KR101876047B1 - 미세 기계 장치 및 그 제조 방법 - Google Patents

미세 기계 장치 및 그 제조 방법 Download PDF

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Publication number
KR101876047B1
KR101876047B1 KR1020160103682A KR20160103682A KR101876047B1 KR 101876047 B1 KR101876047 B1 KR 101876047B1 KR 1020160103682 A KR1020160103682 A KR 1020160103682A KR 20160103682 A KR20160103682 A KR 20160103682A KR 101876047 B1 KR101876047 B1 KR 101876047B1
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KR
South Korea
Prior art keywords
convex portion
substrate
movable
region
convex
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KR1020160103682A
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English (en)
Korean (ko)
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KR20170027280A (ko
Inventor
마사루 소에다
다쿠야 이시하라
마사시 세키네
히데노부 도치기
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아즈빌주식회사
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Publication of KR20170027280A publication Critical patent/KR20170027280A/ko
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Publication of KR101876047B1 publication Critical patent/KR101876047B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00912—Treatments or methods for avoiding stiction of flexible or moving parts of MEMS
    • B81C1/0096—For avoiding stiction when the device is in use, i.e. after manufacture has been completed
    • B81C1/00968—Methods for breaking the stiction bond
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0002—Arrangements for avoiding sticking of the flexible or moving parts
    • B81B3/0008—Structures for avoiding electrostatic attraction, e.g. avoiding charge accumulation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0002—Arrangements for avoiding sticking of the flexible or moving parts
    • B81B3/001—Structures having a reduced contact area, e.g. with bumps or with a textured surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00349—Creating layers of material on a substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0228—Inertial sensors
    • B81B2201/0235—Accelerometers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)
  • Measuring Fluid Pressure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
KR1020160103682A 2015-09-01 2016-08-16 미세 기계 장치 및 그 제조 방법 KR101876047B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2015-171860 2015-09-01
JP2015171860A JP6588773B2 (ja) 2015-09-01 2015-09-01 微細機械装置およびその製造方法

Publications (2)

Publication Number Publication Date
KR20170027280A KR20170027280A (ko) 2017-03-09
KR101876047B1 true KR101876047B1 (ko) 2018-07-06

Family

ID=58273322

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020160103682A KR101876047B1 (ko) 2015-09-01 2016-08-16 미세 기계 장치 및 그 제조 방법

Country Status (4)

Country Link
JP (1) JP6588773B2 (zh)
KR (1) KR101876047B1 (zh)
CN (1) CN106477515B (zh)
TW (1) TWI642617B (zh)

Citations (7)

* Cited by examiner, † Cited by third party
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JP2001092147A (ja) * 1999-09-20 2001-04-06 Ricoh Co Ltd レジストパターン形成方法およびレジストパターン形成装置およびレジストパターンおよびマイクロレンズ
JP2005064324A (ja) * 2003-08-18 2005-03-10 Konica Minolta Holdings Inc 微細形状の加工方法及び光学素子
JP2005233877A (ja) * 2004-02-23 2005-09-02 Alps Electric Co Ltd 圧力センサ
JP2007101282A (ja) * 2005-10-03 2007-04-19 Alps Electric Co Ltd 静電容量型圧力センサ
JP2014055576A (ja) * 2012-09-13 2014-03-27 Ricoh Co Ltd 半導体装置及びその製造方法
KR101489302B1 (ko) * 2013-07-31 2015-02-04 전자부품연구원 압력센서
JP2015211988A (ja) * 2014-05-01 2015-11-26 セイコーエプソン株式会社 Ｍｅｍｓ構造体、電子機器および移動体

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US5311360A (en) * 1992-04-28 1994-05-10 The Board Of Trustees Of The Leland Stanford, Junior University Method and apparatus for modulating a light beam
WO1996023230A1 (de) 1995-01-24 1996-08-01 Siemens Aktiengesellschaft Mikromechanisches bauelement
JPH11340477A (ja) 1998-05-26 1999-12-10 Texas Instr Japan Ltd マイクロマシニングにおける電極のスティッキング防止方法
JP4193232B2 (ja) 1998-07-22 2008-12-10 株式会社デンソー 力学量センサ
JP3527117B2 (ja) 1998-12-24 2004-05-17 富士電機デバイステクノロジー株式会社 半導体力学量センサの製造方法およびその製造装置
JP4329275B2 (ja) 2001-04-03 2009-09-09 株式会社デンソー 力学量センサ
JP3756769B2 (ja) * 2001-03-08 2006-03-15 株式会社山武 静電容量式圧力センサ、センサ素子およびセンサ素子の製造方法
US6791441B2 (en) * 2002-05-07 2004-09-14 Raytheon Company Micro-electro-mechanical switch, and methods of making and using it
JP2007078439A (ja) 2005-09-13 2007-03-29 Sony Corp 容量検出型センサ素子
US7859740B2 (en) * 2008-07-11 2010-12-28 Qualcomm Mems Technologies, Inc. Stiction mitigation with integrated mech micro-cantilevers through vertical stress gradient control
JP2010098518A (ja) * 2008-10-16 2010-04-30 Rohm Co Ltd Ｍｅｍｓセンサの製造方法およびｍｅｍｓセンサ
JP5048633B2 (ja) * 2008-11-13 2012-10-17 アルプス電気株式会社 Ｍｅｍｓセンサの製造方法
US8847087B2 (en) * 2009-09-17 2014-09-30 Panasonic Corporation MEMS switch and communication device using the same
CN102770770B (zh) * 2010-03-08 2014-10-15 阿尔卑斯电气株式会社 物理量传感器
US20120107992A1 (en) * 2010-10-28 2012-05-03 Freescale Semiconductor, Inc. Method of producing layered wafer structure having anti-stiction bumps
US8836055B2 (en) * 2011-09-30 2014-09-16 Taiwan Semiconductor Manufacturing Company, Ltd. MEMS structures and methods for forming the same
US9912255B2 (en) * 2012-04-09 2018-03-06 Pioneer Corporation Electrostatic actuator, variable capacitance capacitor, electric switch, and method for driving electrostatic actuator
JP5973792B2 (ja) * 2012-05-31 2016-08-23 新日本無線株式会社 Ｍｅｍｓ素子の製造方法
TW201423935A (zh) * 2012-12-07 2014-06-16 Powertech Technology Inc 柱狀凸塊具有十字端面之半導體裝置
US9290380B2 (en) * 2012-12-18 2016-03-22 Freescale Semiconductor, Inc. Reducing MEMS stiction by deposition of nanoclusters
US8921956B2 (en) * 2013-01-25 2014-12-30 Infineon Technologies Ag MEMS device having a back plate with elongated protrusions

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001092147A (ja) * 1999-09-20 2001-04-06 Ricoh Co Ltd レジストパターン形成方法およびレジストパターン形成装置およびレジストパターンおよびマイクロレンズ
JP2005064324A (ja) * 2003-08-18 2005-03-10 Konica Minolta Holdings Inc 微細形状の加工方法及び光学素子
JP2005233877A (ja) * 2004-02-23 2005-09-02 Alps Electric Co Ltd 圧力センサ
JP2007101282A (ja) * 2005-10-03 2007-04-19 Alps Electric Co Ltd 静電容量型圧力センサ
JP2014055576A (ja) * 2012-09-13 2014-03-27 Ricoh Co Ltd 半導体装置及びその製造方法
KR101489302B1 (ko) * 2013-07-31 2015-02-04 전자부품연구원 압력센서
JP2015211988A (ja) * 2014-05-01 2015-11-26 セイコーエプソン株式会社 Ｍｅｍｓ構造体、電子機器および移動体

Also Published As

Publication number Publication date
TWI642617B (zh) 2018-12-01
CN106477515A (zh) 2017-03-08
TW201710175A (zh) 2017-03-16
CN106477515B (zh) 2018-06-01
JP6588773B2 (ja) 2019-10-09
KR20170027280A (ko) 2017-03-09
JP2017047497A (ja) 2017-03-09

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