KR101798274B1 - 위치 맞춤 장치 및 기판 처리 장치 - Google Patents

위치 맞춤 장치 및 기판 처리 장치 Download PDF

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Publication number
KR101798274B1
KR101798274B1 KR1020140005000A KR20140005000A KR101798274B1 KR 101798274 B1 KR101798274 B1 KR 101798274B1 KR 1020140005000 A KR1020140005000 A KR 1020140005000A KR 20140005000 A KR20140005000 A KR 20140005000A KR 101798274 B1 KR101798274 B1 KR 101798274B1
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South Korea
Prior art keywords
substrate
holding
processing
section
notch
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KR1020140005000A
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Korean (ko)
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KR20140092778A (ko
Inventor
마사히토 가시야마
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가부시키가이샤 스크린 세미컨덕터 솔루션즈
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Publication of KR20140092778A publication Critical patent/KR20140092778A/ko
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/12—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020140005000A 2013-01-16 2014-01-15 위치 맞춤 장치 및 기판 처리 장치 Active KR101798274B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013005506A JP6184102B2 (ja) 2013-01-16 2013-01-16 位置合わせ装置および基板処理装置
JPJP-P-2013-005506 2013-01-16

Publications (2)

Publication Number Publication Date
KR20140092778A KR20140092778A (ko) 2014-07-24
KR101798274B1 true KR101798274B1 (ko) 2017-11-15

Family

ID=51164208

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140005000A Active KR101798274B1 (ko) 2013-01-16 2014-01-15 위치 맞춤 장치 및 기판 처리 장치

Country Status (4)

Country Link
US (1) US9685363B2 (https=)
JP (1) JP6184102B2 (https=)
KR (1) KR101798274B1 (https=)
TW (1) TWI576948B (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6263017B2 (ja) * 2013-12-16 2018-01-17 川崎重工業株式会社 基板位置合わせ装置及び基板位置合わせ装置の制御方法
US9947566B2 (en) * 2014-03-25 2018-04-17 Kawasaki Jukogyo Kabushiki Kaisha Substrate angle alignment device, substrate angle alignment method, and substrate transfer method
FR3019609B1 (fr) * 2014-04-03 2016-05-13 Hutchinson Courroie de transmission de puissance.
KR102123825B1 (ko) * 2015-03-13 2020-06-18 주식회사 원익아이피에스 얼라인모듈
JP6612632B2 (ja) * 2016-01-26 2019-11-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6815799B2 (ja) * 2016-09-13 2021-01-20 東京エレクトロン株式会社 基板処理装置及び基板処理方法
TWI676584B (zh) * 2018-03-02 2019-11-11 台灣愛司帝科技股份有限公司 晶片取放裝置及晶片取放與檢測系統
CN109917588A (zh) * 2019-03-21 2019-06-21 深圳市华星光电技术有限公司 配向紫外线照射机

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020070095A1 (en) 1999-04-07 2002-06-13 Kousai Electric Co., Ltd. Semiconductor manfacturing method and semiconductor manfacturing apparatus
KR100558774B1 (ko) * 1997-07-15 2007-04-25 동경 엘렉트론 주식회사 위치결정장치및위치결정방법
JP2012023287A (ja) * 2010-07-16 2012-02-02 Tokyo Electron Ltd 基板処理装置、基板処理方法、プログラム及びコンピュータ記憶媒体

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3695911A (en) * 1970-11-09 1972-10-03 Alco Standard Corp Method for applying a flowable substance to a workpiece
US5194743A (en) * 1990-04-06 1993-03-16 Nikon Corporation Device for positioning circular semiconductor wafers
JP2000077501A (ja) 1998-09-02 2000-03-14 Kaijo Corp ノッチ付きウエハ揃え機構
CN1669892B (zh) 2003-11-13 2011-11-16 应用材料股份有限公司 高速载入器相对于基片传送系统的校准
JP4672010B2 (ja) * 2005-03-29 2011-04-20 株式会社日立国際電気 半導体製造装置、半導体装置の製造方法および基板の判別方法
JP4601697B2 (ja) * 2008-09-26 2010-12-22 株式会社日立国際電気 半導体製造方法及び半導体製造装置
JP5410212B2 (ja) * 2009-09-15 2014-02-05 株式会社Ｓｏｋｕｄｏ 基板処理装置、基板処理システムおよび検査周辺露光装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100558774B1 (ko) * 1997-07-15 2007-04-25 동경 엘렉트론 주식회사 위치결정장치및위치결정방법
US20020070095A1 (en) 1999-04-07 2002-06-13 Kousai Electric Co., Ltd. Semiconductor manfacturing method and semiconductor manfacturing apparatus
JP2012023287A (ja) * 2010-07-16 2012-02-02 Tokyo Electron Ltd 基板処理装置、基板処理方法、プログラム及びコンピュータ記憶媒体

Also Published As

Publication number Publication date
JP2014138063A (ja) 2014-07-28
KR20140092778A (ko) 2014-07-24
TWI576948B (zh) 2017-04-01
US20140196663A1 (en) 2014-07-17
JP6184102B2 (ja) 2017-08-23
US9685363B2 (en) 2017-06-20
TW201430990A (zh) 2014-08-01

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