KR101752528B1 - 표면 처리 동박 및 그것을 사용한 적층판, 동판, 프린트 배선판, 전자 기기, 그리고 프린트 배선판의 제조 방법 - Google Patents

표면 처리 동박 및 그것을 사용한 적층판, 동판, 프린트 배선판, 전자 기기, 그리고 프린트 배선판의 제조 방법 Download PDF

Info

Publication number
KR101752528B1
KR101752528B1 KR1020140107817A KR20140107817A KR101752528B1 KR 101752528 B1 KR101752528 B1 KR 101752528B1 KR 1020140107817 A KR1020140107817 A KR 1020140107817A KR 20140107817 A KR20140107817 A KR 20140107817A KR 101752528 B1 KR101752528 B1 KR 101752528B1
Authority
KR
South Korea
Prior art keywords
copper foil
layer
carrier
printed wiring
wiring board
Prior art date
Application number
KR1020140107817A
Other languages
English (en)
Korean (ko)
Other versions
KR20150021473A (ko
Inventor
료 후쿠치
도모타 나가우라
히데타 아라이
아츠시 미키
고스케 아라이
가이치로 나카무로
Original Assignee
제이엑스금속주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 제이엑스금속주식회사 filed Critical 제이엑스금속주식회사
Publication of KR20150021473A publication Critical patent/KR20150021473A/ko
Application granted granted Critical
Publication of KR101752528B1 publication Critical patent/KR101752528B1/ko

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/12Electroplating: Baths therefor from solutions of nickel or cobalt
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/38Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00Electroforming
    • C25D1/04Wires; Strips; Foils
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54Electroplating of non-metallic surfaces
    • C25D5/56Electroplating of non-metallic surfaces of plastics
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0335Layered conductors or foils
    • H05K2201/0355Metal foils

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
KR1020140107817A 2013-08-20 2014-08-19 표면 처리 동박 및 그것을 사용한 적층판, 동판, 프린트 배선판, 전자 기기, 그리고 프린트 배선판의 제조 방법 KR101752528B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2013-186666 2013-08-20
JP2013186666 2013-08-20

Publications (2)

Publication Number Publication Date
KR20150021473A KR20150021473A (ko) 2015-03-02
KR101752528B1 true KR101752528B1 (ko) 2017-06-29

Family

ID=52821355

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140107817A KR101752528B1 (ko) 2013-08-20 2014-08-19 표면 처리 동박 및 그것을 사용한 적층판, 동판, 프린트 배선판, 전자 기기, 그리고 프린트 배선판의 제조 방법

Country Status (5)

Country Link
JP (1) JP5885791B2 (zh)
KR (1) KR101752528B1 (zh)
CN (1) CN104427758B (zh)
MY (1) MY186394A (zh)
TW (1) TWI603655B (zh)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102136784B1 (ko) * 2015-07-24 2020-07-22 케이씨에프테크놀로지스 주식회사 리튬 이차전지용 전해동박 및 이를 포함하는 리튬 이차전지
TWI597390B (zh) * 2015-11-10 2017-09-01 Jx Nippon Mining & Metals Corp Electrolytic copper foil, manufacturing method of electrolytic copper foil, copper clad laminated board, printed wiring board, the manufacturing method of a printed wiring board, and the manufacturing method of an electronic device
KR102274906B1 (ko) * 2016-09-12 2021-07-09 후루카와 덴키 고교 가부시키가이샤 구리박 및 이것을 갖는 동장 적층판
KR20180047897A (ko) * 2016-11-01 2018-05-10 케이씨에프테크놀로지스 주식회사 표면처리 전해동박, 이의 제조방법, 및 이의 용도
JP2018122590A (ja) * 2017-02-02 2018-08-09 Jx金属株式会社 離型層付き金属箔、金属箔、積層体、プリント配線板、半導体パッケージ、電子機器及びプリント配線板の製造方法
JP7033905B2 (ja) * 2017-02-07 2022-03-11 Jx金属株式会社 表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
CN110832120B (zh) * 2017-03-30 2022-01-11 古河电气工业株式会社 表面处理铜箔、以及使用该表面处理铜箔的覆铜板及印刷电路布线板
KR102297790B1 (ko) * 2017-05-19 2021-09-06 미쓰이금속광업주식회사 조화 처리 구리박, 캐리어를 구비한 구리박, 동장 적층판 및 프린트 배선판
KR102180926B1 (ko) 2017-06-28 2020-11-19 에스케이넥실리스 주식회사 우수한 작업성 및 충방전 특성을 갖는 동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법
JP2019065361A (ja) * 2017-10-03 2019-04-25 Jx金属株式会社 Cu−Ni−Sn系銅合金箔、伸銅品、電子機器部品およびオートフォーカスカメラモジュール
KR102390417B1 (ko) * 2017-12-05 2022-04-22 후루카와 덴키 고교 가부시키가이샤 표면 처리 동박, 그리고 이것을 이용한 동 클래드 적층판 및 프린트 배선판
JP6405482B1 (ja) * 2018-03-27 2018-10-17 タツタ電線株式会社 導電性接着剤層用キャリアフィルム及びそれを備えたボンディングフィルム
WO2019187767A1 (ja) * 2018-03-29 2019-10-03 古河電気工業株式会社 絶縁基板及びその製造方法
KR102214641B1 (ko) * 2018-07-16 2021-02-10 삼성전기주식회사 인쇄회로기판
JP7445830B2 (ja) 2018-10-05 2024-03-08 パナソニックIpマネジメント株式会社 銅張積層板、配線板、及び樹脂付き銅箔
KR102349377B1 (ko) * 2019-12-19 2022-01-12 일진머티리얼즈 주식회사 표면처리 동박, 이의 제조방법, 이를 포함한 동박적층판, 및 이를 포함한 프린트 배선판
JP7273883B2 (ja) 2021-04-09 2023-05-15 福田金属箔粉工業株式会社 表面処理銅箔及び該表面処理銅箔を用いた銅張積層板並びにプリント配線板

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5228130B1 (ja) 2012-08-08 2013-07-03 Jx日鉱日石金属株式会社 キャリア付銅箔

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000077851A (ja) * 1998-09-03 2000-03-14 Ibiden Co Ltd 多層プリント配線板の製造方法
TWI414638B (zh) * 2006-06-07 2013-11-11 Furukawa Electric Co Ltd A method for manufacturing a surface-treated electrolytic copper foil, and a circuit board
EP2351876A1 (en) * 2008-11-25 2011-08-03 JX Nippon Mining & Metals Corporation Copper foil for printed circuit
JP5379528B2 (ja) * 2009-03-24 2013-12-25 三井金属鉱業株式会社 キャリア箔付電解銅箔、キャリア箔付電解銅箔の製造方法及びそのキャリア箔付電解銅箔を用いて得られる銅張積層板
JP4690475B2 (ja) * 2009-03-24 2011-06-01 住友電気工業株式会社 サーメット及び被覆サーメット工具
CN102725892A (zh) * 2010-01-25 2012-10-10 吉坤日矿日石金属株式会社 二次电池负极集电体用铜箔
JP5497808B2 (ja) * 2012-01-18 2014-05-21 Jx日鉱日石金属株式会社 表面処理銅箔及びそれを用いた銅張積層板
JP5204908B1 (ja) * 2012-03-26 2013-06-05 Jx日鉱日石金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板用キャリア付銅箔及びプリント配線板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5228130B1 (ja) 2012-08-08 2013-07-03 Jx日鉱日石金属株式会社 キャリア付銅箔

Also Published As

Publication number Publication date
TW201531173A (zh) 2015-08-01
TWI603655B (zh) 2017-10-21
MY186394A (en) 2021-07-22
JP5885791B2 (ja) 2016-03-15
CN104427758A (zh) 2015-03-18
KR20150021473A (ko) 2015-03-02
JP2015061935A (ja) 2015-04-02
CN104427758B (zh) 2018-06-29

Similar Documents

Publication Publication Date Title
KR101632792B1 (ko) 표면 처리 동박 및 그것을 사용한 적층판, 프린트 배선판, 전자 기기, 그리고 프린트 배선판의 제조 방법
KR101752528B1 (ko) 표면 처리 동박 및 그것을 사용한 적층판, 동판, 프린트 배선판, 전자 기기, 그리고 프린트 배선판의 제조 방법
JP5758035B2 (ja) 表面処理銅箔及びそれを用いた積層板、プリント配線板、電子機器、並びに、プリント配線板の製造方法
KR101762049B1 (ko) 캐리어 부착 구리박, 구리 피복 적층판, 프린트 배선판, 전자 기기, 및, 프린트 배선판의 제조 방법
KR101822325B1 (ko) 표면 처리 동박 및 그것을 사용한 적층판, 동박, 프린트 배선판, 전자 기기, 그리고 프린트 배선판의 제조 방법
JP5855259B2 (ja) 表面処理銅箔及びそれを用いた積層板
KR101660663B1 (ko) 표면 처리 동박 및 그것을 사용한 적층판, 구리 피복 적층판, 프린트 배선판 그리고 전자 기기
KR20160129916A (ko) 표면 처리 동박 및 그것을 사용한 적층판, 동박, 프린트 배선판, 전자 기기, 그리고 프린트 배선판의 제조 방법
JP6343204B2 (ja) 表面処理銅箔及びそれを用いたキャリア付銅箔、積層板、プリント配線板、電子機器、並びに、プリント配線板の製造方法
JP6537278B2 (ja) 表面処理銅箔及びそれを用いた積層板、プリント配線板、電子機器、並びに、プリント配線板の製造方法
JP6537279B2 (ja) 表面処理銅箔及びそれを用いた積層板、プリント配線板、電子機器、並びに、プリント配線板の製造方法
TWI489014B (zh) Surface treatment of copper foil and the use of its laminated board, copper laminated board, printed wiring board, and electronic equipment
JP6343205B2 (ja) キャリア付銅箔及びそれを用いた積層板の製造方法、プリント配線板、電子機器、プリント配線板の製造方法、並びに、電子機器の製造方法
JP2015061757A (ja) キャリア付銅箔及びそれを用いた積層板、プリント配線板、電子機器、並びに、プリント配線板の製造方法
JP2015061758A (ja) キャリア付銅箔及びそれを用いた積層板、プリント配線板、電子機器、並びに、プリント配線板の製造方法
JP2015062222A (ja) キャリア付銅箔及びそれを用いた積層板、プリント配線板、電子機器、並びにプリント配線板の製造方法

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E90F Notification of reason for final refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant