KR101863178B1 - 개선된 선택도를 갖는 이산화규소의 증기 에칭 - Google Patents

개선된 선택도를 갖는 이산화규소의 증기 에칭 Download PDF

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Publication number
KR101863178B1
KR101863178B1 KR1020137021088A KR20137021088A KR101863178B1 KR 101863178 B1 KR101863178 B1 KR 101863178B1 KR 1020137021088 A KR1020137021088 A KR 1020137021088A KR 20137021088 A KR20137021088 A KR 20137021088A KR 101863178 B1 KR101863178 B1 KR 101863178B1
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South Korea
Prior art keywords
etching
silicon dioxide
process chamber
increasing
sio
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Korean (ko)
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KR20140039163A (ko
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안쏘니 오하라
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멤스스타 리미티드
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/60—Wet etching
    • H10P50/64—Wet etching of semiconductor materials
    • H10P50/642—Chemical etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00523—Etching material
    • B81C1/00531—Dry etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00436—Shaping materials, i.e. techniques for structuring the substrate or the layers on the substrate
    • B81C1/00555—Achieving a desired geometry, i.e. controlling etch rates, anisotropy or selectivity
    • B81C1/00595—Control etch selectivity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
    • H10P50/246—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group III-V materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
    • H10P50/282—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials
    • H10P50/283—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials by chemical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0102—Surface micromachining
    • B81C2201/0105—Sacrificial layer
    • B81C2201/0109—Sacrificial layers not provided for in B81C2201/0107 - B81C2201/0108
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0128—Processes for removing material
    • B81C2201/013—Etching
    • B81C2201/0132—Dry etching, i.e. plasma etching, barrel etching, reactive ion etching [RIE], sputter etching or ion milling

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Drying Of Semiconductors (AREA)
  • Micromachines (AREA)
  • Formation Of Insulating Films (AREA)
KR1020137021088A 2011-01-24 2012-01-24 개선된 선택도를 갖는 이산화규소의 증기 에칭 Active KR101863178B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB1101188.9A GB2487716B (en) 2011-01-24 2011-01-24 Vapour Etch of Silicon Dioxide with Improved Selectivity
GB1101188.9 2011-01-24
PCT/GB2012/050144 WO2012101431A1 (en) 2011-01-24 2012-01-24 Vapour etch of silicon dioxide with improved selectivity

Publications (2)

Publication Number Publication Date
KR20140039163A KR20140039163A (ko) 2014-04-01
KR101863178B1 true KR101863178B1 (ko) 2018-05-31

Family

ID=43769521

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020137021088A Active KR101863178B1 (ko) 2011-01-24 2012-01-24 개선된 선택도를 갖는 이산화규소의 증기 에칭

Country Status (9)

Country Link
US (1) US10354884B2 (https=)
EP (1) EP2668312B8 (https=)
JP (1) JP5864612B2 (https=)
KR (1) KR101863178B1 (https=)
CN (1) CN103328688B (https=)
DK (1) DK2668312T3 (https=)
ES (1) ES2767108T3 (https=)
GB (1) GB2487716B (https=)
WO (1) WO2012101431A1 (https=)

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CN105632918A (zh) * 2014-10-30 2016-06-01 中国科学院微电子研究所 一种FinFet器件源漏外延前自然氧化层的去除方法
CN104316577B (zh) * 2014-10-31 2016-12-07 中国矿业大学 一种基于倒装焊封装的甲烷传感器及其制备方法与应用
JP6530289B2 (ja) * 2015-09-11 2019-06-12 東芝メモリ株式会社 分析前処理装置
WO2017176027A1 (ko) * 2016-04-05 2017-10-12 주식회사 테스 실리콘산화막의 선택적 식각 방법
US10497579B2 (en) * 2017-05-31 2019-12-03 Applied Materials, Inc. Water-free etching methods
CN108847391B (zh) * 2018-06-01 2021-06-08 北京北方华创微电子装备有限公司 一种非等离子干法刻蚀方法
CN110718459A (zh) * 2018-07-13 2020-01-21 北京北方华创微电子装备有限公司 非等离子体刻蚀方法及刻蚀设备
GB2580858B (en) * 2018-09-07 2021-07-21 Memsstar Ltd A method for detecting defects in thin film layers
EP4056000A4 (en) 2019-11-06 2024-05-29 Ttm Technologies Inc. SYSTEMS AND METHODS FOR REMOVING UNWANTED METAL FROM PRINTED CIRCUIT BOARD VIAS
GB202117751D0 (en) 2019-11-14 2022-01-26 Memsstar Ltd Method of manufacturing a microstructure
CN113785382B (zh) * 2020-04-10 2023-10-27 株式会社日立高新技术 蚀刻方法
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Also Published As

Publication number Publication date
DK2668312T3 (da) 2020-02-17
ES2767108T3 (es) 2020-06-16
WO2012101431A1 (en) 2012-08-02
GB2487716A (en) 2012-08-08
GB201101188D0 (en) 2011-03-09
JP5864612B2 (ja) 2016-02-17
CN103328688A (zh) 2013-09-25
EP2668312B8 (en) 2019-12-25
US10354884B2 (en) 2019-07-16
EP2668312A1 (en) 2013-12-04
EP2668312B1 (en) 2019-11-20
CN103328688B (zh) 2016-03-23
JP2014504805A (ja) 2014-02-24
US20140017901A1 (en) 2014-01-16
KR20140039163A (ko) 2014-04-01
GB2487716B (en) 2015-06-03

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