KR101752528B1 - 표면 처리 동박 및 그것을 사용한 적층판, 동판, 프린트 배선판, 전자 기기, 그리고 프린트 배선판의 제조 방법 - Google Patents

표면 처리 동박 및 그것을 사용한 적층판, 동판, 프린트 배선판, 전자 기기, 그리고 프린트 배선판의 제조 방법 Download PDF

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Publication number
KR101752528B1
KR101752528B1 KR1020140107817A KR20140107817A KR101752528B1 KR 101752528 B1 KR101752528 B1 KR 101752528B1 KR 1020140107817 A KR1020140107817 A KR 1020140107817A KR 20140107817 A KR20140107817 A KR 20140107817A KR 101752528 B1 KR101752528 B1 KR 101752528B1
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KR
South Korea
Prior art keywords
copper foil
layer
carrier
printed wiring
wiring board
Prior art date
Application number
KR1020140107817A
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English (en)
Korean (ko)
Other versions
KR20150021473A (ko
Inventor
료 후쿠치
도모타 나가우라
히데타 아라이
아츠시 미키
고스케 아라이
가이치로 나카무로
Original Assignee
제이엑스금속주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 제이엑스금속주식회사 filed Critical 제이엑스금속주식회사
Publication of KR20150021473A publication Critical patent/KR20150021473A/ko
Application granted granted Critical
Publication of KR101752528B1 publication Critical patent/KR101752528B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/54—Electroplating of non-metallic surfaces
    • C25D5/56—Electroplating of non-metallic surfaces of plastics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
KR1020140107817A 2013-08-20 2014-08-19 표면 처리 동박 및 그것을 사용한 적층판, 동판, 프린트 배선판, 전자 기기, 그리고 프린트 배선판의 제조 방법 KR101752528B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2013-186666 2013-08-20
JP2013186666 2013-08-20

Publications (2)

Publication Number Publication Date
KR20150021473A KR20150021473A (ko) 2015-03-02
KR101752528B1 true KR101752528B1 (ko) 2017-06-29

Family

ID=52821355

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140107817A KR101752528B1 (ko) 2013-08-20 2014-08-19 표면 처리 동박 및 그것을 사용한 적층판, 동판, 프린트 배선판, 전자 기기, 그리고 프린트 배선판의 제조 방법

Country Status (5)

Country Link
JP (1) JP5885791B2 (ja)
KR (1) KR101752528B1 (ja)
CN (1) CN104427758B (ja)
MY (1) MY186394A (ja)
TW (1) TWI603655B (ja)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102136784B1 (ko) * 2015-07-24 2020-07-22 케이씨에프테크놀로지스 주식회사 리튬 이차전지용 전해동박 및 이를 포함하는 리튬 이차전지
TWI597390B (zh) * 2015-11-10 2017-09-01 Jx Nippon Mining & Metals Corp Electrolytic copper foil, manufacturing method of electrolytic copper foil, copper clad laminated board, printed wiring board, the manufacturing method of a printed wiring board, and the manufacturing method of an electronic device
CN109642338B (zh) * 2016-09-12 2021-02-09 古河电气工业株式会社 铜箔以及具有该铜箔的覆铜板
KR20180047897A (ko) * 2016-11-01 2018-05-10 케이씨에프테크놀로지스 주식회사 표면처리 전해동박, 이의 제조방법, 및 이의 용도
JP2018122590A (ja) * 2017-02-02 2018-08-09 Ｊｘ金属株式会社 離型層付き金属箔、金属箔、積層体、プリント配線板、半導体パッケージ、電子機器及びプリント配線板の製造方法
JP7033905B2 (ja) * 2017-02-07 2022-03-11 Ｊｘ金属株式会社 表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP6543001B2 (ja) * 2017-03-30 2019-07-10 古河電気工業株式会社 表面処理銅箔、並びにこれを用いた銅張積層板およびプリント配線板
CN110382745B (zh) * 2017-05-19 2021-06-25 三井金属矿业株式会社 粗糙化处理铜箔、带载体铜箔、覆铜层叠板及印刷电路板
KR102180926B1 (ko) 2017-06-28 2020-11-19 에스케이넥실리스 주식회사 우수한 작업성 및 충방전 특성을 갖는 동박, 그것을 포함하는 전극, 그것을 포함하는 이차전지, 및 그것의 제조방법
JP2019065361A (ja) * 2017-10-03 2019-04-25 Ｊｘ金属株式会社 Ｃｕ−Ｎｉ−Ｓｎ系銅合金箔、伸銅品、電子機器部品およびオートフォーカスカメラモジュール
CN111655908B (zh) * 2017-12-05 2022-03-29 古河电气工业株式会社 表面处理铜箔以及使用该表面处理铜箔的覆铜层叠板和印刷布线板
JP6405482B1 (ja) * 2018-03-27 2018-10-17 タツタ電線株式会社 導電性接着剤層用キャリアフィルム及びそれを備えたボンディングフィルム
CN111051546B (zh) * 2018-03-29 2021-09-14 古河电气工业株式会社 绝缘基板及其制造方法
KR102214641B1 (ko) * 2018-07-16 2021-02-10 삼성전기주식회사 인쇄회로기판
CN112789167A (zh) * 2018-10-05 2021-05-11 松下知识产权经营株式会社 覆铜箔层压板、布线板、以及带树脂的铜箔
KR102349377B1 (ko) * 2019-12-19 2022-01-12 일진머티리얼즈 주식회사 표면처리 동박, 이의 제조방법, 이를 포함한 동박적층판, 및 이를 포함한 프린트 배선판
JP7273883B2 (ja) * 2021-04-09 2023-05-15 福田金属箔粉工業株式会社 表面処理銅箔及び該表面処理銅箔を用いた銅張積層板並びにプリント配線板

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5228130B1 (ja) 2012-08-08 2013-07-03 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000077851A (ja) * 1998-09-03 2000-03-14 Ibiden Co Ltd 多層プリント配線板の製造方法
TWI414638B (zh) * 2006-06-07 2013-11-11 Furukawa Electric Co Ltd A method for manufacturing a surface-treated electrolytic copper foil, and a circuit board
EP2351876A1 (en) * 2008-11-25 2011-08-03 JX Nippon Mining & Metals Corporation Copper foil for printed circuit
JP4690475B2 (ja) * 2009-03-24 2011-06-01 住友電気工業株式会社 サーメット及び被覆サーメット工具
JP5379528B2 (ja) * 2009-03-24 2013-12-25 三井金属鉱業株式会社 キャリア箔付電解銅箔、キャリア箔付電解銅箔の製造方法及びそのキャリア箔付電解銅箔を用いて得られる銅張積層板
SG182300A1 (en) * 2010-01-25 2012-08-30 Jx Nippon Mining & Metals Corp Copper foil for negative electrode current collector of secondary battery
JP5497808B2 (ja) * 2012-01-18 2014-05-21 Ｊｘ日鉱日石金属株式会社 表面処理銅箔及びそれを用いた銅張積層板
JP5204908B1 (ja) * 2012-03-26 2013-06-05 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板用キャリア付銅箔及びプリント配線板

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5228130B1 (ja) 2012-08-08 2013-07-03 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔

Also Published As

Publication number Publication date
JP2015061935A (ja) 2015-04-02
TWI603655B (zh) 2017-10-21
CN104427758A (zh) 2015-03-18
CN104427758B (zh) 2018-06-29
JP5885791B2 (ja) 2016-03-15
KR20150021473A (ko) 2015-03-02
MY186394A (en) 2021-07-22
TW201531173A (zh) 2015-08-01

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