KR101803390B1 - 캐리어 부착 극박 동박, 그리고 이것을 이용하여 제작된 구리 클래드 적층판, 프린트 배선 기판 및 코어리스 기판 - Google Patents

캐리어 부착 극박 동박, 그리고 이것을 이용하여 제작된 구리 클래드 적층판, 프린트 배선 기판 및 코어리스 기판 Download PDF

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Publication number
KR101803390B1
KR101803390B1 KR1020167000224A KR20167000224A KR101803390B1 KR 101803390 B1 KR101803390 B1 KR 101803390B1 KR 1020167000224 A KR1020167000224 A KR 1020167000224A KR 20167000224 A KR20167000224 A KR 20167000224A KR 101803390 B1 KR101803390 B1 KR 101803390B1
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KR
South Korea
Prior art keywords
carrier
ultra
foil
copper foil
thin copper
Prior art date
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KR1020167000224A
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English (en)
Korean (ko)
Other versions
KR20160048755A (ko
Inventor
료타 후지타
타케오 우노
Original Assignee
후루카와 덴키 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of KR20160048755A publication Critical patent/KR20160048755A/ko
Application granted granted Critical
Publication of KR101803390B1 publication Critical patent/KR101803390B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes
    • C25D1/22—Separating compounds
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4658—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern characterized by laminating a prefabricated metal foil pattern, e.g. by transfer
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/562—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/58—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0147—Carriers and holders
    • H05K2203/0156—Temporary polymeric carrier or foil, e.g. for processing or transferring

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Electroplating Methods And Accessories (AREA)
KR1020167000224A 2014-02-14 2015-01-23 캐리어 부착 극박 동박, 그리고 이것을 이용하여 제작된 구리 클래드 적층판, 프린트 배선 기판 및 코어리스 기판 KR101803390B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2014-026047 2014-02-14
JP2014026047 2014-02-14
PCT/JP2015/051886 WO2015122258A1 (ja) 2014-02-14 2015-01-23 キャリア付き極薄銅箔、並びにこれを用いて作製された銅張積層板、プリント配線基板及びコアレス基板

Publications (2)

Publication Number Publication Date
KR20160048755A KR20160048755A (ko) 2016-05-04
KR101803390B1 true KR101803390B1 (ko) 2017-11-30

Family

ID=53800006

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167000224A KR101803390B1 (ko) 2014-02-14 2015-01-23 캐리어 부착 극박 동박, 그리고 이것을 이용하여 제작된 구리 클래드 적층판, 프린트 배선 기판 및 코어리스 기판

Country Status (5)

Country Link
JP (1) JP5830635B1 (ja)
KR (1) KR101803390B1 (ja)
CN (1) CN105378150B (ja)
TW (1) TWI606152B (ja)
WO (1) WO2015122258A1 (ja)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6708398B2 (ja) * 2015-11-28 2020-06-10 キヤノン株式会社 貫通配線基板の製造方法及びこれを用いたデバイスの製造方法
US9955588B1 (en) 2016-11-28 2018-04-24 Chang Chun Petrochemical Co., Ltd. Multilayer carrier foil
JP7095224B2 (ja) * 2017-03-28 2022-07-05 昭和電工マテリアルズ株式会社 コアレス基板用プリプレグ、コアレス基板用プリプレグの製造方法及び製造装置、並びにコアレス基板及びその製造方法
JP2018171899A (ja) * 2017-03-31 2018-11-08 Ｊｘ金属株式会社 離型層付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
CN110798986A (zh) * 2018-12-10 2020-02-14 广州方邦电子股份有限公司 一种带载体的金属箔
CN111295055A (zh) * 2018-12-10 2020-06-16 广州方邦电子股份有限公司 一种复合金属箔的制备方法
CN110785015A (zh) * 2018-12-10 2020-02-11 广州方邦电子股份有限公司 一种复合金属箔
JP2020131552A (ja) * 2019-02-20 2020-08-31 株式会社東芝 キャリアおよび半導体装置の製造方法
CN113386417A (zh) * 2021-07-08 2021-09-14 江西柔顺科技有限公司 一种覆铜板及其制备方法
CN115058711B (zh) * 2022-06-17 2022-12-27 山东大学 一种易剥离的超薄载体铜箔的制备方法
TW202410319A (zh) * 2022-08-26 2024-03-01 日商Ｍｇｃ電子科技股份有限公司 積層體、及無芯基板之製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004169181A (ja) * 2002-10-31 2004-06-17 Furukawa Techno Research Kk キャリア付き極薄銅箔、及びその製造方法、キャリア付き極薄銅箔を用いたプリント配線基板
JP2006022406A (ja) * 2000-09-22 2006-01-26 Furukawa Circuit Foil Kk キャリア付き極薄銅箔
JP2013243396A (ja) * 2013-07-29 2013-12-05 Jx Nippon Mining & Metals Corp キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板用キャリア付銅箔及びプリント配線板

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012046804A1 (ja) * 2010-10-06 2012-04-12 古河電気工業株式会社 銅箔及びその製造方法、キャリア付き銅箔及びその製造方法、プリント配線板、多層プリント配線板
CN103430640B (zh) * 2011-03-30 2016-10-26 三井金属矿业株式会社 多层印刷线路板的制造方法
JP5922227B2 (ja) * 2012-04-24 2016-05-24 Ｊｘ金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法及びプリント配線板の製造方法
JP6310193B2 (ja) * 2013-07-02 2018-04-11 Ｊｘ金属株式会社 キャリア付銅箔、その製造方法、銅張積層板の製造方法及びプリント配線板の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006022406A (ja) * 2000-09-22 2006-01-26 Furukawa Circuit Foil Kk キャリア付き極薄銅箔
JP2004169181A (ja) * 2002-10-31 2004-06-17 Furukawa Techno Research Kk キャリア付き極薄銅箔、及びその製造方法、キャリア付き極薄銅箔を用いたプリント配線基板
JP2013243396A (ja) * 2013-07-29 2013-12-05 Jx Nippon Mining & Metals Corp キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板用キャリア付銅箔及びプリント配線板

Also Published As

Publication number Publication date
JP5830635B1 (ja) 2015-12-09
TWI606152B (zh) 2017-11-21
KR20160048755A (ko) 2016-05-04
CN105378150B (zh) 2018-06-22
JPWO2015122258A1 (ja) 2017-03-30
TW201604337A (zh) 2016-02-01
CN105378150A (zh) 2016-03-02
WO2015122258A1 (ja) 2015-08-20

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