KR101819374B1 - 표시 장치 - Google Patents

표시 장치 Download PDF

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KR101819374B1
KR101819374B1 KR1020160132857A KR20160132857A KR101819374B1 KR 101819374 B1 KR101819374 B1 KR 101819374B1 KR 1020160132857 A KR1020160132857 A KR 1020160132857A KR 20160132857 A KR20160132857 A KR 20160132857A KR 101819374 B1 KR101819374 B1 KR 101819374B1
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KR20170059382A (ko
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유스께 고또
다까시 사에끼
도시히로 사또
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가부시키가이샤 재팬 디스프레이
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H01L51/0097—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H01L51/5246—
    • H01L51/5253—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441—Interconnections, e.g. scanning lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H01L2227/32—
    • H01L2251/5338—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Electroluminescent Light Sources (AREA)
  • Structure Of Printed Boards (AREA)
KR1020160132857A 2015-11-20 2016-10-13 표시 장치 Active KR101819374B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015227554A JP6423781B2 (ja) 2015-11-20 2015-11-20 表示装置
JPJP-P-2015-227554 2015-11-20

Publications (2)

Publication Number Publication Date
KR20170059382A KR20170059382A (ko) 2017-05-30
KR101819374B1 true KR101819374B1 (ko) 2018-01-16

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Family Applications (1)

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KR1020160132857A Active KR101819374B1 (ko) 2015-11-20 2016-10-13 표시 장치

Country Status (4)

Country Link
US (1) US9806284B2 (https=)
JP (1) JP6423781B2 (https=)
KR (1) KR101819374B1 (https=)
CN (1) CN106783870B (https=)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6152409B1 (ja) * 2015-12-21 2017-06-21 レノボ・シンガポール・プライベート・リミテッド 粘着部材および電子機器
KR101821782B1 (ko) 2016-03-11 2018-01-25 삼성디스플레이 주식회사 디스플레이 장치 제조방법 및 디스플레이 장치
KR102572720B1 (ko) * 2016-05-03 2023-08-31 삼성디스플레이 주식회사 디스플레이 장치 및 그 제조방법
JP6804243B2 (ja) * 2016-09-08 2020-12-23 株式会社ジャパンディスプレイ 表示装置
JP2018105976A (ja) * 2016-12-26 2018-07-05 株式会社ジャパンディスプレイ 表示装置
JP2019012099A (ja) * 2017-06-29 2019-01-24 株式会社ジャパンディスプレイ 表示装置及びその製造方法
JP7029948B2 (ja) * 2017-12-04 2022-03-04 株式会社ジャパンディスプレイ 表示装置
CN108389886B (zh) * 2018-04-17 2021-11-30 京东方科技集团股份有限公司 一种背板组件及显示面板
CN109147564B (zh) * 2018-09-29 2021-07-09 上海天马微电子有限公司 显示面板、显示装置及显示面板制作方法
CN109448553A (zh) * 2018-11-22 2019-03-08 京东方科技集团股份有限公司 盖板、显示装置以及盖板制作方法
CN112153176B (zh) * 2019-06-27 2021-08-13 Oppo广东移动通信有限公司 电子设备
CN110297346B (zh) * 2019-06-28 2022-07-12 广州国显科技有限公司 一种显示面板及其制作方法
US11468832B2 (en) 2019-11-08 2022-10-11 Beijing Boe Technology Development Co., Ltd. Array substrate and method for manufacturing same, display panel, and display device
CN111725424A (zh) * 2020-06-11 2020-09-29 武汉华星光电半导体显示技术有限公司 一种显示面板
KR102743166B1 (ko) 2020-07-15 2024-12-18 삼성디스플레이 주식회사 전자 장치
CN112530295B (zh) * 2020-12-28 2022-09-27 厦门天马微电子有限公司 一种显示装置
CN112927628B (zh) * 2021-01-28 2023-10-27 京东方科技集团股份有限公司 一种显示面板及显示装置
KR102873685B1 (ko) * 2021-11-15 2025-10-17 엘지디스플레이 주식회사 디스플레이 장치
CN114863808B (zh) * 2022-04-08 2023-05-12 荣耀终端有限公司 屏幕组件、电子设备及组装方法
CN115294866B (zh) * 2022-08-01 2024-01-02 厦门天马显示科技有限公司 一种复合胶带及其塑形方法、显示面板和显示装置

Citations (1)

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JP5019604B2 (ja) 2007-09-20 2012-09-05 株式会社ジャパンディスプレイセントラル 液晶表示装置

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JPS6013274B2 (ja) * 1976-09-20 1985-04-05 日本メクトロン株式会社 フレキシブルサ−キツトに於ける端子構造及びその製造方法
JP3764945B2 (ja) * 2000-04-25 2006-04-12 カシオ計算機株式会社 表示モジュール
EP1528594B1 (en) * 2003-10-28 2019-05-29 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device
JP2006349788A (ja) * 2005-06-14 2006-12-28 Sanyo Epson Imaging Devices Corp 電気光学装置、電気光学装置の製造方法、及び電子機器
JP4692816B2 (ja) 2005-07-13 2011-06-01 住友ベークライト株式会社 フレキシブルプリント基板
JP2010098645A (ja) 2008-10-20 2010-04-30 Seiko Epson Corp プロジェクター、投写システム、プログラムおよび情報記憶媒体
JP5507237B2 (ja) * 2009-12-25 2014-05-28 株式会社ジャパンディスプレイ 液晶表示装置
JP2013003171A (ja) * 2011-06-10 2013-01-07 Bridgestone Corp 情報表示パネルモジュール
KR102117890B1 (ko) * 2012-12-28 2020-06-02 엘지디스플레이 주식회사 플렉서블 표시 장치 및 플렉서블 표시 장치 제조 방법
US9349969B2 (en) * 2013-02-01 2016-05-24 Lg Display Co., Ltd. Electronic devices with flexible display and method for manufacturing the same
KR102009670B1 (ko) * 2013-02-28 2019-08-13 엘지디스플레이 주식회사 플렉서블 디스플레이 장치 및 그 제조 방법
KR102035462B1 (ko) 2013-03-27 2019-10-23 엘지디스플레이 주식회사 슬릿코터 및 이의 구동방법, 이를 이용한 플렉서블 표시장치 및 이의 제조방법
KR102081650B1 (ko) * 2013-04-10 2020-02-26 엘지디스플레이 주식회사 플렉서블 디스플레이 장치 및 그 제조 방법
KR102090200B1 (ko) * 2013-08-08 2020-03-18 삼성디스플레이 주식회사 유기 발광 표시 장치

Patent Citations (1)

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JP5019604B2 (ja) 2007-09-20 2012-09-05 株式会社ジャパンディスプレイセントラル 液晶表示装置

Also Published As

Publication number Publication date
US20170148857A1 (en) 2017-05-25
JP6423781B2 (ja) 2018-11-14
CN106783870A (zh) 2017-05-31
KR20170059382A (ko) 2017-05-30
JP2017097096A (ja) 2017-06-01
US9806284B2 (en) 2017-10-31
CN106783870B (zh) 2020-04-17

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