KR101877600B1 - 기판 반송 장치 및 기판 조립 라인 - Google Patents

기판 반송 장치 및 기판 조립 라인 Download PDF

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Publication number
KR101877600B1
KR101877600B1 KR1020147017030A KR20147017030A KR101877600B1 KR 101877600 B1 KR101877600 B1 KR 101877600B1 KR 1020147017030 A KR1020147017030 A KR 1020147017030A KR 20147017030 A KR20147017030 A KR 20147017030A KR 101877600 B1 KR101877600 B1 KR 101877600B1
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KR
South Korea
Prior art keywords
substrate
tray
inner plate
conveyance
transport
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KR1020147017030A
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English (en)
Korean (ko)
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KR20140099505A (ko
Inventor
미치야 요코타
마사유키 와타나베
Original Assignee
신에츠 엔지니어링 가부시키가이샤
신코우 엔지니어링 가부시키가이샤
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Publication of KR20140099505A publication Critical patent/KR20140099505A/ko
Application granted granted Critical
Publication of KR101877600B1 publication Critical patent/KR101877600B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67727—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations using a general scheme of a conveying path within a factory
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Nonlinear Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Liquid Crystal (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)
KR1020147017030A 2011-11-25 2011-11-25 기판 반송 장치 및 기판 조립 라인 KR101877600B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2011/077235 WO2013076874A1 (ja) 2011-11-25 2011-11-25 基板搬送装置及び基板組み立てライン

Publications (2)

Publication Number Publication Date
KR20140099505A KR20140099505A (ko) 2014-08-12
KR101877600B1 true KR101877600B1 (ko) 2018-07-12

Family

ID=47789842

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147017030A KR101877600B1 (ko) 2011-11-25 2011-11-25 기판 반송 장치 및 기판 조립 라인

Country Status (5)

Country Link
JP (1) JP5139604B1 (zh)
KR (1) KR101877600B1 (zh)
CN (1) CN103959453B (zh)
TW (1) TWI511225B (zh)
WO (1) WO2013076874A1 (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101990854B1 (ko) * 2012-05-23 2019-06-19 엘지디스플레이 주식회사 디스플레이장치용 합착장치 및 합착기판 제조방법
JP5395306B1 (ja) * 2013-08-13 2014-01-22 信越エンジニアリング株式会社 貼合デバイスの製造装置及び貼合デバイスの製造方法
JP5934156B2 (ja) * 2013-08-20 2016-06-15 Ｔｏｗａ株式会社 基板の搬送供給方法及び基板の搬送供給装置
CN105247670B (zh) * 2013-12-06 2018-06-12 Ev 集团 E·索尔纳有限责任公司 用于对齐衬底的装置和方法
JP6291275B2 (ja) * 2014-02-13 2018-03-14 東京応化工業株式会社 貼付方法
JP6298381B2 (ja) * 2014-08-08 2018-03-20 日東精機株式会社 基板貼合せ方法および基板貼合せ装置
CN107665848B (zh) * 2016-07-29 2020-08-25 上海微电子装备（集团）股份有限公司 一种解键合调平装置及解键合方法
US10475685B2 (en) * 2016-11-03 2019-11-12 Molecular Imprints, Inc. Substrate loading system
JP2019010692A (ja) * 2017-06-29 2019-01-24 日本電産サンキョー株式会社 産業用ロボットのハンドおよび産業用ロボット
JP6970432B2 (ja) * 2017-11-30 2021-11-24 三星ダイヤモンド工業株式会社 基板整列装置
KR101927801B1 (ko) * 2018-06-27 2019-02-26 주식회사 인스풀 곡면 디스플레이 합착 장치 및 곡면 디스플레이 합착 방법
JP7244068B2 (ja) * 2019-03-26 2023-03-22 新光エンジニアリング株式会社 ワーク貼合装置及びワークステージ
JP6950120B1 (ja) * 2020-10-01 2021-10-13 信越エンジニアリング株式会社 分離装置及び分離方法
JP6932291B1 (ja) * 2020-10-01 2021-09-08 信越エンジニアリング株式会社 微小構造物製造装置及び微小構造物製造方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1174164A (ja) * 1997-08-27 1999-03-16 Canon Inc 基板処理装置、基板支持装置及び基板処理方法並びに基板の製造方法
JP2001005405A (ja) * 1999-06-18 2001-01-12 Hitachi Techno Eng Co Ltd 基板の組立方法およびその装置
KR100360833B1 (ko) * 1999-03-30 2002-11-13 가부시키가이샤 히다치 인더스트리즈 기판의 조립장치
JP2008192746A (ja) * 2007-02-02 2008-08-21 Toshiba Electronic Engineering Corp 物品の搬送具、物品の反転装置、物品の反転方法、フラットパネルディスプレイの製造装置、及びフラットパネルディスプレイの製造方法
JP2010046696A (ja) * 2008-08-22 2010-03-04 Musashino Eng:Kk 原子拡散接合方法及び前記方法により接合された構造体
KR20100063000A (ko) * 2007-08-10 2010-06-10 가부시키가이샤 니콘 기판접합장치 및 기판접합방법
KR100994718B1 (ko) * 2010-07-30 2010-11-16 주식회사 갤럭시아디스플레이 유리기판 합착시스템

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1174164A (ja) * 1997-08-27 1999-03-16 Canon Inc 基板処理装置、基板支持装置及び基板処理方法並びに基板の製造方法
KR100360833B1 (ko) * 1999-03-30 2002-11-13 가부시키가이샤 히다치 인더스트리즈 기판의 조립장치
JP2001005405A (ja) * 1999-06-18 2001-01-12 Hitachi Techno Eng Co Ltd 基板の組立方法およびその装置
JP2008192746A (ja) * 2007-02-02 2008-08-21 Toshiba Electronic Engineering Corp 物品の搬送具、物品の反転装置、物品の反転方法、フラットパネルディスプレイの製造装置、及びフラットパネルディスプレイの製造方法
KR20100063000A (ko) * 2007-08-10 2010-06-10 가부시키가이샤 니콘 기판접합장치 및 기판접합방법
JP2010046696A (ja) * 2008-08-22 2010-03-04 Musashino Eng:Kk 原子拡散接合方法及び前記方法により接合された構造体
KR100994718B1 (ko) * 2010-07-30 2010-11-16 주식회사 갤럭시아디스플레이 유리기판 합착시스템

Also Published As

Publication number Publication date
TW201330155A (zh) 2013-07-16
WO2013076874A1 (ja) 2013-05-30
TWI511225B (zh) 2015-12-01
JPWO2013076874A1 (ja) 2015-04-27
KR20140099505A (ko) 2014-08-12
JP5139604B1 (ja) 2013-02-06
CN103959453A (zh) 2014-07-30
CN103959453B (zh) 2017-03-08

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