KR101787616B1 - 폴리우레탄 수지 조성물 제조용 폴리올 조성물 - Google Patents

폴리우레탄 수지 조성물 제조용 폴리올 조성물 Download PDF

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Publication number
KR101787616B1
KR101787616B1 KR1020167005403A KR20167005403A KR101787616B1 KR 101787616 B1 KR101787616 B1 KR 101787616B1 KR 1020167005403 A KR1020167005403 A KR 1020167005403A KR 20167005403 A KR20167005403 A KR 20167005403A KR 101787616 B1 KR101787616 B1 KR 101787616B1
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KR
South Korea
Prior art keywords
polyol
composition
polyurethane resin
resin composition
treatment
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KR1020167005403A
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English (en)
Korean (ko)
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KR20160145532A (ko
Inventor
도미오 나기
다케시 후지사와
고타로 무라카미
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산유 레크 가부시키가이샤
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Application filed by 산유 레크 가부시키가이샤 filed Critical 산유 레크 가부시키가이샤
Publication of KR20160145532A publication Critical patent/KR20160145532A/ko
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/08Processes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/30Low-molecular-weight compounds
    • C08G18/32Polyhydroxy compounds; Polyamines; Hydroxyamines
    • C08G18/3203Polyhydroxy compounds
    • C08G18/3206Polyhydroxy compounds aliphatic
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40High-molecular-weight compounds
    • C08G18/62Polymers of compounds having carbon-to-carbon double bonds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40High-molecular-weight compounds
    • C08G18/64Macromolecular compounds not provided for by groups C08G18/42 - C08G18/63
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/10Metal compounds
    • C08K3/12Hydrides
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04Polyurethanes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00Applications
    • C08L2203/20Applications use in electrical or conductive gadgets
    • C08L2203/206Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Polyurethanes Or Polyureas (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Sealing Material Composition (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020167005403A 2015-05-08 2015-12-24 폴리우레탄 수지 조성물 제조용 폴리올 조성물 KR101787616B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2015095815A JP5864008B1 (ja) 2015-05-08 2015-05-08 ポリウレタン樹脂組成物製造用ポリオール組成物
JPJP-P-2015-095815 2015-05-08
PCT/JP2015/086123 WO2016181583A1 (ja) 2015-05-08 2015-12-24 ポリウレタン樹脂組成物製造用ポリオール組成物

Publications (2)

Publication Number Publication Date
KR20160145532A KR20160145532A (ko) 2016-12-20
KR101787616B1 true KR101787616B1 (ko) 2017-10-18

Family

ID=55346931

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020167005403A KR101787616B1 (ko) 2015-05-08 2015-12-24 폴리우레탄 수지 조성물 제조용 폴리올 조성물

Country Status (5)

Country Link
JP (1) JP5864008B1 (zh)
KR (1) KR101787616B1 (zh)
CN (1) CN106459334B (zh)
MY (1) MY183388A (zh)
WO (1) WO2016181583A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5946574B1 (ja) * 2015-08-25 2016-07-06 サンユレック株式会社 ポリウレタン樹脂組成物
KR102112790B1 (ko) * 2017-12-15 2020-05-19 주식회사 엘지화학 수지 조성물
KR102268268B1 (ko) * 2018-04-20 2021-06-23 주식회사 엘지화학 수지 조성물 및 이를 포함하는 배터리 모듈
KR102070573B1 (ko) 2018-04-20 2020-01-29 주식회사 엘지화학 수지 조성물 및 이를 포함하는 배터리 모듈
KR102113234B1 (ko) * 2018-04-20 2020-05-20 주식회사 엘지화학 수지 조성물 및 이를 포함하는 배터리 모듈
KR102382554B1 (ko) * 2019-03-27 2022-04-04 주식회사 엘지화학 수지 조성물
JP6732145B1 (ja) * 2019-05-28 2020-07-29 三菱電機株式会社 熱伝導性樹脂組成物、熱伝導性シートおよび製造方法
KR102214563B1 (ko) * 2020-05-12 2021-02-09 주식회사 엘지화학 수지 조성물
WO2023055082A1 (ko) * 2021-09-28 2023-04-06 주식회사 엘지화학 경화성 조성물

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009035686A (ja) 2007-08-03 2009-02-19 Toyo Tire & Rubber Co Ltd 硬質ポリウレタンフォーム用ポリオール組成物及び硬質ポリウレタンフォームの製造方法
JP2009167383A (ja) * 2007-12-18 2009-07-30 Dai Ichi Kogyo Seiyaku Co Ltd 2液反応型ポリウレタン樹脂組成物及び該樹脂組成物を用いた電気電子部品
JP2010280760A (ja) 2009-06-02 2010-12-16 Hitachi Chem Co Ltd ウレタン樹脂組成物及びこれを用いた電気電子部品

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03215554A (ja) * 1990-01-18 1991-09-20 Sunstar Eng Inc 揺変性ポリウレタン樹脂組成物
JPH06306351A (ja) * 1993-04-26 1994-11-01 Nitsusen Kagaku Kk ウレタンシーリング材
JP3096559B2 (ja) * 1994-04-15 2000-10-10 オート化学工業株式会社 湿気硬化性ウレタン組成物
CN1240474A (zh) * 1996-10-16 2000-01-05 尤尼利弗公司 含水量低且多元醇与水比例最小的可熔化浇铸的条状组合物
JP2000219806A (ja) 1999-01-29 2000-08-08 Sekisui Chem Co Ltd 湿気硬化型ウレタン系組成物の製造方法
JP2002003726A (ja) * 2000-06-21 2002-01-09 Shiraishi Kogyo Kaisha Ltd 封止用樹脂組成物
DE10101770A1 (de) * 2001-01-17 2002-07-18 Bayer Ag Solarmodule mit Polyurethaneinbettung und ein Verfahren zu deren Herstellung
JP2002270235A (ja) * 2001-03-07 2002-09-20 Nisshinbo Ind Inc 高分子ゲル電解質用プレゲル組成物及びその脱水方法並びに二次電池及び電気二重層キャパシタ
CN1325246C (zh) 2003-10-31 2007-07-11 杭州悍马轮胎科技有限公司 聚氨酯胎面-橡胶胎体复合结构绿色轮胎及其制造方法
JP2007308607A (ja) * 2006-05-19 2007-11-29 Konishi Co Ltd 2成分形シーリング材組成物
JP5161756B2 (ja) 2008-12-26 2013-03-13 第一工業製薬株式会社 ポリウレタン樹脂組成物及びポリウレタン樹脂
JP2010180384A (ja) 2009-02-09 2010-08-19 Showa Denko Kk 発光素子接着用樹脂組成物、発光素子の接着方法およびランプ
JP6046328B2 (ja) * 2010-08-31 2016-12-14 オート化学工業株式会社 着色剤組成物及びその製造方法、並びに当該着色剤組成物を用いた着色方法及びシーリング材の製造方法
CN102079960B (zh) * 2010-12-15 2013-08-14 佛山市南海易乐工程塑料有限公司 一种聚氨酯隔热结构胶以及隔热铝型材的制造方法
JP6289069B2 (ja) * 2013-12-16 2018-03-07 株式会社白石バイオマス 液状ポリオール組成物
CN103897650B (zh) * 2014-03-17 2016-05-18 郑州大学 一种不易起泡的单组份聚氨酯密封胶
CN104650793B (zh) * 2015-03-10 2017-04-12 上海蒂姆新材料科技有限公司 一种耐热性单组份湿固化聚氨酯密封胶及其制备方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009035686A (ja) 2007-08-03 2009-02-19 Toyo Tire & Rubber Co Ltd 硬質ポリウレタンフォーム用ポリオール組成物及び硬質ポリウレタンフォームの製造方法
JP2009167383A (ja) * 2007-12-18 2009-07-30 Dai Ichi Kogyo Seiyaku Co Ltd 2液反応型ポリウレタン樹脂組成物及び該樹脂組成物を用いた電気電子部品
JP2010280760A (ja) 2009-06-02 2010-12-16 Hitachi Chem Co Ltd ウレタン樹脂組成物及びこれを用いた電気電子部品

Also Published As

Publication number Publication date
JP2016210889A (ja) 2016-12-15
CN106459334A (zh) 2017-02-22
CN106459334B (zh) 2018-06-12
KR20160145532A (ko) 2016-12-20
MY183388A (en) 2021-02-18
WO2016181583A1 (ja) 2016-11-17
JP5864008B1 (ja) 2016-02-17

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