CN104995727A - 带有温度调节布置的加工布置和加工基底的方法 - Google Patents
带有温度调节布置的加工布置和加工基底的方法 Download PDFInfo
- Publication number
- CN104995727A CN104995727A CN201380056240.7A CN201380056240A CN104995727A CN 104995727 A CN104995727 A CN 104995727A CN 201380056240 A CN201380056240 A CN 201380056240A CN 104995727 A CN104995727 A CN 104995727A
- Authority
- CN
- China
- Prior art keywords
- substrate
- substrate processing
- heating element
- processing
- bed support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68735—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge profile or support profile
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
- C23C14/325—Electric arc evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3426—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/332—Coating
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Analytical Chemistry (AREA)
- Plasma & Fusion (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
Description
Claims (16)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261693406P | 2012-08-27 | 2012-08-27 | |
US61/693406 | 2012-08-27 | ||
PCT/CH2013/000148 WO2014032192A1 (en) | 2012-08-27 | 2013-08-22 | Processing arrangement with temperature conditioning arrangement and method of processing a substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
CN104995727A true CN104995727A (zh) | 2015-10-21 |
Family
ID=49110950
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201380056240.7A Pending CN104995727A (zh) | 2012-08-27 | 2013-08-22 | 带有温度调节布置的加工布置和加工基底的方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20150228530A1 (zh) |
EP (1) | EP2896065A1 (zh) |
CN (1) | CN104995727A (zh) |
TW (1) | TWI597376B (zh) |
WO (1) | WO2014032192A1 (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108456873A (zh) * | 2017-02-22 | 2018-08-28 | 北京北方华创微电子装备有限公司 | 一种下电极结构及工艺腔室 |
WO2024050727A1 (en) * | 2022-09-07 | 2024-03-14 | Innoscience (suzhou) Semiconductor Co., Ltd. | Nitride-based wafer chemical vapor deposition device and deposition method of the same |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6436896B2 (ja) * | 2015-12-04 | 2018-12-12 | 信越化学工業株式会社 | カーボンヒーターおよびカーボンヒーターの製造方法 |
CN109136885B (zh) * | 2017-06-19 | 2020-11-10 | 北京北方华创微电子装备有限公司 | 线圈调节机构、感应加热装置和气相沉积设备 |
KR102633715B1 (ko) | 2017-11-28 | 2024-02-05 | 에바텍 아크티엔게젤샤프트 | 기판 처리 장치, 기판 처리 방법 및 처리된 작업편의 제조방법 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6025575A (en) * | 1997-11-27 | 2000-02-15 | Lg Semicon Co., Ltd. | Heating apparatus for chemical vapor deposition equipment |
US6046439A (en) * | 1996-06-17 | 2000-04-04 | Mattson Technology, Inc. | System and method for thermal processing of a semiconductor substrate |
US20060213770A1 (en) * | 2005-03-25 | 2006-09-28 | Nobuyuki Takahashi | Sputtering device |
US20080032036A1 (en) * | 2006-08-02 | 2008-02-07 | Nuflare Technology, Inc. | Manufacturing apparatus for semiconductor device and manufacturing method for semiconductor device |
WO2012013707A1 (en) * | 2010-07-27 | 2012-02-02 | Oerlikon Solar Ag, Trübbach | Heating arrangement and method for heating substrates |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3437118B2 (ja) * | 1999-04-23 | 2003-08-18 | 東芝機械株式会社 | ウエーハ加熱装置及びその制御方法 |
US20040226516A1 (en) * | 2003-05-13 | 2004-11-18 | Daniel Timothy J. | Wafer pedestal cover |
-
2013
- 2013-08-22 WO PCT/CH2013/000148 patent/WO2014032192A1/en active Application Filing
- 2013-08-22 CN CN201380056240.7A patent/CN104995727A/zh active Pending
- 2013-08-22 US US14/424,172 patent/US20150228530A1/en not_active Abandoned
- 2013-08-22 EP EP13756294.8A patent/EP2896065A1/en not_active Withdrawn
- 2013-08-26 TW TW102130394A patent/TWI597376B/zh active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6046439A (en) * | 1996-06-17 | 2000-04-04 | Mattson Technology, Inc. | System and method for thermal processing of a semiconductor substrate |
US6025575A (en) * | 1997-11-27 | 2000-02-15 | Lg Semicon Co., Ltd. | Heating apparatus for chemical vapor deposition equipment |
US20060213770A1 (en) * | 2005-03-25 | 2006-09-28 | Nobuyuki Takahashi | Sputtering device |
US20080032036A1 (en) * | 2006-08-02 | 2008-02-07 | Nuflare Technology, Inc. | Manufacturing apparatus for semiconductor device and manufacturing method for semiconductor device |
WO2012013707A1 (en) * | 2010-07-27 | 2012-02-02 | Oerlikon Solar Ag, Trübbach | Heating arrangement and method for heating substrates |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108456873A (zh) * | 2017-02-22 | 2018-08-28 | 北京北方华创微电子装备有限公司 | 一种下电极结构及工艺腔室 |
CN108456873B (zh) * | 2017-02-22 | 2020-04-28 | 北京北方华创微电子装备有限公司 | 一种下电极结构及工艺腔室 |
WO2024050727A1 (en) * | 2022-09-07 | 2024-03-14 | Innoscience (suzhou) Semiconductor Co., Ltd. | Nitride-based wafer chemical vapor deposition device and deposition method of the same |
Also Published As
Publication number | Publication date |
---|---|
EP2896065A1 (en) | 2015-07-22 |
TWI597376B (zh) | 2017-09-01 |
WO2014032192A1 (en) | 2014-03-06 |
TW201413025A (zh) | 2014-04-01 |
US20150228530A1 (en) | 2015-08-13 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information |
Address after: Liechtenstein Barr Che J Applicant after: OERLIKON ADVANCED TECHNOLOGIES Address before: Liechtenstein Barr Che J Applicant before: OC OERLIKON BALZERS AG |
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CB02 | Change of applicant information | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20180117 Address after: Swiss Te Lui Bach Applicant after: EVATEC AG Address before: Liechtenstein Barr Che J Applicant before: OERLIKON ADVANCED TECHNOLOGIES |
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TA01 | Transfer of patent application right | ||
WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20151021 |
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WD01 | Invention patent application deemed withdrawn after publication |