TWI576948B - 對位裝置及基板處理裝置 - Google Patents

對位裝置及基板處理裝置 Download PDF

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Publication number
TWI576948B
TWI576948B TW102147650A TW102147650A TWI576948B TW I576948 B TWI576948 B TW I576948B TW 102147650 A TW102147650 A TW 102147650A TW 102147650 A TW102147650 A TW 102147650A TW I576948 B TWI576948 B TW I576948B
Authority
TW
Taiwan
Prior art keywords
substrate
unit
holding
portions
processing
Prior art date
Application number
TW102147650A
Other languages
English (en)
Chinese (zh)
Other versions
TW201430990A (zh
Inventor
柏山真人
Original Assignee
斯克林半導體科技有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 斯克林半導體科技有限公司 filed Critical 斯克林半導體科技有限公司
Publication of TW201430990A publication Critical patent/TW201430990A/zh
Application granted granted Critical
Publication of TWI576948B publication Critical patent/TWI576948B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
    • H10P72/53—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/12—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3306—Horizontal transfer of a single workpiece

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW102147650A 2013-01-16 2013-12-20 對位裝置及基板處理裝置 TWI576948B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013005506A JP6184102B2 (ja) 2013-01-16 2013-01-16 位置合わせ装置および基板処理装置

Publications (2)

Publication Number Publication Date
TW201430990A TW201430990A (zh) 2014-08-01
TWI576948B true TWI576948B (zh) 2017-04-01

Family

ID=51164208

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102147650A TWI576948B (zh) 2013-01-16 2013-12-20 對位裝置及基板處理裝置

Country Status (4)

Country Link
US (1) US9685363B2 (https=)
JP (1) JP6184102B2 (https=)
KR (1) KR101798274B1 (https=)
TW (1) TWI576948B (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6263017B2 (ja) * 2013-12-16 2018-01-17 川崎重工業株式会社 基板位置合わせ装置及び基板位置合わせ装置の制御方法
US9947566B2 (en) * 2014-03-25 2018-04-17 Kawasaki Jukogyo Kabushiki Kaisha Substrate angle alignment device, substrate angle alignment method, and substrate transfer method
FR3019609B1 (fr) * 2014-04-03 2016-05-13 Hutchinson Courroie de transmission de puissance.
KR102123825B1 (ko) * 2015-03-13 2020-06-18 주식회사 원익아이피에스 얼라인모듈
JP6612632B2 (ja) * 2016-01-26 2019-11-27 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6815799B2 (ja) * 2016-09-13 2021-01-20 東京エレクトロン株式会社 基板処理装置及び基板処理方法
TWI676584B (zh) * 2018-03-02 2019-11-11 台灣愛司帝科技股份有限公司 晶片取放裝置及晶片取放與檢測系統
CN109917588A (zh) * 2019-03-21 2019-06-21 深圳市华星光电技术有限公司 配向紫外线照射机

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6052913A (en) * 1997-07-15 2000-04-25 Tokyo Electron Limited Positioning device and positioning method
US20090030547A1 (en) * 2003-11-13 2009-01-29 Applied Materials, Inc. Calibration of high speed loader to substrate transport system
US20110063588A1 (en) * 2009-09-15 2011-03-17 Kashiyama Masahito Substrate processing apparatus, substrate processing system and inspection/periphery exposure apparatus

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3695911A (en) * 1970-11-09 1972-10-03 Alco Standard Corp Method for applying a flowable substance to a workpiece
US5194743A (en) * 1990-04-06 1993-03-16 Nikon Corporation Device for positioning circular semiconductor wafers
JP2000077501A (ja) 1998-09-02 2000-03-14 Kaijo Corp ノッチ付きウエハ揃え機構
JP4255091B2 (ja) 1999-04-07 2009-04-15 株式会社日立国際電気 半導体製造方法
JP4672010B2 (ja) * 2005-03-29 2011-04-20 株式会社日立国際電気 半導体製造装置、半導体装置の製造方法および基板の判別方法
JP4601697B2 (ja) * 2008-09-26 2010-12-22 株式会社日立国際電気 半導体製造方法及び半導体製造装置
JP5567919B2 (ja) * 2010-07-16 2014-08-06 東京エレクトロン株式会社 基板処理装置、基板処理方法、プログラム及びコンピュータ記憶媒体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6052913A (en) * 1997-07-15 2000-04-25 Tokyo Electron Limited Positioning device and positioning method
US20090030547A1 (en) * 2003-11-13 2009-01-29 Applied Materials, Inc. Calibration of high speed loader to substrate transport system
US20110063588A1 (en) * 2009-09-15 2011-03-17 Kashiyama Masahito Substrate processing apparatus, substrate processing system and inspection/periphery exposure apparatus

Also Published As

Publication number Publication date
JP2014138063A (ja) 2014-07-28
KR20140092778A (ko) 2014-07-24
KR101798274B1 (ko) 2017-11-15
US20140196663A1 (en) 2014-07-17
JP6184102B2 (ja) 2017-08-23
US9685363B2 (en) 2017-06-20
TW201430990A (zh) 2014-08-01

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