KR101783819B1 - 가열 장치 및 기판 가열 방법 - Google Patents

가열 장치 및 기판 가열 방법 Download PDF

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Publication number
KR101783819B1
KR101783819B1 KR1020137004891A KR20137004891A KR101783819B1 KR 101783819 B1 KR101783819 B1 KR 101783819B1 KR 1020137004891 A KR1020137004891 A KR 1020137004891A KR 20137004891 A KR20137004891 A KR 20137004891A KR 101783819 B1 KR101783819 B1 KR 101783819B1
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South Korea
Prior art keywords
substrate
heating
plane
processing system
enclosure
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Expired - Fee Related
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KR1020137004891A
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English (en)
Korean (ko)
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KR20130105606A (ko
Inventor
에드윈 핑크
필립 호츠
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텔 쏠라 아게
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Assigned to 에바텍 아크티엔게젤샤프트 reassignment 에바텍 아크티엔게젤샤프트 권리의 전부이전등록 Assignors: 텔 쏠라 아게 인 리퀴데이션
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00—Manufacture or treatment of devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0436—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/60—Arrangements for cooling, heating, ventilating or compensating for temperature fluctuations
    • H10F77/63—Arrangements for cooling directly associated or integrated with photovoltaic cells, e.g. heat sinks directly associated with the photovoltaic cells or integrated Peltier elements for active cooling
    • H10F77/68—Arrangements for cooling directly associated or integrated with photovoltaic cells, e.g. heat sinks directly associated with the photovoltaic cells or integrated Peltier elements for active cooling using gaseous or liquid coolants, e.g. air flow ventilation or water circulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
    • Y02A40/00—Adaptation technologies in agriculture, forestry, livestock or agroalimentary production
    • Y02A40/90—Adaptation technologies in agriculture, forestry, livestock or agroalimentary production in food processing or handling, e.g. food conservation
    • Y02A40/963—Off-grid food refrigeration
    • Y02A40/966—Powered by renewable energy sources
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

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  • Chemical Vapour Deposition (AREA)
  • Physical Vapour Deposition (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Resistance Heating (AREA)
KR1020137004891A 2010-07-27 2011-07-27 가열 장치 및 기판 가열 방법 Expired - Fee Related KR101783819B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US36791010P 2010-07-27 2010-07-27
US61/367,910 2010-07-27
PCT/EP2011/062912 WO2012013707A1 (en) 2010-07-27 2011-07-27 Heating arrangement and method for heating substrates

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020177027060A Division KR102121794B1 (ko) 2010-07-27 2011-07-27 가열 장치 및 기판 가열 방법

Publications (2)

Publication Number Publication Date
KR20130105606A KR20130105606A (ko) 2013-09-25
KR101783819B1 true KR101783819B1 (ko) 2017-10-10

Family

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Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020137004891A Expired - Fee Related KR101783819B1 (ko) 2010-07-27 2011-07-27 가열 장치 및 기판 가열 방법
KR1020177027060A Expired - Fee Related KR102121794B1 (ko) 2010-07-27 2011-07-27 가열 장치 및 기판 가열 방법

Family Applications After (1)

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KR1020177027060A Expired - Fee Related KR102121794B1 (ko) 2010-07-27 2011-07-27 가열 장치 및 기판 가열 방법

Country Status (6)

Country Link
US (1) US10276412B2 (https=)
EP (1) EP2599115B1 (https=)
JP (1) JP6088970B2 (https=)
KR (2) KR101783819B1 (https=)
CN (1) CN103222041B (https=)
WO (1) WO2012013707A1 (https=)

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US20130074358A1 (en) * 2011-09-24 2013-03-28 Quantum Technology Holdings Limited Heated body with high heat transfer rate material and its use
WO2014032192A1 (en) * 2012-08-27 2014-03-06 Oc Oerlikon Balzers Ag Processing arrangement with temperature conditioning arrangement and method of processing a substrate
US10208381B2 (en) 2014-12-23 2019-02-19 Rec Silicon Inc Apparatus and method for managing a temperature profile using reflective energy in a thermal decomposition reactor
WO2016106337A1 (en) * 2014-12-23 2016-06-30 Rec Silicon Inc Apparatus and method for managing a temperature profile using reflective energy in a thermal decomposition reactor
KR102592972B1 (ko) * 2016-02-12 2023-10-24 삼성전자주식회사 센싱 모듈 기판 및 이를 포함하는 센싱 모듈
DE102016015502A1 (de) * 2016-12-23 2018-06-28 Singulus Technologies Ag Verfahren und Vorrichtung zur thermischen Behandlung beschichteter Substrate, insbesondere von Dünnschicht-Solarsubstraten
DE102018128243A1 (de) * 2018-11-12 2020-05-14 AM Metals GmbH Herstellvorrichtung zur additiven Fertigung dreidimensionaler Bauteile
JP7398935B2 (ja) * 2019-11-25 2023-12-15 東京エレクトロン株式会社 載置台、及び、検査装置
CN115461491B (zh) * 2020-07-01 2024-08-23 应用材料公司 用于操作腔室的方法、用于处理基板的装置和基板处理系统
DE102020130339A1 (de) * 2020-11-17 2022-05-19 Aixtron Se Heizeinrichtung für einen CVD-Reaktor
KR102836506B1 (ko) * 2023-03-27 2025-07-22 주식회사 히타치하이테크 플라스마 처리 장치

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JP2007329423A (ja) * 2006-06-09 2007-12-20 Tokki Corp 基板加熱装置及び基板加熱方法
JP2010135531A (ja) * 2008-12-04 2010-06-17 Shimadzu Corp 真空加熱装置

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JPS63274714A (ja) * 1987-04-28 1988-11-11 Michio Sugiyama 真空熱処理炉用ラジアントチユ−ブヒ−タ
US4832778A (en) * 1987-07-16 1989-05-23 Texas Instruments Inc. Processing apparatus for wafers
US5108570A (en) 1990-03-30 1992-04-28 Applied Materials, Inc. Multistep sputtering process for forming aluminum layer over stepped semiconductor wafer
US5700992A (en) * 1993-10-08 1997-12-23 Toshiba Machine Co., Ltd. Zigzag heating device with downward directed connecting portions
JPH07221037A (ja) * 1994-02-03 1995-08-18 Dainippon Screen Mfg Co Ltd 熱処理装置
JPH0820868A (ja) * 1994-07-06 1996-01-23 Noboru Naruo 真空加熱均熱ヒーター
JPH08191074A (ja) * 1995-01-10 1996-07-23 Touyoko Kagaku Kk 高速熱処理装置
JPH08222360A (ja) * 1995-02-10 1996-08-30 Noboru Naruo 真空加熱兼冷却均熱ヒータ
JPH10208855A (ja) * 1997-01-23 1998-08-07 Toshiba Ceramics Co Ltd 面状ヒータ
JPH1197448A (ja) * 1997-09-18 1999-04-09 Kemitoronikusu:Kk 熱処理装置とこれを用いた半導体結晶の熱処理法
JP3170573B2 (ja) * 1999-06-23 2001-05-28 助川電気工業株式会社 縦型加熱炉用円板状ヒータ
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US8057601B2 (en) * 2007-05-09 2011-11-15 Applied Materials, Inc. Apparatus and method for supporting, positioning and rotating a substrate in a processing chamber
US8548311B2 (en) * 2008-04-09 2013-10-01 Applied Materials, Inc. Apparatus and method for improved control of heating and cooling of substrates
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JP2002536829A (ja) * 1999-02-04 2002-10-29 シュテアク エルテーペー システムズ ゲゼルシャフト ミット ベシュレンクテル ハフツング 急速熱処理（ｒｔｐ）装置のための冷却シャワーヘッド
JP2007329423A (ja) * 2006-06-09 2007-12-20 Tokki Corp 基板加熱装置及び基板加熱方法
JP2010135531A (ja) * 2008-12-04 2010-06-17 Shimadzu Corp 真空加熱装置

Also Published As

Publication number Publication date
KR20130105606A (ko) 2013-09-25
JP6088970B2 (ja) 2017-03-01
US20140202027A1 (en) 2014-07-24
EP2599115A1 (en) 2013-06-05
CN103222041A (zh) 2013-07-24
JP2013541176A (ja) 2013-11-07
KR102121794B1 (ko) 2020-06-12
CN103222041B (zh) 2016-01-20
KR20170117198A (ko) 2017-10-20
US10276412B2 (en) 2019-04-30
EP2599115B1 (en) 2015-02-25
WO2012013707A1 (en) 2012-02-02

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