KR101895834B1 - 검출장치, 계측장치, 노광장치, 물품의 제조방법, 및 계측방법 - Google Patents

검출장치, 계측장치, 노광장치, 물품의 제조방법, 및 계측방법 Download PDF

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KR101895834B1
KR101895834B1 KR1020150123406A KR20150123406A KR101895834B1 KR 101895834 B1 KR101895834 B1 KR 101895834B1 KR 1020150123406 A KR1020150123406 A KR 1020150123406A KR 20150123406 A KR20150123406 A KR 20150123406A KR 101895834 B1 KR101895834 B1 KR 101895834B1
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KR20160029673A (ko
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아키오 아카마츠
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캐논 가부시끼가이샤
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G01B11/27—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes
    • G01B11/272—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes for testing the alignment of axes using photoelectric detection means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/38—Masks having auxiliary features, e.g. special coatings or marks for alignment or testing; Preparation thereof
    • G03F1/44—Testing or measuring features, e.g. grid patterns, focus monitors, sawtooth scales or notched scales
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70275—Multiple projection paths, e.g. array of projection systems, microlens projection systems or tandem projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70591—Testing optical components
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020150123406A 2014-09-05 2015-09-01 검출장치, 계측장치, 노광장치, 물품의 제조방법, 및 계측방법 Active KR101895834B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014181599A JP6470528B2 (ja) 2014-09-05 2014-09-05 検出装置、計測装置、露光装置、物品の製造方法、および計測方法
JPJP-P-2014-181599 2014-09-05

Publications (2)

Publication Number Publication Date
KR20160029673A KR20160029673A (ko) 2016-03-15
KR101895834B1 true KR101895834B1 (ko) 2018-09-07

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KR1020150123406A Active KR101895834B1 (ko) 2014-09-05 2015-09-01 검출장치, 계측장치, 노광장치, 물품의 제조방법, 및 계측방법

Country Status (5)

Country Link
US (1) US9534888B2 (enExample)
JP (1) JP6470528B2 (enExample)
KR (1) KR101895834B1 (enExample)
CN (1) CN105467771B (enExample)
TW (1) TWI605314B (enExample)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6685821B2 (ja) * 2016-04-25 2020-04-22 キヤノン株式会社 計測装置、インプリント装置、物品の製造方法、光量決定方法、及び、光量調整方法
JP7186531B2 (ja) * 2018-07-13 2022-12-09 キヤノン株式会社 露光装置、および物品製造方法
EP3667423B1 (en) * 2018-11-30 2024-04-03 Canon Kabushiki Kaisha Lithography apparatus, determination method, and method of manufacturing an article
JP2022117091A (ja) 2021-01-29 2022-08-10 キヤノン株式会社 計測装置、リソグラフィ装置及び物品の製造方法
JP2022187831A (ja) * 2021-06-08 2022-12-20 キヤノン株式会社 計測装置、リソグラフィ装置及び物品の製造方法
KR102524462B1 (ko) * 2022-03-28 2023-04-21 (주)오로스 테크놀로지 오버레이 측정장치

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100389976B1 (ko) * 1995-03-23 2004-05-27 가부시키가이샤 니콘 얼라인먼트방법및장치
JP5571316B2 (ja) 2004-12-27 2014-08-13 エーエスエムエル ネザーランズ ビー．ブイ． 複数の位置調整装置を備えるリソグラフィ装置、及び位置調整測定方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6332303A (ja) 1986-07-25 1988-02-12 Canon Inc アライメント装置
JPH07123103B2 (ja) * 1986-11-26 1995-12-25 株式会社ニコン 位置合わせ装置
US5734478A (en) * 1988-10-12 1998-03-31 Nikon Corporation Projection exposure apparatus
JP2819592B2 (ja) * 1989-03-03 1998-10-30 キヤノン株式会社 位置合わせ装置
JP3033135B2 (ja) * 1990-06-13 2000-04-17 株式会社ニコン 投影露光装置及び方法
JPH0954443A (ja) * 1995-08-18 1997-02-25 Nikon Corp 露光方法及び装置
JP3445100B2 (ja) * 1997-06-02 2003-09-08 キヤノン株式会社 位置検出方法及び位置検出装置
JP2002289495A (ja) * 2001-03-23 2002-10-04 Nikon Corp 露光装置、露光装置の製造方法及びマイクロデバイスの製造方法
JP2009192271A (ja) * 2008-02-12 2009-08-27 Canon Inc 位置検出方法、露光装置、及びデバイス製造方法
NL2008110A (en) * 2011-02-18 2012-08-21 Asml Netherlands Bv Measuring method, measuring apparatus, lithographic apparatus and device manufacturing method.
JP6066627B2 (ja) * 2012-08-23 2017-01-25 キヤノン株式会社 位置検出装置、およびそれを用いたリソグラフィー装置並びにデバイスの製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100389976B1 (ko) * 1995-03-23 2004-05-27 가부시키가이샤 니콘 얼라인먼트방법및장치
JP5571316B2 (ja) 2004-12-27 2014-08-13 エーエスエムエル ネザーランズ ビー．ブイ． 複数の位置調整装置を備えるリソグラフィ装置、及び位置調整測定方法

Also Published As

Publication number Publication date
JP6470528B2 (ja) 2019-02-13
CN105467771B (zh) 2018-02-27
TW201617741A (zh) 2016-05-16
CN105467771A (zh) 2016-04-06
TWI605314B (zh) 2017-11-11
KR20160029673A (ko) 2016-03-15
JP2016058452A (ja) 2016-04-21
US9534888B2 (en) 2017-01-03
US20160070175A1 (en) 2016-03-10

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