JP6184102B2 - 位置合わせ装置および基板処理装置 - Google Patents

位置合わせ装置および基板処理装置 Download PDF

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Publication number
JP6184102B2
JP6184102B2 JP2013005506A JP2013005506A JP6184102B2 JP 6184102 B2 JP6184102 B2 JP 6184102B2 JP 2013005506 A JP2013005506 A JP 2013005506A JP 2013005506 A JP2013005506 A JP 2013005506A JP 6184102 B2 JP6184102 B2 JP 6184102B2
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Japan
Prior art keywords
substrate
unit
holding
units
processing
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JP2013005506A
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English (en)
Japanese (ja)
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JP2014138063A (ja
JP2014138063A5 (https=
Inventor
真人 柏山
真人 柏山
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株式会社Ｓｃｒｅｅｎセミコンダクターソリューションズ
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Priority to JP2013005506A priority Critical patent/JP6184102B2/ja
Priority to US14/132,334 priority patent/US9685363B2/en
Priority to TW102147650A priority patent/TWI576948B/zh
Priority to KR1020140005000A priority patent/KR101798274B1/ko
Publication of JP2014138063A publication Critical patent/JP2014138063A/ja
Publication of JP2014138063A5 publication Critical patent/JP2014138063A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/12—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece

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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2013005506A 2013-01-16 2013-01-16 位置合わせ装置および基板処理装置 Active JP6184102B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013005506A JP6184102B2 (ja) 2013-01-16 2013-01-16 位置合わせ装置および基板処理装置
US14/132,334 US9685363B2 (en) 2013-01-16 2013-12-18 Alignment device and substrate processing apparatus
TW102147650A TWI576948B (zh) 2013-01-16 2013-12-20 對位裝置及基板處理裝置
KR1020140005000A KR101798274B1 (ko) 2013-01-16 2014-01-15 위치 맞춤 장치 및 기판 처리 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013005506A JP6184102B2 (ja) 2013-01-16 2013-01-16 位置合わせ装置および基板処理装置

Publications (3)

Publication Number Publication Date
JP2014138063A JP2014138063A (ja) 2014-07-28
JP2014138063A5 JP2014138063A5 (https=) 2016-02-12
JP6184102B2 true JP6184102B2 (ja) 2017-08-23

Family

ID=51164208

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013005506A Active JP6184102B2 (ja) 2013-01-16 2013-01-16 位置合わせ装置および基板処理装置

Country Status (4)

Country Link
US (1) US9685363B2 (https=)
JP (1) JP6184102B2 (https=)
KR (1) KR101798274B1 (https=)
TW (1) TWI576948B (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6263017B2 (ja) * 2013-12-16 2018-01-17 川崎重工業株式会社 基板位置合わせ装置及び基板位置合わせ装置の制御方法
US9947566B2 (en) * 2014-03-25 2018-04-17 Kawasaki Jukogyo Kabushiki Kaisha Substrate angle alignment device, substrate angle alignment method, and substrate transfer method
FR3019609B1 (fr) * 2014-04-03 2016-05-13 Hutchinson Courroie de transmission de puissance.
KR102123825B1 (ko) * 2015-03-13 2020-06-18 주식회사 원익아이피에스 얼라인모듈
JP6612632B2 (ja) * 2016-01-26 2019-11-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6815799B2 (ja) * 2016-09-13 2021-01-20 東京エレクトロン株式会社 基板処理装置及び基板処理方法
TWI676584B (zh) * 2018-03-02 2019-11-11 台灣愛司帝科技股份有限公司 晶片取放裝置及晶片取放與檢測系統
CN109917588A (zh) * 2019-03-21 2019-06-21 深圳市华星光电技术有限公司 配向紫外线照射机

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3695911A (en) * 1970-11-09 1972-10-03 Alco Standard Corp Method for applying a flowable substance to a workpiece
US5194743A (en) * 1990-04-06 1993-03-16 Nikon Corporation Device for positioning circular semiconductor wafers
JP3208562B2 (ja) * 1997-07-15 2001-09-17 東京エレクトロン株式会社 位置決め装置及び位置決め方法
JP2000077501A (ja) 1998-09-02 2000-03-14 Kaijo Corp ノッチ付きウエハ揃え機構
JP4255091B2 (ja) 1999-04-07 2009-04-15 株式会社日立国際電気 半導体製造方法
CN1669892B (zh) 2003-11-13 2011-11-16 应用材料股份有限公司 高速载入器相对于基片传送系统的校准
JP4672010B2 (ja) * 2005-03-29 2011-04-20 株式会社日立国際電気 半導体製造装置、半導体装置の製造方法および基板の判別方法
JP4601697B2 (ja) * 2008-09-26 2010-12-22 株式会社日立国際電気 半導体製造方法及び半導体製造装置
JP5410212B2 (ja) * 2009-09-15 2014-02-05 株式会社Ｓｏｋｕｄｏ 基板処理装置、基板処理システムおよび検査周辺露光装置
JP5567919B2 (ja) * 2010-07-16 2014-08-06 東京エレクトロン株式会社 基板処理装置、基板処理方法、プログラム及びコンピュータ記憶媒体

Also Published As

Publication number Publication date
JP2014138063A (ja) 2014-07-28
KR20140092778A (ko) 2014-07-24
TWI576948B (zh) 2017-04-01
KR101798274B1 (ko) 2017-11-15
US20140196663A1 (en) 2014-07-17
US9685363B2 (en) 2017-06-20
TW201430990A (zh) 2014-08-01

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