KR101753019B1 - 기판 처리 장치, 기판 처리 방법, 및 기판 처리 시스템 - Google Patents

기판 처리 장치, 기판 처리 방법, 및 기판 처리 시스템 Download PDF

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Publication number
KR101753019B1
KR101753019B1 KR1020167005338A KR20167005338A KR101753019B1 KR 101753019 B1 KR101753019 B1 KR 101753019B1 KR 1020167005338 A KR1020167005338 A KR 1020167005338A KR 20167005338 A KR20167005338 A KR 20167005338A KR 101753019 B1 KR101753019 B1 KR 101753019B1
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substrate
processing apparatus
substrate processing
plan
unit
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KR20160038027A (ko
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다카시 고시다
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가부시키가이샤 스크린 홀딩스
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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/4189—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the transport system
    • H01L21/67276—
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/18—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form
    • G05B19/402—Numerical control [NC], i.e. automatically operating machines, in particular machine tools, e.g. in a manufacturing environment, so as to execute positioning, movement or co-ordinated operations by means of program data in numerical form characterised by control arrangements for positioning, e.g. centring a tool relative to a hole in the workpiece, additional detection means to correct position
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41815—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the cooperation between machine tools, manipulators and conveyor or other workpiece supply system, workcell
    • H01L21/67715—
    • H01L21/6773—
    • H01L21/67772—
    • H01L22/12—
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/40—Robotics, robotics mapping to robotics vision
    • G05B2219/40066—Stack and align identical layers, laminates, electronic substrate layers
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45054—Handling, conveyor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/80—Management or planning

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  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Human Computer Interaction (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • General Factory Administration (AREA)
KR1020167005338A 2013-07-29 2014-07-10 기판 처리 장치, 기판 처리 방법, 및 기판 처리 시스템 Active KR101753019B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013156946A JP6121832B2 (ja) 2013-07-29 2013-07-29 基板処理装置、基板処理方法、および基板処理システム
JPJP-P-2013-156946 2013-07-29
PCT/JP2014/068467 WO2015016033A1 (ja) 2013-07-29 2014-07-10 基板処理装置、基板処理方法、および基板処理システム

Publications (2)

Publication Number Publication Date
KR20160038027A KR20160038027A (ko) 2016-04-06
KR101753019B1 true KR101753019B1 (ko) 2017-07-03

Family

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KR1020167005338A Active KR101753019B1 (ko) 2013-07-29 2014-07-10 기판 처리 장치, 기판 처리 방법, 및 기판 처리 시스템

Country Status (6)

Country Link
US (1) US10241503B2 (https=)
JP (1) JP6121832B2 (https=)
KR (1) KR101753019B1 (https=)
CN (1) CN105431923B (https=)
TW (1) TW201515137A (https=)
WO (1) WO2015016033A1 (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10503850B2 (en) * 2016-11-22 2019-12-10 Tokyo Electron Limited Generation of a map of a substrate using iterative calculations of non-measured attribute data
JP6863114B2 (ja) * 2017-06-16 2021-04-21 東京エレクトロン株式会社 基板処理装置、基板処理方法及び記憶媒体
JP6751735B2 (ja) * 2018-07-25 2020-09-09 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
TWI864258B (zh) * 2020-04-08 2024-12-01 日商東京威力科創股份有限公司 基板處理裝置及基板處理方法
JP7591370B2 (ja) * 2020-08-28 2024-11-28 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008198796A (ja) 2007-02-13 2008-08-28 Tokyo Electron Ltd 基板処理装置の設定操作支援装置，設定操作支援方法，プログラムを記憶する記憶媒体
JP5185054B2 (ja) 2008-10-10 2013-04-17 東京エレクトロン株式会社 基板搬送方法、制御プログラム及び記憶媒体

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3237854B2 (ja) * 1996-06-07 2001-12-10 東京エレクトロン株式会社 処理ステーションの管理装置
JP3766177B2 (ja) 1997-05-15 2006-04-12 大日本スクリーン製造株式会社 基板処理装置および基板洗浄装置
JP2002064128A (ja) * 2000-08-22 2002-02-28 Kaijo Corp 基板搬送装置及びこれを備えた基板処理装置
WO2002046864A2 (en) * 2000-12-07 2002-06-13 Emcore Corporation Automated wafer handling with graphic user interface
JP2005093653A (ja) * 2003-09-17 2005-04-07 Dainippon Screen Mfg Co Ltd 基板処理装置
JP2005096653A (ja) * 2003-09-25 2005-04-14 Toyoda Gosei Co Ltd 後席用エアバッグ及び後席用エアバッグ装置
US8634633B2 (en) * 2003-11-10 2014-01-21 Brooks Automation, Inc. Wafer center finding with kalman filter
US20080101912A1 (en) * 2006-10-26 2008-05-01 Martin Todd W Deposition analysis for robot motion correction
KR20080060669A (ko) 2006-12-27 2008-07-02 세메스 주식회사 기판 이송 모듈 및 이를 갖는 기판 처리 장치
US7933009B2 (en) * 2007-07-27 2011-04-26 Applied Materials, Inc. Method and apparatus for verifying proper substrate positioning
KR20110059724A (ko) * 2008-08-26 2011-06-03 어플라이드 머티어리얼스, 인코포레이티드 레이저 재료 제거 방법 및 장치
JP6005912B2 (ja) 2011-07-05 2016-10-12 株式会社Ｓｃｒｅｅｎホールディングス 制御装置、基板処理方法、基板処理システム、基板処理システムの運用方法、ロードポート制御装置及びそれを備えた基板処理システム
JP5852908B2 (ja) 2011-09-16 2016-02-03 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置のためのスケジュール作成方法およびスケジュール作成プログラム
JP6118044B2 (ja) * 2012-07-19 2017-04-19 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008198796A (ja) 2007-02-13 2008-08-28 Tokyo Electron Ltd 基板処理装置の設定操作支援装置，設定操作支援方法，プログラムを記憶する記憶媒体
JP5185054B2 (ja) 2008-10-10 2013-04-17 東京エレクトロン株式会社 基板搬送方法、制御プログラム及び記憶媒体

Also Published As

Publication number Publication date
CN105431923B (zh) 2018-03-06
US10241503B2 (en) 2019-03-26
JP6121832B2 (ja) 2017-04-26
TWI562262B (https=) 2016-12-11
TW201515137A (zh) 2015-04-16
JP2015026788A (ja) 2015-02-05
US20160161941A1 (en) 2016-06-09
WO2015016033A1 (ja) 2015-02-05
CN105431923A (zh) 2016-03-23
KR20160038027A (ko) 2016-04-06

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