KR101832480B1 - 접합을 생성시키는 방법 - Google Patents
접합을 생성시키는 방법 Download PDFInfo
- Publication number
- KR101832480B1 KR101832480B1 KR1020127012966A KR20127012966A KR101832480B1 KR 101832480 B1 KR101832480 B1 KR 101832480B1 KR 1020127012966 A KR1020127012966 A KR 1020127012966A KR 20127012966 A KR20127012966 A KR 20127012966A KR 101832480 B1 KR101832480 B1 KR 101832480B1
- Authority
- KR
- South Korea
- Prior art keywords
- sensitive adhesive
- pressure
- release
- release layer
- product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2465/00—Presence of polyphenylene
- C09J2465/005—Presence of polyphenylene in the release coating
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/14—Layer or component removable to expose adhesive
- Y10T428/1476—Release layer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesive Tapes (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Joining Of Glass To Other Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102009045812A DE102009045812A1 (de) | 2009-10-19 | 2009-10-19 | Verfahren zur Herstellung von Verklebungen |
| DE102009045812.3 | 2009-10-19 | ||
| PCT/EP2010/064845 WO2011047958A1 (de) | 2009-10-19 | 2010-10-05 | Verfahren zur herstellung von verklebungen |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20120089326A KR20120089326A (ko) | 2012-08-09 |
| KR101832480B1 true KR101832480B1 (ko) | 2018-02-26 |
Family
ID=43413665
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020127012966A Expired - Fee Related KR101832480B1 (ko) | 2009-10-19 | 2010-10-05 | 접합을 생성시키는 방법 |
Country Status (12)
| Country | Link |
|---|---|
| US (1) | US9499722B2 (enExample) |
| EP (1) | EP2491086B1 (enExample) |
| JP (1) | JP2013508487A (enExample) |
| KR (1) | KR101832480B1 (enExample) |
| CN (1) | CN102597143A (enExample) |
| BR (1) | BR112012009097A2 (enExample) |
| DE (1) | DE102009045812A1 (enExample) |
| IN (1) | IN2012DN02685A (enExample) |
| MX (1) | MX2012003824A (enExample) |
| PL (1) | PL2491086T3 (enExample) |
| TW (1) | TWI568590B (enExample) |
| WO (1) | WO2011047958A1 (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102011120830A1 (de) | 2011-12-13 | 2013-06-13 | Baumer Hhs Gmbh | Verfahren zur Herstellung eines Haftklebeprodukts mit unterschiedlichen Hafteigenschaften |
| JP5972009B2 (ja) * | 2012-03-30 | 2016-08-17 | デクセリアルズ株式会社 | 回路接続材料、及びこれを用いた実装体の製造方法 |
| TWI502161B (zh) * | 2012-07-17 | 2015-10-01 | Lite On Technology Corp | 組合發熱元件與散熱件的方法、感壓結合件 |
| CN104053542A (zh) * | 2012-12-21 | 2014-09-17 | 祐平·菲利普·林 | 膜总成及贴附该膜总成的方法 |
| DE102013206624A1 (de) * | 2013-04-15 | 2014-10-16 | Tesa Se | Haftklebemasse und Verwendung derselben in einem Haftklebstreifen |
| DE102013113532A1 (de) * | 2013-12-05 | 2015-06-11 | Huhtamaki Films Germany Gmbh & Co. Kg | Vorläuferverbundmaterial, Verbundmaterial, Verfahren zur Herstellung eines Vorläuferverbundmaterials, Verfahren zur Herstellung eines Verbundmaterials und Verwendung eines Vorläuferverbundmaterials und eines Verbundmaterials |
| DE102018101331A1 (de) | 2018-01-22 | 2019-07-25 | Infiana Germany Gmbh & Co. Kg | Bedruckte und beschichtete Trennfolie |
| US11304296B2 (en) | 2018-04-28 | 2022-04-12 | Shenzhen Royole Technologies Co., Ltd. | Substrate, electronic device, and bonding method |
| DE102018218283A1 (de) * | 2018-09-11 | 2020-03-12 | Tesa Se | Verfahren zum Aufbringen von Stanzteilen auf Oberflächen sowie Testverfahren dafür |
| JP2021091776A (ja) * | 2019-12-10 | 2021-06-17 | フジコピアン株式会社 | 転写式感圧接着テープ |
| DE102024107479B3 (de) * | 2024-03-15 | 2025-06-12 | Tesa Se | Verfahren zur Herstellung eines mehrlagigen Empfängermaterials für den Einsatz bei der Verarbeitung von MicroLED und ein Ausgangsfolienelement zur Bereitstellung dafür geeignet und ein mehrlagiges Empfängermaterial und dessen Verwendung in einem solchen Verfahren |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003096414A (ja) * | 2001-09-26 | 2003-04-03 | Nitto Denko Corp | 剥離ライナー、及び感圧性両面接着テープ又はシート |
Family Cites Families (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3632386A (en) | 1968-10-31 | 1972-01-04 | Arbco Inc | Treated silicone surface |
| US4181752A (en) | 1974-09-03 | 1980-01-01 | Minnesota Mining And Manufacturing Company | Acrylic-type pressure sensitive adhesives by means of ultraviolet radiation curing |
| EP0216376B1 (en) | 1982-09-10 | 1991-08-07 | General Electric Company | Process for making solventless release diorganopolysiloxane composition |
| US4454266A (en) | 1983-04-11 | 1984-06-12 | Daubert Coated Products Inc. | Release coating compositions |
| US4728571A (en) | 1985-07-19 | 1988-03-01 | Minnesota Mining And Manufacturing Company | Polysiloxane-grafted copolymer release coating sheets and adhesive tapes |
| US5082706A (en) * | 1988-11-23 | 1992-01-21 | Dow Corning Corporation | Pressure sensitive adhesive/release liner laminate |
| US5100976A (en) * | 1990-01-16 | 1992-03-31 | Dow Corning Corporation | Silicon pressure sensitive adhesive compositions |
| US5208300A (en) * | 1991-08-22 | 1993-05-04 | Dow Corning Corporation | Solution-stable, moisture-curable silicone pressure sensitive adhesives |
| US5281455A (en) | 1991-08-22 | 1994-01-25 | Dow Corning Corporation | Laminate article comprising moisture-curable silicone pressure sensitive adhesive and release liner |
| DE4319023C1 (de) | 1993-06-01 | 1994-09-29 | Neschen Hans Gmbh & Co Kg | Druckempfindliches, trägerloses, beidseitig selbstklebendes Band und Verwendung eines Polyacrylsäureesterhaftklebers zu dessen Herstellung |
| CA2174973A1 (en) * | 1993-11-10 | 1995-05-18 | Greggory S. Bennett | Pressure sensitive adhesives |
| DE69824274T2 (de) | 1998-03-13 | 2005-06-09 | Minnesota Mining And Mfg. Co., St. Paul | Klebeband zum Befestigen von Einlagen auf der Seite einer Zeitschrift |
| DE19911063A1 (de) * | 1999-03-12 | 2001-01-25 | Lohmann Gmbh & Co Kg | Mehrlagige, kreuzgewickelte Spule aus trägerlosem, beidseitig haftklebendem Transferklebeband |
| JP4825992B2 (ja) * | 1999-08-11 | 2011-11-30 | 綜研化学株式会社 | アクリル系粘着剤組成物、該組成物を用いた粘着テープの製造方法および粘着テープ |
| JP2001279199A (ja) | 2000-03-29 | 2001-10-10 | Sekisui Chem Co Ltd | 両面粘着テープ |
| CN1221621C (zh) * | 2000-09-14 | 2005-10-05 | 罗姆和哈斯公司 | 包含接枝共聚物的粘合剂组合物 |
| JP2003013027A (ja) * | 2001-06-28 | 2003-01-15 | Sekisui Chem Co Ltd | アクリル系粘着剤組成物及び粘着テープ |
| US6805933B2 (en) * | 2001-07-31 | 2004-10-19 | 3M Innovative Properties Company | Articles comprising a release liner having a high coefficient of friction and good roll stability |
| US20070031641A1 (en) * | 2003-09-05 | 2007-02-08 | 3M Innovative Properties Company | License plate for back illumination and method for making same |
| DE10357322A1 (de) * | 2003-12-05 | 2005-06-30 | Tesa Ag | Zweischichtige Haftklebemasse |
| EP2426185A1 (en) * | 2004-04-30 | 2012-03-07 | 3M Innovative Properties Company | Roll stabilized double-sided pressure sensitive adhesive tape assembly |
| CN101451054A (zh) * | 2004-05-18 | 2009-06-10 | 日立化成工业株式会社 | 粘接接合片与使用该粘接接合片的半导体装置以及其制造方法 |
| DE102005054781A1 (de) * | 2005-11-15 | 2007-05-16 | Tesa Ag | Verwendung eines doppelseitigen Haftklebebandes zur Verklebung bei der Herstellung von Elektronikartikel |
| KR100965378B1 (ko) | 2005-12-07 | 2010-06-22 | 도레이첨단소재 주식회사 | 박리력을 조절할 수 있는 실리콘 이형 조성물 및 이를 코팅한 실리콘 이형필름 |
| JP5063008B2 (ja) * | 2006-02-16 | 2012-10-31 | 日東電工株式会社 | 両面粘着テープ又はシート |
| KR20090099073A (ko) * | 2006-12-25 | 2009-09-21 | 린텍 가부시키가이샤 | 화소 제어 소자 매립용 디스플레이기판 |
| US8367212B2 (en) | 2007-01-18 | 2013-02-05 | Shin-Etsu Chemical Co., Ltd. | Ultraviolet-curable silicone composition |
| JP2009256607A (ja) * | 2008-03-17 | 2009-11-05 | Nitto Denko Corp | アクリル系粘着剤、アクリル系粘着剤層、アクリル系粘着テープ又はシート |
| JP5351432B2 (ja) * | 2008-04-10 | 2013-11-27 | リンテック株式会社 | 両面粘着シートおよびその製造方法 |
-
2009
- 2009-10-19 DE DE102009045812A patent/DE102009045812A1/de not_active Withdrawn
-
2010
- 2010-10-05 KR KR1020127012966A patent/KR101832480B1/ko not_active Expired - Fee Related
- 2010-10-05 EP EP10760714.5A patent/EP2491086B1/de not_active Not-in-force
- 2010-10-05 PL PL10760714.5T patent/PL2491086T3/pl unknown
- 2010-10-05 MX MX2012003824A patent/MX2012003824A/es not_active Application Discontinuation
- 2010-10-05 CN CN2010800470276A patent/CN102597143A/zh active Pending
- 2010-10-05 JP JP2012534615A patent/JP2013508487A/ja active Pending
- 2010-10-05 BR BR112012009097A patent/BR112012009097A2/pt not_active Application Discontinuation
- 2010-10-05 IN IN2685DEN2012 patent/IN2012DN02685A/en unknown
- 2010-10-05 US US13/502,304 patent/US9499722B2/en not_active Expired - Fee Related
- 2010-10-05 WO PCT/EP2010/064845 patent/WO2011047958A1/de not_active Ceased
- 2010-10-06 TW TW099134007A patent/TWI568590B/zh not_active IP Right Cessation
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003096414A (ja) * | 2001-09-26 | 2003-04-03 | Nitto Denko Corp | 剥離ライナー、及び感圧性両面接着テープ又はシート |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2491086B1 (de) | 2016-01-27 |
| IN2012DN02685A (enExample) | 2015-09-04 |
| US20120251757A1 (en) | 2012-10-04 |
| JP2013508487A (ja) | 2013-03-07 |
| TWI568590B (zh) | 2017-02-01 |
| PL2491086T3 (pl) | 2016-09-30 |
| WO2011047958A1 (de) | 2011-04-28 |
| EP2491086A1 (de) | 2012-08-29 |
| DE102009045812A1 (de) | 2011-04-28 |
| CN102597143A (zh) | 2012-07-18 |
| TW201119870A (en) | 2011-06-16 |
| BR112012009097A2 (pt) | 2016-05-03 |
| KR20120089326A (ko) | 2012-08-09 |
| MX2012003824A (es) | 2012-05-08 |
| US9499722B2 (en) | 2016-11-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
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| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| R17-X000 | Change to representative recorded |
St.27 status event code: A-3-3-R10-R17-oth-X000 |
|
| A201 | Request for examination | ||
| AMND | Amendment | ||
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
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| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
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| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
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| E14-X000 | Pre-grant third party observation filed |
St.27 status event code: A-2-3-E10-E14-opp-X000 |
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| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
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| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
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| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| AMND | Amendment | ||
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
St.27 status event code: N-2-6-B10-B15-exm-PE0601 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| AMND | Amendment | ||
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PX0901 | Re-examination |
St.27 status event code: A-2-3-E10-E12-rex-PX0901 |
|
| T13-X000 | Administrative time limit extension granted |
St.27 status event code: U-3-3-T10-T13-oth-X000 |
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| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
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| AMND | Amendment | ||
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