KR101883289B1 - 정밀 특징점 마킹을 위한 고해상도 디지털 암호화된 레이저 스캐너의 최적화 방법 - Google Patents

정밀 특징점 마킹을 위한 고해상도 디지털 암호화된 레이저 스캐너의 최적화 방법 Download PDF

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Publication number
KR101883289B1
KR101883289B1 KR1020140120247A KR20140120247A KR101883289B1 KR 101883289 B1 KR101883289 B1 KR 101883289B1 KR 1020140120247 A KR1020140120247 A KR 1020140120247A KR 20140120247 A KR20140120247 A KR 20140120247A KR 101883289 B1 KR101883289 B1 KR 101883289B1
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KR
South Korea
Prior art keywords
scan
laser beam
laser
substrate
layer
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KR1020140120247A
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English (en)
Korean (ko)
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KR20150029597A (ko
Inventor
켄 그로스
Original Assignee
엔라이트 인크.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Priority claimed from US14/323,954 external-priority patent/US9842665B2/en
Application filed by 엔라이트 인크. filed Critical 엔라이트 인크.
Publication of KR20150029597A publication Critical patent/KR20150029597A/ko
Application granted granted Critical
Publication of KR101883289B1 publication Critical patent/KR101883289B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H01C17/24—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material
    • H01C17/242—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by removing or adding resistive material by laser
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/22—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming
    • H01C17/26—Apparatus or processes specially adapted for manufacturing resistors adapted for trimming by converting resistive material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
KR1020140120247A 2013-09-09 2014-09-11 정밀 특징점 마킹을 위한 고해상도 디지털 암호화된 레이저 스캐너의 최적화 방법 KR101883289B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201361875679P 2013-09-09 2013-09-09
US61/875,679 2013-09-09
US14/323,954 US9842665B2 (en) 2013-02-21 2014-07-03 Optimization of high resolution digitally encoded laser scanners for fine feature marking
US14/323,954 2014-07-03

Publications (2)

Publication Number Publication Date
KR20150029597A KR20150029597A (ko) 2015-03-18
KR101883289B1 true KR101883289B1 (ko) 2018-07-31

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140120247A KR101883289B1 (ko) 2013-09-09 2014-09-11 정밀 특징점 마킹을 위한 고해상도 디지털 암호화된 레이저 스캐너의 최적화 방법

Country Status (3)

Country Link
KR (1) KR101883289B1 (zh)
CN (1) CN104416289B (zh)
TW (1) TWI611855B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018537857A (ja) * 2015-12-03 2018-12-20 マイクロニック アクティエボラーグ ポリマー層を用いてワークピースを製造する方法及びシステム
WO2018035538A1 (en) * 2016-08-19 2018-02-22 Levi Strauss & Co. Laser finishing of apparel
CN110678001A (zh) * 2019-09-18 2020-01-10 深圳市安元达电子有限公司 形成cof细密电路的方法及系统、cof及其加工方法
JP2021178337A (ja) * 2020-05-12 2021-11-18 株式会社ディスコ レーザー加工装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100225974A1 (en) * 2009-03-06 2010-09-09 Micronic Laser Systems Ab Lithographic printing system with placement corrections
CN102441740A (zh) * 2010-10-07 2012-05-09 住友重机械工业株式会社 激光照射装置、激光照射方法及绝缘膜形成装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2962937B2 (ja) * 1992-07-14 1999-10-12 キヤノン株式会社 文字処理装置及び方法
US6639177B2 (en) * 2001-03-29 2003-10-28 Gsi Lumonics Corporation Method and system for processing one or more microstructures of a multi-material device
JP4599553B2 (ja) * 2004-10-01 2010-12-15 国立大学法人北海道大学 レーザ加工方法および装置
US8071912B2 (en) * 2005-11-16 2011-12-06 Technolines, Lp Engineered wood fiber product substrates and their formation by laser processing
JP2008068270A (ja) * 2006-09-12 2008-03-27 Disco Abrasive Syst Ltd レーザー加工装置
JP5489392B2 (ja) * 2007-05-09 2014-05-14 オリンパス株式会社 光学系評価装置、光学系評価方法および光学系評価プログラム
JP4297952B2 (ja) * 2007-05-28 2009-07-15 三菱電機株式会社 レーザ加工装置
CN101733561B (zh) * 2009-11-04 2012-04-11 中国科学院长春光学精密机械与物理研究所 激光修调薄膜电阻中快速精确调整焦面的方法
JP2011215286A (ja) * 2010-03-31 2011-10-27 Brother Industries Ltd 走査光学装置
CN201783759U (zh) * 2010-08-24 2011-04-06 上海市激光技术研究所 光纤激光或碟片激光动态聚焦扫描点轨迹加工系统

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20100225974A1 (en) * 2009-03-06 2010-09-09 Micronic Laser Systems Ab Lithographic printing system with placement corrections
CN102441740A (zh) * 2010-10-07 2012-05-09 住友重机械工业株式会社 激光照射装置、激光照射方法及绝缘膜形成装置

Also Published As

Publication number Publication date
CN104416289B (zh) 2017-09-12
TW201518021A (zh) 2015-05-16
TWI611855B (zh) 2018-01-21
CN104416289A (zh) 2015-03-18
KR20150029597A (ko) 2015-03-18

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