JP6088970B2 - 加熱配置構成及び基板を加熱するための方法 - Google Patents
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- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
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- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/052—Cooling means directly associated or integrated with the PV cell, e.g. integrated Peltier elements for active cooling or heat sinks directly associated with the PV cells
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Description
前記加熱手段は、前記第1の表面及び/又は第2の表面を介することによってのみ加熱用エネルギーを照射するように構成され、
前記第1の反射手段は、前記加熱手段によって照射される前記加熱用エネルギーを前記基板平面上に反射するように構成され、
前記加熱手段は、前記第1の表面が前記第1の反射手段の方を向き、第2の表面が前記基板平面の方を向くように配置される、基板を処理するための真空処理システムによって達成される。
a)1m2以上の表面サイズを有する平面基板を、前記基板が前記基板平面内に設けられるように前記格納容器内に設けるステップと、
b)前記格納容器を、8*10−2mbar以下でかつ1*10−5mbar以上に排気するステップと、
c)前記基板を加熱するために、26kW以上の電力を前記加熱手段に提供するステップとを含む、請求項1〜11のいずれか1項に記載の真空処理システムを動作させるための方法によって更に対処される。
2 基板
3 基板キャリア
4 基板平面
5 加熱素子
6 第1の反射手段
7 第2の反射手段
8 冷却ユニット
9 バスバー
10 第1の平面表面
11 第2の平面表面
12 第1の面
13 第2の面
14 加熱素子
Claims (13)
- 基板(2)を処理するための真空処理システムであって、処理される前記基板(2)を基板平面(4)に保持するための格納容器(1)を有し、
前記格納容器(1)は、第1の反射手段(6)と、第1の平面表面(10)及び反対側の第2の平面表面(11)を有する加熱手段(5)とを備え、
前記加熱手段(5)は、前記第1の平面表面(10)及び前記第2の平面表面(11)を介することによってのみ加熱用エネルギーを照射するように構成され、
前記第1の反射手段(6)は、前記加熱手段(5)によって照射される前記加熱用エネルギーを前記基板平面(4)上に反射するように構成され、
前記加熱手段(5)は、前記第1の平面表面(10)が前記第1の反射手段(6)の方を向くように配置され、前記第1の反射手段(6)から生じる反射によって前記基板(2)を照射するように構成され、
前記加熱手段(5)は、前記第2の平面表面(11)が前記基板平面(4)の方を向くように配置され、前記基板(2)を直接照射するように構成され、
前記加熱手段(5)は、それぞれが長さ(c)、幅(a)、及び厚さ(b)を有する複数の矩形加熱素子(14)を備え、
前記加熱素子(14)は、直列に及び/又は並列に電気接続され、
前記加熱素子(14)は、前記加熱手段(5)の前記第1の平面表面(10)と前記第2の平面表面(11)とをそれぞれ形成する平面であって、かつ、前記基板平面(4)に平行な平面に、前記加熱素子(14)の幅(a)及び長さ(c)に沿って配置され、
前記格納容器(1)は、前記反射手段(6、7)を冷却するための冷却ユニット(8)を備え、
前記反射手段(6、7)は、前記加熱手段(5)の方を向いている第1の面(12)と、前記加熱手段(5)の方を向いていない、反対側の第2の面(13)とを備え、
前記冷却ユニット(8)は、前記反射手段(6、7)の前記第2の面(13)上に設けられ、前記反射手段(6、7)と熱接触状態である、
基板を処理するための真空処理システム。 - 前記格納容器(1)は、前記加熱手段(5)によって照射される前記加熱用エネルギーを前記基板(2)上に反射するように構成された第2の反射手段(7)を備え、
前記第2の反射手段(7)は、前記加熱手段(5)の前記第2の平面表面(11)が前記第2の反射手段(7)の方を向き、前記基板平面(4)が、前記加熱手段(5)と前記第2の反射手段(7)との間に設けられるように配置される、
請求項1に記載の真空処理システム。 - 前記加熱手段(5)の前記第2の平面表面は、前記基板平面(4)から50mm以下、好ましくは40mm以下、より好ましくは10mm以下離れて配置される、
請求項1〜2のいずれか1項に記載の真空処理システム。 - 前記加熱手段(5)は、前記格納容器(1)内で保持可能な前記基板(2)の表面積より5%以上大きい表面積を有する2次元平面サイズを有し、
前記加熱手段(5)は、炭素複合材、炭素繊維強化炭素、炭素繊維、SiCコーティングした繊維、グラファイト、グラファイト繊維及び/又はSiC板からなる群から選択される材料を含み、かつ/又は、前記加熱手段(5)は、600℃以上の温度に不変のまま耐える耐熱性材料を含む、
請求項1〜3のいずれか1項に記載の真空処理システム。 - 前記格納容器(1)は、前記加熱手段(5)を支持するための、及び/又は、前記加熱手段(5)に電気エネルギーを提供するためのバスバー(9)を備える、
請求項1〜4のいずれか1項に記載の真空処理システム。 - 前記格納容器(1)は、処理される前記基板(2)を前記基板平面(4)に保持するための基板キャリア(3)を備える、
請求項1〜5のいずれか1項に記載の真空処理システム。 - 各加熱素子(14)は、前記それぞれの加熱素子(14)の前記厚さ(b)の500倍以上である幅(a)と、前記それぞれの加熱素子(14)の前記厚さ(b)の3000倍以上である長さ(c)とを有し、かつ/又は、前記加熱素子(14)は、前記それぞれの加熱素子(14)の前記厚さの2倍以上の距離(d)で、好ましくは互いに4mm以上の距離(d)で互いに隣接して配置される、
請求項1〜6のいずれか1項に記載の真空処理システム。 - 前記矩形加熱素子(14)の前記厚さ(b)は、0.5mm以下、好ましくは0.15mm以下である、
請求項1〜7のいずれか1項に記載の真空処理システム。 - 前記反射手段(6、7)は、銅、銅コーティング、ニッケル、ニッケルコーティング、金、金コーティング、銀、銀コーティング、アルミニウム、及び/又はアルミニウムコーティングからなる群から選択される材料を含み、かつ/又は、前記反射手段(6、7)は、N9以下の表面粗さ等級を有する反射表面を備える、
請求項1〜8のいずれか1項に記載の真空処理システム。 - 前記格納容器(1)は、該格納容器(1)が、前記真空処理システム内に設けられるとき、真空を破ることなくアクセス可能であるように密封可能開口を備えるロードロックとして設けられる、
請求項1〜9のいずれか1項に記載の真空処理システム。 - 請求項1〜10のいずれか1項に記載の真空処理システムを動作させるための方法であって、
a)1m2以上の表面サイズを有する平面基板(2)を、前記基板(2)が前記基板平面(4)に設けられるように前記格納容器(1)内に設けるステップと、
b)前記格納容器(1)を、8*10−2mbar以下でかつ1*10−5mbar以上に排気するステップと、
c)前記基板(2)を加熱するために、26kW以上の電力を前記加熱手段(5)に提供するステップとを含む、
請求項1〜10のいずれか1項に記載の真空処理システムを動作させるための方法。 - ステップc)中に、前記電力は、前記基板(2)の加熱レートが2.5K/s以上になるように提供される、
請求項11に記載の方法。 - ステップc)中に、前記基板(2)は、前記格納容器(1)内で周期的に又は直線的に移動される、
請求項11及び12のいずれか1項に記載の方法。
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US36791010P | 2010-07-27 | 2010-07-27 | |
US61/367,910 | 2010-07-27 | ||
PCT/EP2011/062912 WO2012013707A1 (en) | 2010-07-27 | 2011-07-27 | Heating arrangement and method for heating substrates |
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JP2013541176A JP2013541176A (ja) | 2013-11-07 |
JP2013541176A5 JP2013541176A5 (ja) | 2014-09-18 |
JP6088970B2 true JP6088970B2 (ja) | 2017-03-01 |
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US (1) | US10276412B2 (ja) |
EP (1) | EP2599115B1 (ja) |
JP (1) | JP6088970B2 (ja) |
KR (2) | KR102121794B1 (ja) |
CN (1) | CN103222041B (ja) |
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US20130074358A1 (en) * | 2011-09-24 | 2013-03-28 | Quantum Technology Holdings Limited | Heated body with high heat transfer rate material and its use |
US20150228530A1 (en) * | 2012-08-27 | 2015-08-13 | Oerlikon Advanced Technologies Ag | Processing arrangement with temperature conditioning arrangement and method of processing a substrate |
JP2018502039A (ja) * | 2014-12-23 | 2018-01-25 | アールイーシー シリコン インコーポレイテッド | 熱分解リアクタにおける反射エネルギーを使用することにより温度プロファイルを管理する装置及び方法 |
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US20140202027A1 (en) | 2014-07-24 |
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