KR101813818B1 - 프린트 배선 기판용 구리박 - Google Patents

프린트 배선 기판용 구리박 Download PDF

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Publication number
KR101813818B1
KR101813818B1 KR1020167001515A KR20167001515A KR101813818B1 KR 101813818 B1 KR101813818 B1 KR 101813818B1 KR 1020167001515 A KR1020167001515 A KR 1020167001515A KR 20167001515 A KR20167001515 A KR 20167001515A KR 101813818 B1 KR101813818 B1 KR 101813818B1
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KR
South Korea
Prior art keywords
copper foil
less
tensile strength
temperature
printed wiring
Prior art date
Application number
KR1020167001515A
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English (en)
Korean (ko)
Other versions
KR20160037888A (ko
Inventor
다께시 에즈라
다까히로 사이또
겐사꾸 시노자끼
기미꼬 후지사와
Original Assignee
후루카와 덴키 고교 가부시키가이샤
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First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=52431801&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR101813818(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 후루카와 덴키 고교 가부시키가이샤 filed Critical 후루카와 덴키 고교 가부시키가이샤
Publication of KR20160037888A publication Critical patent/KR20160037888A/ko
Application granted granted Critical
Publication of KR101813818B1 publication Critical patent/KR101813818B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H01B1/026—Alloys based on copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
KR1020167001515A 2013-08-01 2014-07-30 프린트 배선 기판용 구리박 KR101813818B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2013-160312 2013-08-01
JP2013160312 2013-08-01
PCT/JP2014/070090 WO2015016271A1 (ja) 2013-08-01 2014-07-30 プリント配線基板用銅箔

Publications (2)

Publication Number Publication Date
KR20160037888A KR20160037888A (ko) 2016-04-06
KR101813818B1 true KR101813818B1 (ko) 2017-12-29

Family

ID=52431801

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167001515A KR101813818B1 (ko) 2013-08-01 2014-07-30 프린트 배선 기판용 구리박

Country Status (5)

Country Link
JP (1) JP5889443B2 (zh)
KR (1) KR101813818B1 (zh)
CN (1) CN105492660B (zh)
TW (1) TWI639363B (zh)
WO (1) WO2015016271A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6294862B2 (ja) * 2015-12-09 2018-03-14 古河電気工業株式会社 プリント配線板用表面処理銅箔、プリント配線板用銅張積層板及びプリント配線板
JP6182584B2 (ja) * 2015-12-09 2017-08-16 古河電気工業株式会社 プリント配線板用表面処理銅箔、プリント配線板用銅張積層板及びプリント配線板
KR101734840B1 (ko) * 2016-11-11 2017-05-15 일진머티리얼즈 주식회사 내굴곡성이 우수한 이차전지용 전해동박 및 그의 제조방법
US10190225B2 (en) * 2017-04-18 2019-01-29 Chang Chun Petrochemical Co., Ltd. Electrodeposited copper foil with low repulsive force

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004339558A (ja) 2003-05-14 2004-12-02 Fukuda Metal Foil & Powder Co Ltd 低粗面電解銅箔及びその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5431803A (en) * 1990-05-30 1995-07-11 Gould Electronics Inc. Electrodeposited copper foil and process for making same
MY138743A (en) * 1996-05-13 2009-07-31 Mitsui Mining & Smelting Co High tensile strength electrodeposited copper foil and the production process of the same
JPH10330983A (ja) * 1997-05-30 1998-12-15 Fukuda Metal Foil & Powder Co Ltd 電解銅箔及びその製造方法
KR101154203B1 (ko) * 2006-04-28 2012-06-18 미쓰이 긴조꾸 고교 가부시키가이샤 전해 동박, 그 전해 동박을 이용한 표면 처리 동박 및 그 표면 처리 동박을 이용한 동박 적층판 및 그 전해 동박의 제조 방법
JP5771392B2 (ja) * 2010-12-28 2015-08-26 日本電解株式会社 電解銅箔およびその製造方法
JP5595301B2 (ja) * 2011-02-22 2014-09-24 Ｊｘ日鉱日石金属株式会社 銅電解液
JP5595320B2 (ja) * 2011-03-31 2014-09-24 Ｊｘ日鉱日石金属株式会社 銅電解液

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004339558A (ja) 2003-05-14 2004-12-02 Fukuda Metal Foil & Powder Co Ltd 低粗面電解銅箔及びその製造方法

Also Published As

Publication number Publication date
CN105492660A (zh) 2016-04-13
JP5889443B2 (ja) 2016-03-22
WO2015016271A1 (ja) 2015-02-05
JPWO2015016271A1 (ja) 2017-03-02
CN105492660B (zh) 2017-12-01
TW201524277A (zh) 2015-06-16
TWI639363B (zh) 2018-10-21
KR20160037888A (ko) 2016-04-06

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