KR101900585B1 - 임프린트 장치, 임프린트 방법 및 물품의 제조 방법 - Google Patents

임프린트 장치, 임프린트 방법 및 물품의 제조 방법 Download PDF

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KR101900585B1
KR101900585B1 KR1020167032829A KR20167032829A KR101900585B1 KR 101900585 B1 KR101900585 B1 KR 101900585B1 KR 1020167032829 A KR1020167032829 A KR 1020167032829A KR 20167032829 A KR20167032829 A KR 20167032829A KR 101900585 B1 KR101900585 B1 KR 101900585B1
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South Korea
Prior art keywords
imprint material
substrate
imprint
mold
pattern
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Korean (ko)
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KR20160146956A (ko
Inventor
히로미츠 야마구치
야스유키 다무라
요시카즈 미야지마
아키오 사이토
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캐논 가부시끼가이샤
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B1/00—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means
    • B05B1/30—Nozzles, spray heads or other outlets, with or without auxiliary devices such as valves, heating means designed to control volume of flow, e.g. with adjustable passages
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B12/00—Arrangements for controlling delivery; Arrangements for controlling the spray area
    • B05B12/02—Arrangements for controlling delivery; Arrangements for controlling the spray area for controlling time, or sequence, of delivery
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/12—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by mechanical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J3/00—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
    • B41J3/407—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • H01L21/0274—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/40—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials
    • H10P76/408—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their sizes, orientations, dispositions, behaviours or shapes
    • H10P76/4085—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising inorganic materials characterised by their sizes, orientations, dispositions, behaviours or shapes characterised by the processes involved to create the masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2203/00—Other substrates
    • B05D2203/30—Other inorganic substrates, e.g. ceramics, silicon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
KR1020167032829A 2014-05-02 2015-04-16 임프린트 장치, 임프린트 방법 및 물품의 제조 방법 Active KR101900585B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2014-095502 2014-05-02
JP2014095502A JP6329425B2 (ja) 2014-05-02 2014-05-02 インプリント装置、インプリント方法、および物品の製造方法
PCT/JP2015/062315 WO2015166870A1 (en) 2014-05-02 2015-04-16 Imprint apparatus, imprint method, and method of manufacturing article

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020187026503A Division KR20180104777A (ko) 2014-05-02 2015-04-16 임프린트 장치, 임프린트 방법 및 물품의 제조 방법

Publications (2)

Publication Number Publication Date
KR20160146956A KR20160146956A (ko) 2016-12-21
KR101900585B1 true KR101900585B1 (ko) 2018-09-19

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Application Number Title Priority Date Filing Date
KR1020167032829A Active KR101900585B1 (ko) 2014-05-02 2015-04-16 임프린트 장치, 임프린트 방법 및 물품의 제조 방법
KR1020187026503A Ceased KR20180104777A (ko) 2014-05-02 2015-04-16 임프린트 장치, 임프린트 방법 및 물품의 제조 방법

Family Applications After (1)

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KR1020187026503A Ceased KR20180104777A (ko) 2014-05-02 2015-04-16 임프린트 장치, 임프린트 방법 및 물품의 제조 방법

Country Status (7)

Country Link
US (1) US10406743B2 (https=)
JP (1) JP6329425B2 (https=)
KR (2) KR101900585B1 (https=)
CN (1) CN106256014B (https=)
SG (1) SG11201608330YA (https=)
TW (1) TWI564935B (https=)
WO (1) WO2015166870A1 (https=)

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* Cited by examiner, † Cited by third party
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JP6329437B2 (ja) * 2014-06-10 2018-05-23 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
JP6566843B2 (ja) * 2015-11-12 2019-08-28 キヤノン株式会社 パターン形成方法、インプリントシステムおよび物品製造方法
JP6666039B2 (ja) * 2016-03-07 2020-03-13 キヤノン株式会社 インプリント方法、インプリント装置、プログラム、および物品の製造方法
JP6726987B2 (ja) * 2016-03-17 2020-07-22 キヤノン株式会社 インプリント装置および物品製造方法
SG10201709153VA (en) * 2016-12-12 2018-07-30 Canon Kk Fluid droplet methodology and apparatus for imprint lithography
US10493672B2 (en) * 2017-06-26 2019-12-03 Canon Kabushiki Kaisha Imprint apparatus, method of manufacturing article, information processing apparatus, method of supporting map editing, and storage medium
US11131923B2 (en) * 2018-10-10 2021-09-28 Canon Kabushiki Kaisha System and method of assessing surface quality by optically analyzing dispensed drops
US10725375B2 (en) 2018-12-04 2020-07-28 Canon Kabushiki Kaisha Using non-linear fluid dispensers for forming thick films
JP7149870B2 (ja) 2019-02-08 2022-10-07 キヤノン株式会社 インプリント装置および物品製造方法
JP7171468B2 (ja) * 2019-02-20 2022-11-15 キヤノン株式会社 情報処理装置、プログラム、リソグラフィ装置、物品の製造方法、物品の製造システム、及び出力方法
KR102904803B1 (ko) * 2019-06-17 2025-12-26 삼성디스플레이 주식회사 광학측정장치
CN110143061B (zh) * 2019-07-02 2020-07-24 敏达环保科技（嘉兴）有限公司 一种铁皮专用压印装置
JP7271352B2 (ja) * 2019-07-17 2023-05-11 キオクシア株式会社 インプリント装置、インプリント方法、および半導体装置の製造方法
KR102776383B1 (ko) * 2020-03-18 2025-03-10 삼성디스플레이 주식회사 표시 장치의 제조장치 및 표시 장치의 제조방법
JP7532234B2 (ja) * 2020-12-10 2024-08-13 キヤノン株式会社 平坦化装置、平坦化方法及び物品の製造方法
KR102509680B1 (ko) * 2020-12-31 2023-03-15 (주)유니젯 잉크방울 측정패드와 이를 구비한 잉크젯 프린터 장치 및 잉크방울 측정방법
JP2023012047A (ja) * 2021-07-13 2023-01-25 東京エレクトロン株式会社 機能液測定装置および機能液測定方法
JP7667047B2 (ja) * 2021-09-22 2025-04-22 キオクシア株式会社 ドロップレシピの作成方法、パターン形成方法、半導体装置の製造方法
EP4250006A1 (en) * 2022-03-23 2023-09-27 Koninklijke Philips N.V. Quality control method for imprint lithography
JP2025140831A (ja) * 2024-03-14 2025-09-29 キオクシア株式会社 インプリント方法および半導体装置の製造方法

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JP2011159764A (ja) * 2010-01-29 2011-08-18 Toshiba Corp パターン形成方法、レジスト塗布分布算出装置及びレジスト塗布分布算出プログラム
JP2012033769A (ja) * 2010-07-30 2012-02-16 Toshiba Corp パタン形成方法
JP2013065624A (ja) * 2011-09-15 2013-04-11 Fujifilm Corp インクジェットヘッドの吐出量補正方法、吐出量補正装置、及び機能性インク配置装置並びにナノインプリントシステム

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JP5520612B2 (ja) 2010-01-04 2014-06-11 東芝機械株式会社 ディスペンサを備えた転写装置、ディスペンサの吐出量検出方法、及びディスペンサの吐出量制御方法
JP5744422B2 (ja) 2010-06-17 2015-07-08 キヤノン株式会社 インプリント方法及びインプリント装置、サンプルショット抽出方法、並びにそれを用いた物品の製造方法
JP5489887B2 (ja) 2010-06-30 2014-05-14 富士フイルム株式会社 液体塗布装置及び液体塗布方法並びにナノインプリントシステム
JP2012114157A (ja) 2010-11-22 2012-06-14 Toshiba Corp ドロップレシピ作成方法およびデータベース作成方法
JP6180131B2 (ja) 2012-03-19 2017-08-16 キヤノン株式会社 インプリント装置、それを用いた物品の製造方法
JP2014033069A (ja) * 2012-08-03 2014-02-20 Toshiba Corp パターン形成方法及びディスペンサー
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Publication number Priority date Publication date Assignee Title
JP2011159764A (ja) * 2010-01-29 2011-08-18 Toshiba Corp パターン形成方法、レジスト塗布分布算出装置及びレジスト塗布分布算出プログラム
JP2012033769A (ja) * 2010-07-30 2012-02-16 Toshiba Corp パタン形成方法
JP2013065624A (ja) * 2011-09-15 2013-04-11 Fujifilm Corp インクジェットヘッドの吐出量補正方法、吐出量補正装置、及び機能性インク配置装置並びにナノインプリントシステム

Also Published As

Publication number Publication date
US10406743B2 (en) 2019-09-10
WO2015166870A1 (en) 2015-11-05
JP2015213130A (ja) 2015-11-26
TWI564935B (zh) 2017-01-01
TW201545205A (zh) 2015-12-01
SG11201608330YA (en) 2016-11-29
KR20180104777A (ko) 2018-09-21
JP6329425B2 (ja) 2018-05-23
CN106256014B (zh) 2019-06-21
US20170015045A1 (en) 2017-01-19
KR20160146956A (ko) 2016-12-21
CN106256014A (zh) 2016-12-21

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