KR101750713B1 - 마이크로스프링 접점을 갖는 인터포저 및 그 제조 및 사용 방법 - Google Patents

마이크로스프링 접점을 갖는 인터포저 및 그 제조 및 사용 방법 Download PDF

Info

Publication number
KR101750713B1
KR101750713B1 KR1020110095001A KR20110095001A KR101750713B1 KR 101750713 B1 KR101750713 B1 KR 101750713B1 KR 1020110095001 A KR1020110095001 A KR 1020110095001A KR 20110095001 A KR20110095001 A KR 20110095001A KR 101750713 B1 KR101750713 B1 KR 101750713B1
Authority
KR
South Korea
Prior art keywords
microspring
substrate
interposer
free
microsprings
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020110095001A
Other languages
English (en)
Korean (ko)
Other versions
KR20120031140A (ko
Inventor
유진 엠. 차우
Original Assignee
팔로 알토 리서치 센터 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 팔로 알토 리서치 센터 인코포레이티드 filed Critical 팔로 알토 리서치 센터 인코포레이티드
Publication of KR20120031140A publication Critical patent/KR20120031140A/ko
Application granted granted Critical
Publication of KR101750713B1 publication Critical patent/KR101750713B1/ko
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/644—Elastic or compliant interconnections, e.g. springs, cantilevers or elastic pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H10P72/7418—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding of passive members, e.g. a chip mounting substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7438—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support with parts of the auxiliary support remaining in the finished device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01215—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps forming coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/012—Manufacture or treatment of bump connectors, dummy bumps or thermal bumps
    • H10W72/01251—Changing the shapes of bumps
    • H10W72/01253—Changing the shapes of bumps by etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/221—Structures or relative sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/231—Shapes
    • H10W72/232—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/231—Shapes
    • H10W72/234—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/231—Shapes
    • H10W72/235—Shapes of outermost layers of multilayered bumps, e.g. bump coating not being conformal on a bump core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/242—Dispositions, e.g. layouts relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/244—Dispositions, e.g. layouts relative to underlying supporting features, e.g. bond pads, RDLs or vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/245—Dispositions, e.g. layouts of outermost layers of multilayered bumps, e.g. bump coating being only on a part of a bump core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/252—Materials comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/251—Materials
    • H10W72/255—Materials of outermost layers of multilayered bumps, e.g. material of a coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/261—Functions other than electrical connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Measuring Leads Or Probes (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
KR1020110095001A 2010-09-22 2011-09-21 마이크로스프링 접점을 갖는 인터포저 및 그 제조 및 사용 방법 Expired - Fee Related KR101750713B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US12/887,814 2010-09-22
US12/887,814 US8441808B2 (en) 2010-09-22 2010-09-22 Interposer with microspring contacts

Publications (2)

Publication Number Publication Date
KR20120031140A KR20120031140A (ko) 2012-03-30
KR101750713B1 true KR101750713B1 (ko) 2017-06-27

Family

ID=45816712

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110095001A Expired - Fee Related KR101750713B1 (ko) 2010-09-22 2011-09-21 마이크로스프링 접점을 갖는 인터포저 및 그 제조 및 사용 방법

Country Status (4)

Country Link
US (2) US8441808B2 (https=)
JP (1) JP5706794B2 (https=)
KR (1) KR101750713B1 (https=)
TW (1) TWI556377B (https=)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5077324B2 (ja) * 2009-10-26 2012-11-21 株式会社デンソー 配線基板
US8441808B2 (en) * 2010-09-22 2013-05-14 Palo Alto Research Center Incorporated Interposer with microspring contacts
US9306302B2 (en) * 2012-04-30 2016-04-05 Hewlett Packard Enterprise Development Lp Socket with routed contacts
US8686552B1 (en) 2013-03-14 2014-04-01 Palo Alto Research Center Incorporated Multilevel IC package using interconnect springs
US9386693B2 (en) * 2014-05-05 2016-07-05 Lockheed Martin Corporation Board integrated interconnect
US20160229689A1 (en) * 2015-02-11 2016-08-11 Analog Devices, Inc. Packaged Microchip with Patterned Interposer
EP3356286B1 (en) * 2015-09-30 2022-12-21 TDK Corporation Resiliently mounted sensor system with damping
US11289443B2 (en) 2017-04-20 2022-03-29 Palo Alto Research Center Incorporated Microspring structure for hardware trusted platform module
US11171103B2 (en) 2020-01-06 2021-11-09 International Business Machines Corporation Solder ball dimension management
US11054593B1 (en) 2020-03-11 2021-07-06 Palo Alto Research Center Incorporated Chip-scale optoelectronic transceiver with microspringed interposer
US11908782B2 (en) 2021-03-22 2024-02-20 Xerox Corporation Spacers formed on a substrate with etched micro-springs
US11527420B2 (en) * 2021-03-22 2022-12-13 Palo Alto Research Center Incorporated Micro-fabricated, stress-engineered members formed on passivation layer of integrated circuit

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004501517A (ja) 2000-06-20 2004-01-15 ナノネクサス　インコーポレイテッド 集積回路をテスト及びパッケージングするためのシステム
JP2006508495A (ja) 2002-03-18 2006-03-09 ナノネクサス インク 小型化されたコンタクトスプリング

Family Cites Families (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6741085B1 (en) * 1993-11-16 2004-05-25 Formfactor, Inc. Contact carriers (tiles) for populating larger substrates with spring contacts
US5783870A (en) 1995-03-16 1998-07-21 National Semiconductor Corporation Method for connecting packages of a stacked ball grid array structure
US5613861A (en) 1995-06-07 1997-03-25 Xerox Corporation Photolithographically patterned spring contact
US5944537A (en) 1997-12-15 1999-08-31 Xerox Corporation Photolithographically patterned spring contact and apparatus and methods for electrically contacting devices
US5979892A (en) 1998-05-15 1999-11-09 Xerox Corporation Controlled cilia for object manipulation
US6672875B1 (en) 1998-12-02 2004-01-06 Formfactor, Inc. Spring interconnect structures
KR20020028159A (ko) * 1999-05-27 2002-04-16 나노넥서스, 인코포레이티드 전자 회로용 대량 병렬 인터페이스
WO2001009623A1 (en) * 1999-07-28 2001-02-08 Nanonexus, Inc. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
US6352454B1 (en) 1999-10-20 2002-03-05 Xerox Corporation Wear-resistant spring contacts
US6267605B1 (en) 1999-11-15 2001-07-31 Xerox Corporation Self positioning, passive MEMS mirror structures
US6213789B1 (en) 1999-12-15 2001-04-10 Xerox Corporation Method and apparatus for interconnecting devices using an adhesive
US6794725B2 (en) 1999-12-21 2004-09-21 Xerox Corporation Amorphous silicon sensor with micro-spring interconnects for achieving high uniformity in integrated light-emitting sources
US6827584B2 (en) 1999-12-28 2004-12-07 Formfactor, Inc. Interconnect for microelectronic structures with enhanced spring characteristics
EP1275150A2 (en) * 2000-04-12 2003-01-15 Formfactor, Inc. Shaped springs and methods of fabricating and using shaped springs
US6392524B1 (en) 2000-06-09 2002-05-21 Xerox Corporation Photolithographically-patterned out-of-plane coil structures and method of making
US6856225B1 (en) 2000-05-17 2005-02-15 Xerox Corporation Photolithographically-patterned out-of-plane coil structures and method of making
US6396677B1 (en) 2000-05-17 2002-05-28 Xerox Corporation Photolithographically-patterned variable capacitor structures and method of making
US6290510B1 (en) 2000-07-27 2001-09-18 Xerox Corporation Spring structure with self-aligned release material
US6521970B1 (en) * 2000-09-01 2003-02-18 National Semiconductor Corporation Chip scale package with compliant leads
US6632373B1 (en) 2000-09-28 2003-10-14 Xerox Corporation Method for an optical switch on a substrate
US6504643B1 (en) 2000-09-28 2003-01-07 Xerox Corporation Structure for an optical switch on a substrate
US6743982B2 (en) 2000-11-29 2004-06-01 Xerox Corporation Stretchable interconnects using stress gradient films
US6534249B2 (en) 2001-02-09 2003-03-18 Xerox Corporation Method of making low cost integrated out-of-plane micro-device structures
US6655964B2 (en) 2001-02-09 2003-12-02 Xerox Corporation Low cost integrated out-of-plane micro-device structures and method of making
US6595787B2 (en) 2001-02-09 2003-07-22 Xerox Corporation Low cost integrated out-of-plane micro-device structures and method of making
JP3724432B2 (ja) 2001-04-19 2005-12-07 株式会社ニコン 薄膜弾性構造体及びその製造方法並びにこれを用いたミラーデバイス及び光スイッチ
US6528350B2 (en) * 2001-05-21 2003-03-04 Xerox Corporation Method for fabricating a metal plated spring structure
US6560861B2 (en) 2001-07-11 2003-05-13 Xerox Corporation Microspring with conductive coating deposited on tip after release
DE10149688B4 (de) 2001-10-09 2004-09-09 Infineon Technologies Ag Verfahren zum Herstellen einer Mikrokontaktfeder auf einem Substrat
US6794737B2 (en) * 2001-10-12 2004-09-21 Xerox Corporation Spring structure with stress-balancing layer
US6777963B2 (en) 2001-11-08 2004-08-17 Koninklijke Philips Electronics N.V. Chip-mounted contact springs
US6684499B2 (en) 2002-01-07 2004-02-03 Xerox Corporation Method for fabricating a spring structure
US6668628B2 (en) 2002-03-29 2003-12-30 Xerox Corporation Scanning probe system with spring probe
US7011530B2 (en) 2002-05-24 2006-03-14 Sitaraman Suresh K Multi-axis compliance spring
US6621141B1 (en) 2002-07-22 2003-09-16 Palo Alto Research Center Incorporated Out-of-plane microcoil with ground-plane structure
JP2004259530A (ja) 2003-02-25 2004-09-16 Shinko Electric Ind Co Ltd 外部接触端子を有する半導体装置及びその使用方法
JP2007527507A (ja) 2003-07-08 2007-09-27 キューナノ エービー ナノウィスカーを組み込んだプローブ構造体、その製造方法及びナノウィスカーを形成する方法
US7015584B2 (en) 2003-07-08 2006-03-21 Xerox Corporation High force metal plated spring structure
US6998703B2 (en) 2003-12-04 2006-02-14 Palo Alto Research Center Inc. Thin package for stacking integrated circuits
US7400041B2 (en) * 2004-04-26 2008-07-15 Sriram Muthukumar Compliant multi-composition interconnects
US7649145B2 (en) 2004-06-18 2010-01-19 Micron Technology, Inc. Compliant spring contact structures
US20060030179A1 (en) * 2004-08-05 2006-02-09 Palo Alto Research Center, Incorporated Transmission-line spring structure
US7456092B2 (en) 2004-10-07 2008-11-25 Palo Alto Research Center Incorporated Self-releasing spring structures and methods
US7230440B2 (en) 2004-10-21 2007-06-12 Palo Alto Research Center Incorporated Curved spring structure with elongated section located under cantilevered section
US7166326B1 (en) 2004-12-14 2007-01-23 Palo Alto Research Center (Parc) Method of electroplating stressed metal springs
US7550855B2 (en) * 2005-12-02 2009-06-23 Palo Alto Research Center Incorporated Vertically spaced plural microsprings
US7344906B2 (en) 2005-12-15 2008-03-18 Palo Alto Research Center Incorporated Structure and method for releasing stressy metal films
US7426117B2 (en) 2005-12-21 2008-09-16 Xerox Corporation Chip on a board
US7982290B2 (en) 2006-01-12 2011-07-19 Palo Alto Research Center, Inc. Contact spring application to semiconductor devices
US7927905B2 (en) * 2007-12-21 2011-04-19 Palo Alto Research Center Incorporated Method of producing microsprings having nanowire tip structures
US8519534B2 (en) * 2010-09-22 2013-08-27 Palo Alto Research Center Incorporated Microsprings partially embedded in a laminate structure and methods for producing same
US8441808B2 (en) * 2010-09-22 2013-05-14 Palo Alto Research Center Incorporated Interposer with microspring contacts

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004501517A (ja) 2000-06-20 2004-01-15 ナノネクサス　インコーポレイテッド 集積回路をテスト及びパッケージングするためのシステム
JP2006508495A (ja) 2002-03-18 2006-03-09 ナノネクサス インク 小型化されたコンタクトスプリング

Also Published As

Publication number Publication date
TWI556377B (zh) 2016-11-01
KR20120031140A (ko) 2012-03-30
US20160128206A9 (en) 2016-05-05
JP5706794B2 (ja) 2015-04-22
US9967982B2 (en) 2018-05-08
US20130232782A1 (en) 2013-09-12
TW201222745A (en) 2012-06-01
US20120067637A1 (en) 2012-03-22
US8441808B2 (en) 2013-05-14
JP2012069952A (ja) 2012-04-05

Similar Documents

Publication Publication Date Title
KR101750713B1 (ko) 마이크로스프링 접점을 갖는 인터포저 및 그 제조 및 사용 방법
TWI763666B (zh) 連接電子組件至基板
KR101536045B1 (ko) 팬 아웃 웨이퍼 레벨 패키지 구조
CN103109367B (zh) 可堆叠的模塑微电子封装
CN103283007B (zh) 不流动底充胶
US9312151B2 (en) Method of manufacturing semiconductor device and method of manufacturing electronic device including an adhesive layer on a support member
KR20180121893A (ko) 내장형 실리콘 기판의 팬 아웃 3d 패키지 구조
US20160189983A1 (en) Method and structure for fan-out wafer level packaging
US8927345B2 (en) Device package with rigid interconnect structure connecting die and substrate and method thereof
KR20150012285A (ko) 와이어 본드 상호연결을 이용하여 기판 없이 적층가능한 패키지
KR20060002954A (ko) 나선형 미세 전자 접속체 및 그의 제조 방법
KR20130086347A (ko) 영역 어레이 유닛 컨넥터를 갖는 적층 가능한 몰딩된 마이크로전자 패키지
TWI553800B (zh) 部分地埋置於層體結構內之微型彈簧
KR20120038440A (ko) 재구성된 웨이퍼의 제조 동안 칩들을 포지셔닝하는 방법
JP2021197431A (ja) 半導体装置の製造方法
US9245819B2 (en) Embedded electrical component surface interconnect
CN103229609B (zh) 第二级互连结构及其制造方法
EP3038150A1 (en) Chip scale package with flexible interconnect
EP4290569A1 (en) Composite wiring board
US9997425B2 (en) Layered benzocyclobutene interconnected circuit and method of manufacturing same
KR101221257B1 (ko) 단차를 가진 중공 구조가 형성된 전도성 범프 수용 구조체 제조 방법과 전도성 범프 구조체 제조 방법, 이에 의하여 제조된 전도성 범프 수용 구조체 및 이를 이용한 칩간 접속 방법
CN121693240A (zh) 芯片封装结构及其形成方法

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

A302 Request for accelerated examination
E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0302 Request for accelerated examination

St.27 status event code: A-1-2-D10-D17-exm-PA0302

St.27 status event code: A-1-2-D10-D16-exm-PA0302

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 7

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R13-asn-PN2301

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 8

PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20250621

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

H13 Ip right lapsed

Free format text: ST27 STATUS EVENT CODE: N-4-6-H10-H13-OTH-PC1903 (AS PROVIDED BY THE NATIONAL OFFICE); TERMINATION CATEGORY : DEFAULT_OF_REGISTRATION_FEE

Effective date: 20250621

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20250621