KR101869126B1 - 발광 소자용 기판, 기판용 재료 및 발광 모듈 - Google Patents

발광 소자용 기판, 기판용 재료 및 발광 모듈 Download PDF

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Publication number
KR101869126B1
KR101869126B1 KR1020137030141A KR20137030141A KR101869126B1 KR 101869126 B1 KR101869126 B1 KR 101869126B1 KR 1020137030141 A KR1020137030141 A KR 1020137030141A KR 20137030141 A KR20137030141 A KR 20137030141A KR 101869126 B1 KR101869126 B1 KR 101869126B1
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KR
South Korea
Prior art keywords
light
layer
base layer
thickness
substrate
Prior art date
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KR1020137030141A
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English (en)
Korean (ko)
Other versions
KR20140024383A (ko
Inventor
신지 야마모토
요시미츠 오다
마사아키 이시오
Original Assignee
히타치 긴조쿠 가부시키가이샤
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Publication of KR20140024383A publication Critical patent/KR20140024383A/ko
Application granted granted Critical
Publication of KR101869126B1 publication Critical patent/KR101869126B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
KR1020137030141A 2011-06-02 2012-05-31 발광 소자용 기판, 기판용 재료 및 발광 모듈 KR101869126B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2011124350 2011-06-02
JPJP-P-2011-124350 2011-06-02
PCT/JP2012/064134 WO2012165568A1 (ja) 2011-06-02 2012-05-31 発光素子用基板、基板用材料および発光モジュール

Publications (2)

Publication Number Publication Date
KR20140024383A KR20140024383A (ko) 2014-02-28
KR101869126B1 true KR101869126B1 (ko) 2018-06-19

Family

ID=47259420

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137030141A KR101869126B1 (ko) 2011-06-02 2012-05-31 발광 소자용 기판, 기판용 재료 및 발광 모듈

Country Status (5)

Country Link
JP (1) JP6040938B2 (ja)
KR (1) KR101869126B1 (ja)
CN (1) CN103563109A (ja)
TW (1) TW201310709A (ja)
WO (1) WO2012165568A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107706271A (zh) * 2016-08-08 2018-02-16 深圳市斯迈得半导体有限公司 一种新型结构的led光源的制作方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005197329A (ja) * 2004-01-05 2005-07-21 Stanley Electric Co Ltd 表面実装型半導体装置及びそのリードフレーム構造
JP2008042064A (ja) * 2006-08-09 2008-02-21 Matsushita Electric Ind Co Ltd セラミック配線基板とそれを用いた光学デバイス装置、パッケージおよびセラミック配線基板の製造方法
JP2010192606A (ja) * 2009-02-17 2010-09-02 Toshiba Lighting & Technology Corp 発光装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS607747A (ja) * 1983-06-27 1985-01-16 Nec Corp 樹脂封止型半導体装置
JP5233087B2 (ja) 2006-06-28 2013-07-10 日亜化学工業株式会社 発光装置およびその製造方法、パッケージ、発光素子実装用の基板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005197329A (ja) * 2004-01-05 2005-07-21 Stanley Electric Co Ltd 表面実装型半導体装置及びそのリードフレーム構造
JP2008042064A (ja) * 2006-08-09 2008-02-21 Matsushita Electric Ind Co Ltd セラミック配線基板とそれを用いた光学デバイス装置、パッケージおよびセラミック配線基板の製造方法
JP2010192606A (ja) * 2009-02-17 2010-09-02 Toshiba Lighting & Technology Corp 発光装置

Also Published As

Publication number Publication date
TW201310709A (zh) 2013-03-01
JP6040938B2 (ja) 2016-12-07
JPWO2012165568A1 (ja) 2015-02-23
WO2012165568A1 (ja) 2012-12-06
CN103563109A (zh) 2014-02-05
KR20140024383A (ko) 2014-02-28

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