 82 are formed in a cylindrical shape as an example.
- the fixed pin 82 is fixed to the inner surface of the ceiling wall of the upper container 20 ⁇ / b> A with the axial direction vertical.
- the moving mechanism 83 is configured to be able to reciprocate the movable pin 81 in the radial direction of the second disk W2. 4A and 4B, the moving mechanism 83 includes a stepping motor 831, a ball screw nut 832, a ball screw 833, a stem 834, a support shaft 835, a stopper 836, a flange 837, a compression coil spring 838, and the like.
- a bearing 839 is provided.
- the stepping motor 831 is fixed to the outer surface of the ceiling wall of the upper container 20A with its drive shaft oriented in the direction away from the center in the radial direction of the second disc W2.
- the stepping motor 831 is configured to be able to rotate the drive shaft in both forward and reverse directions by pulse driving, and the driving force is transmitted to the ball screw nut 832 to rotate the ball screw nut 832 by a predetermined amount in the forward direction or the reverse direction.
- the rotational motion of the ball screw nut 832 is converted into the linear motion of the ball screw 833.
- the tip of the ball screw 833 is attached to the top of a vertically extending stem 834.
- a base end of a support shaft 835 extending in parallel with the ball screw 833 is attached to the lower portion of the stem 834.
- the support shaft 835 is inserted through the through hole in the side wall of the upper container 20A.
- a shaft seal 14 is provided in the through hole of the upper container 20A, and the shaft seal 14 seals between the upper container 20A and the support shaft 835.
- a flange 837 is formed at a portion located inside the upper container 20 ⁇ / b> A in the axial direction of the support shaft 835.
- the distal end portion of the support shaft 835 is inserted into the through hole of the movable pin 81.
- a bearing 839 is provided in the through hole of the movable pin 81, and the bearing 839 enables sliding along the support shaft 835 of the movable pin 81.
- a compression coil spring 838 is provided in a portion between the flange 837 and the movable pin 81 in the axial direction of the support shaft 835, and the movable pin 81 is urged toward the distal end side of the support shaft 835 by the compression coil spring 838.
- a stopper 836 is attached to the tip of the support shaft 835, and the movable pin 81 is prevented from coming off the support shaft 835 by the stopper 836.
- the moving mechanism 83 when the stepping motor 831 is driven to rotate in the forward direction, the support shaft 835 approaches the center in the radial direction of the second disk W2 as indicated by the arrow in FIG. Moving. As a result, the movable pin 81 urged by the compression coil spring 838 is pressed against the side surface of the second disk W2, and the second disk W2 is held at three positions on the side surface by the movable pin 81 and the two stationary pins 82. Is done. As shown in FIG. 3, it is assumed that the mounting position of the stationary pin 82 is set so that the center of the second disk W ⁇ b> 2 is aligned with the center of the pressure disk 60. At this time, if the movable pin 81 is engaged with a notch N provided on one side of the second disk W2, the angle of the second disk W2 can be adjusted.
- the support shaft 835 moves away from the center in the radial direction of the second disk W2, as indicated by the arrow in FIG. Thereby, the movable pin 81 is separated from the side surface of the second disk W2, and the second disk W2 is detached.
- pressurization may be performed in a state where the second disk W2 is held by the pins as shown in FIG. In the latter case, it is effective to prevent the displacement of the second disk W2 with pressure.
- the gripping force of the second disk W2 can be adjusted by the spring constant of the compression coil spring 838.
- the holding mechanism 80 holds the second disk W2 with the chamber 20 opened, and the first disk W1 is placed on the stage 50 using the second disk W2 as a reference for alignment. To support. As a result, the first disk W1 and the second disk W2 are disposed in the chamber 20 so as to face each other in the vertical direction. Note that an adhesive is uniformly applied to the upper surface of the first disk W1 with a predetermined film thickness. After the upper container 20A is lowered by the opening / closing mechanism 40 and the chamber 20 is closed, the decompression mechanism 30 is operated to keep the inside of the chamber 20 at a high vacuum.
- the pressure disk 60 is lowered by the elevating mechanism 70 and the second disk W2 is detached from the holding mechanism 80.
- the upper surface of the second disc W2 is pressed with a uniform force on the stage 50 by the pressurizing disc 60, and the upper surface of the first disc W1 and the lower surface of the second disc W2 form the adhesive layer.
- the first disc W1, the second disc W2, and the pressure disc 60 are centered in advance.
- the diameter dimension of the pressure disk 60 is set to a dimension that optimizes the uneven shape mode found in the radial thickness profile of the disk stack. For this reason, the in-plane dispersion
- thermosetting resin or a UV curable resin is used as an example of the adhesive.
- the disk laminate after the bonding is taken out from the bonding apparatus 10, and the adhesive layer is solidified by heating or UV irradiation in the next step to obtain a product.
- the laminating apparatus 10 of the present invention by performing pressure treatment using a pressure disk having a diameter dimension in which the uneven shape mode is optimized, the disk after bonding with a simple apparatus configuration. In-plane variation of the total thickness of the laminate can be suppressed.
- the procedure for setting the dimensions of the pressure disk will be described by way of example.
- the diameter range of the pressure disc examined in the experiment is smaller than the diameter (300 mm) of the silicon wafer that is the workpiece, and the thickness is measured for all five diameter dimensions.
- the number of maximal points of the concavo-convex mode found in the profile is three (one at the center and two on the left and right), and there is no change and is common.
- the number of minimum points is two at 296 mm, 290 mm, and 285 mm, and is increased by two to four at 280 mm and 270 mm.
- the singular point (outermost singular point) farthest from the center in the radial direction becomes the maximum point, and as a result of decreasing monotonically outside it,
- the outer peripheral edge has the minimum thickness.
- the pressure disk diameter is 280 mm and 270 mm
- a minimum point appears on the outer side of the maximum point farthest from the center in the radial direction, and the point giving the minimum thickness is from the outer peripheral edge in the radial direction. Shift inward.
- the diameter dimension of the intermediate pressure disk in which the singular point (outermost singular point) farthest from the center in the radial direction changes from the local maximum point to the local minimum point is 285 mm. It can be seen that the thickness profile uneven shape mode is greatly changed. In this example, the in-plane variation of the total thickness of the laminated discs after bonding is minimized by the diameter corresponding to this turning point.
- the diameter dimension of the pressure disk that minimizes the in-plane variation of the total thickness of the disk stack is not necessarily the diameter dimension corresponding to the turning point of the profile, the diameter dimension and thickness of the silicon wafer and the glass plate to be used, Furthermore, the optimum diameter dimension varies depending on the type of adhesive and the film thickness (that is, the lot of disk laminates). For this reason, the optimal diameter dimension of the pressure disk is tested with multiple pressure disks with different diameter dimensions for each lot of disk stacks, and the changes in the uneven shape mode of the thickness profile are tracked as described above. However, it must be determined experimentally. However, once the optimum diameter dimension has been determined, the pressure disk required to produce the lot with the same apparatus is uniquely determined.
- the present invention is very simple and useful.
- FIG. 6 is a front view showing a schematic configuration of a bonding apparatus according to the second embodiment of the present invention.
- the holding mechanism that holds the second disk W2 in the previous stage of the pressurizing process causes suction suction force to act on the second disk W2 to suck and hold the pressure disk 60.
- a mechanism 180 is provided.
- the suction mechanism 180 includes a vacuum line 181, a vacuum pump 182, and a vacuum valve 183.
- the suction side of the vacuum line 181 is passed through the inner side of the support shaft 73 of the lifting mechanism 70 in the axial direction, reaches the pressure surface (lower surface) of the pressure disk 60, and is opened as an air intake hole.
- the degree of vacuum of the vacuum line 181 is monitored by a vacuum gauge 19.
- the suction mechanism 180 has the same configuration as the decompression mechanism 30 that achieves a vacuum in the chamber 20.
- the second disk W2 can be adsorbed and held by the above configuration.
- the pressure environment in the chamber 20 is set to a high vacuum in the pressurization process.
- the holding force is weakened, and the second disk W2 may fall before the pressure disk 60 is lowered.
- a pressure adjusting mechanism 100 is additionally provided.
- the pressure adjustment mechanism 100 is for maintaining the degree of vacuum of the vacuum line 181 of the suction mechanism 180 higher than the degree of vacuum in the chamber 20, and includes a nitrogen gas introduction line 101, a mass flow controller (MFC) 102, and a slot valve 103. Is provided.
- the nitrogen gas introduction line 101 is formed by piping, and the gas introduction side is attached through the upper container 20A. Thereby, the nitrogen gas introduction line communicates with the inside of the chamber 20.
- the slot valve 103 is a valve configured to be capable of dynamically adjusting an opening degree additionally provided in the vacuum line 31 of the pressure reducing mechanism 30.
- the degree of vacuum in the chamber 20 can be maintained at a predetermined pressure. Thereby, the degree of vacuum of the vacuum line 181 of the suction mechanism 180 is maintained higher than the degree of vacuum in the chamber 20, and the second disk W2 can be adsorbed.
- the vacuum valve 183 provided in the vacuum line 181 is closed and the suction force of the vacuum pump 182 is forced. Cut off.
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Abstract
Description
20…チャンバ
30…減圧機構
40…開閉機構
50…ステージ
60…加圧円板
70…昇降機構
74…円板磁石(着脱機構)
80…保持機構
83…移動機構
100…圧力調整機構
180…吸引機構
W1…第1円板
W2…第2円板
Claims (15)
- 第1円板および第2円板があらかじめ中心合わせがなされると共に、前記第1円板の上面または前記第2円板の下面に接着剤が均一塗布されており、前記第1円板および前記第2円板を上下方向に加圧することにより、前記第1円板上に接着剤層を介して前記第2円板が貼り合された円板積層体を作製する貼り合せ装置であって、
気密性を有する処理室と、
前記処理室内に配置され、前記第1円板を支持するステージと、
前記処理室内の前記ステージの上方に対向配置され、前記第1円板および前記第2円板に対して中心合わせがなされた加圧円板と、
前記加圧円板を昇降可能に支持する昇降機構と、
前記第2円板を、前記ステージの上方、かつ、前記加圧円板の下方に離脱可能に保持する保持機構と、
を有し、
前記加圧円板の直径寸法は、前記第2円板の直径寸法よりも小さく、かつ、円板積層体の半径方向の厚みプロファイルに見られる凹凸形状モードの最適化が図られた寸法に設定されている、貼り合せ装置。 - 前記保持機構は、前記第2円板の側面の一箇所に当接する1本の可動ピンと、前記第2円板の側面の複数箇所に当接する複数本の不動ピンと、前記可動ピンを前記第2円板の半径方向に往復移動させる移動機構と、を備える、請求項1に記載の貼り合せ装置。
- 前記可動ピンは前記第2円板の側面の一箇所に設けられた角度合わせ用ノッチに係合される、請求項2に記載の貼り合せ装置。
- 前記保持機構は、前記加圧円板に前記第2円板の上面を吸着させる吸引機構を備える、請求項1に記載の貼り合せ装置。
- 前記処理室内を減圧する減圧機構を有し、前記吸引機構により達成される真空度が、前記減圧機構により達成される真空チャンバ内の真空度よりも小さくなるように、前記真空チャンバ内の圧力を調整する圧力調整機構をさらに備える、請求項4に記載の貼り合せ装置。
- 前記昇降機構は、前記加圧円板の中心を位置決めして着脱自在に支持する着脱機構を備える、請求項1~5のいずれかに記載の貼り合せ装置。
- ステージ上に支持された、接着剤が上面に均一に塗布された第1円板の上方に、中心合わせがなされた第2円板が対向保持され、前記第1円板および前記第2円板と中心合わせがなされた加圧円板により前記第2円板の上面を均等な力で加圧して前記第1円板および前記第2円板を貼り合せて円板積層体を作製する貼り合せ方法において、
前記加圧円板の直径寸法が、前記第2円板の直径寸法よりも小さく、かつ、円板積層体の半径方向の厚みプロファイルに見られる凹凸形状モードの最適化が図られた寸法に設定された、貼り合せ方法。 - 前記加圧円板による加圧処理を高真空下で行う、請求項7に記載の貼り合せ方法。
- 前記第2円板の直径寸法は、前記第1円板の直径寸法より大きい、請求項7に記載の貼り合せ方法。
- 前記第2円板の直径寸法は、前記第1円板の直径寸法より大きい、請求項8に記載の貼り合せ方法。
- 前記円板積層体のロット毎に、対応する直径寸法を有する前記加圧円板に交換する、請求項8に記載の貼り合せ方法。
- 前記円板積層体のロット毎に、対応する直径寸法を有する前記加圧円板に交換する、請求項9に記載の貼り合せ方法。
- 前記円板積層体のロット毎に、対応する直径寸法を有する前記加圧円板に交換する、請求項10に記載の貼り合せ方法。
- 前記第1円板がシリコンウェーハであり、前記第2円板がガラス製の支持体である、請求項11に記載の貼り合せ方法。
- 前記接着剤が光硬化性樹脂または熱硬化性樹脂である、請求項14に記載の貼り合せ方法。
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