KR101739833B1 - Die bonder and method for detecting positions of bonding tool and semiconductor die relative to each other - Google Patents

Die bonder and method for detecting positions of bonding tool and semiconductor die relative to each other Download PDF

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Publication number
KR101739833B1
KR101739833B1 KR1020147023857A KR20147023857A KR101739833B1 KR 101739833 B1 KR101739833 B1 KR 101739833B1 KR 1020147023857 A KR1020147023857 A KR 1020147023857A KR 20147023857 A KR20147023857 A KR 20147023857A KR 101739833 B1 KR101739833 B1 KR 101739833B1
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South Korea
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bonding tool
image
semiconductor die
camera
bonding
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KR1020147023857A
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Korean (ko)
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KR20140128357A (en
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마사히토 츠지
오키토 우메하라
케이이치 히루마
아키라 우라하시
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가부시키가이샤 신가와
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75743—Suction holding means
    • H01L2224/75745—Suction holding means in the upper part of the bonding apparatus, e.g. in the bonding head
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75753—Means for optical alignment, e.g. sensors

Abstract

A bonding tool 24, a strobe 34, a camera 32 and a shank 20, and the bonding tool 24 has a suction surface 27 at the tip for absorbing the semiconductor die 30, The camera 32 has a base portion that is thicker than the absorption surface 27 of the front end and a slope inclined with respect to the longitudinal center line and connects the absorption surface 27 and the base portion, The shank 20 acquires the image of the shank 20 and the image of the inclined surface of the bonding tool 24 at the same time and the shank 20 is adjacent to the base portion of the bonding tool 24, Is positioned away from the depth of focus of the camera 32 in the longitudinal direction of the bonding tool 24 and does not move relative to the bonding tool 24 but reflects the light from the strobe 34. [ As a result, the positional deviation between the bonding tool and the semiconductor die is effectively detected with a simple configuration in the die bonder.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a method of detecting a relative position between a die bonder, a bonding tool, and a semiconductor die,

The present invention relates to a structure of a die bonder and a method of detecting a relative position between a bonding tool and a semiconductor die sucked at the tip of the bonding tool.

BACKGROUND ART A die bonder is widely used as an apparatus for bonding a semiconductor die to a circuit board such as a lead frame. The die bonder lowers the semiconductor die held by suction at the tip of the bonding tool toward the surface of the circuit board adhered and fixed on the bonding stage and bonds the semiconductor die onto the circuit board.

It is necessary to press the semiconductor die onto the circuit board in a state where the position of the semiconductor die sucked by the bonding tool is aligned with the bonding position of the circuit board in the die bonder. Therefore, when transferring the semiconductor die by the bonding tool, a method of acquiring the image of the back surface of the semiconductor die sucked by the bonding tool and matching the relative position of the semiconductor die and the circuit board based on the alignment mark on the back surface of the semiconductor die (See, for example, Patent Document 1).

However, in the method described in Patent Document 1, there is a problem that the transfer of the semiconductor die needs to be temporarily stopped when acquiring an image, and the tact time is lengthened. Therefore, when a reference member having a mirror and a rectangular through-hole is fixed with an L-shaped connecting member interposed therebetween in the moving wick head of the semiconductor die, and when the semiconductor die is transported by the moving wick head, The first image data obtained by picking up the semiconductor die and the second image data obtained by picking up the reference part are acquired and the two pieces of image data are superimposed to detect the position of the semiconductor die with respect to the reference part, Therefore, a method of correcting the position of the semiconductor die mounted on the circuit board has been proposed (for example, see Patent Document 2).

Japanese Laid-Open Patent Publication No. 2010-40738 Japanese Patent Application Laid-Open No. 2007-115851

In the conventional technique described in Patent Document 2, since it is necessary to dispose the reference member at a position that does not hinder the bonding, the optical path from the reference member to the camera and the optical path from the tip of the mobile placement head to the semiconductor die To be a separate optical path. On the other hand, in order to simultaneously capture the image of the reference member and the image of the semiconductor die sucked at the tip of the moving wand head, it is necessary to configure the optical path so as to arrange the two optical paths together. It is also necessary to make the optical path length from the reference member to the camera equal to the optical path length from the surface of the semiconductor die to the camera so that the image of the reference member and the semiconductor die is in focus. For this purpose, it is necessary to use a half mirror or a prism in the optical system, and the configuration of the optical system becomes complicated.

In the prior art described in Patent Document 2, since the reference member is attached to the moving mount head by the connecting member, the reference component vibrates due to the reciprocating movement of the moving mount head, There is a problem that the positional deviation of the die occurs (see Patent Document 2, paragraph 0096).

Therefore, the present invention aims at effectively detecting the positional deviation between the bonding tool and the semiconductor die with a simple structure.

The die bonder of the present invention includes a bonding tool, a light source, a camera, and a reflector, and the bonding tool includes a bonding surface of a front end that absorbs the semiconductor die, a base portion that is thicker than the front end of the bonding surface, And the light source is disposed on the attraction surface side of the bonding tool, and the camera simultaneously acquires the image of the semiconductor die, the image of the reflector, and the image of the inclined surface of the bonding tool, which are attracted to the attraction surface The reflector is disposed adjacent to the base portion of the bonding tool, is disposed apart from the attraction surface in the longitudinal direction of the bonding tool, and is not relatively moved with respect to the bonding tool, And is reflected on the absorption surface side of the bonding tool.

The die bonder of the present invention further includes an image processing section that processes an image of a reflector obtained by a camera, an image of an inclined surface of a bonding tool acquired by a camera, and an image of a semiconductor die acquired by a camera, It is also suitable to detect the relative position between the tool and the semiconductor die.

In the die bonder of the present invention, the reflector is a stepped portion adjacent to the base portion of the ring or bonding tool attached to the shank or the bonding tool holding the bonding tool, and has a reflecting surface perpendicular to the longitudinal center line of the bonding tool , And the reflective surface may be a cross-section of the shank suction surface side or a ring cross-section of the adsorption surface side or a cross section of the step portion.

In the die bonder of the present invention, the relative position between the bonding tool and the semiconductor die is determined by a shift amount between the position on the adsorption surface of the longitudinal center line of the bonding tool and the position on the adsorption surface of the center of the semiconductor die, But it is also suitable to be one or both of inclination angles of the semiconductor die

The die bonder of the present invention further includes a moving mechanism and a control unit, wherein the moving mechanism moves the bonding tool, the control unit moves the bonding tool by the moving mechanism, and the bonding tool moves from the pickup position of the semiconductor die to the bonding position The image of the semiconductor die and the image of the inclined surface of the bonding tool and the image of the reflector are simultaneously acquired by the camera while the bonding tool is being moved .

The die bonder of the present invention further includes a moving mechanism and a control unit, wherein the moving mechanism moves the bonding tool, the control unit changes the position of the bonding tool by the moving mechanism, The position of the bonding tool may be corrected based on the relative position of the die.

A position detecting method for detecting a relative position between a bonding tool and a semiconductor die according to the present invention is a position detecting method for detecting a relative position between a bonding tool and a semiconductor die in a die bonder, A bonding tool having a front end absorbing surface for absorbing the semiconductor die, a base portion being thicker than the absorbing surface of the front end, a bonding tool connecting the absorbing surface and the base portion and having an inclined surface inclined with respect to the longitudinal centerline, A light source disposed on the side of the adsorption surface and a reflector that does not relatively move between the bonding tool and reflects the light from the light source to the adsorption surface side of the bonding tool and the image of the semiconductor die adsorbed on the adsorption surface and the image of the reflector And a camera for simultaneously acquiring an image of an inclined plane of the bonding tool, wherein the reflector is adjacent to the base portion of the bonding tool, And a reflecting surface that is disposed at a distance from the depth of focus of the camera in the longitudinal direction of the bonding tool and perpendicular to the longitudinal center line of the bonding tool, And the relative position detection step acquires an image of the reflector obtained by the camera, an image of the inclined surface of the bonding tool acquired by the camera, and an image of the semiconductor die acquired by the camera, And the semiconductor die.

In the position detecting method of the present invention, the relative position between the bonding tool and the semiconductor die is determined by a shift amount between a position on the adsorption surface of the longitudinal center line of the bonding tool and a position on the adsorption surface of the center of the semiconductor die, It is also preferable that the inclination angle of the semiconductor die is either or both inclination angles.

In the position detecting method of the present invention, the die bonder further includes a moving mechanism for moving the bonding tool, and the image acquiring step moves the bonding tool by the moving mechanism so that the bonding tool moves from the pickup position of the semiconductor die to the bonding position The image of the semiconductor die, the image of the reflector, and the image of the inclined surface of the bonding tool are simultaneously acquired by the camera while moving the bonding tool while the light source is at a predetermined position between the semiconductor die and the bonding tool .

INDUSTRIAL APPLICABILITY The present invention has the effect of effectively detecting the positional deviation between the bonding tool and the semiconductor die with a simple structure.

BRIEF DESCRIPTION OF DRAWINGS FIG. 1 is a system diagram showing a configuration of a control system of a die bonder according to an embodiment of the present invention. FIG.
Fig. 2 is an explanatory view showing details of a bonding tool and a shank of a die bonder in an embodiment of the present invention. Fig.
3 is an explanatory view showing the operation of the die bonder in the embodiment of the present invention.
4 is an explanatory view showing a structure of a bonding tool and a shank of a die bonder according to an embodiment of the present invention and an image captured by a camera.
5 is an explanatory view showing a step of binarizing the image shown in Fig.
6 is an explanatory view showing an image obtained by binarizing the image shown in Fig.
7 is an explanatory view showing a structure of a bonding tool and a ring of a die bonder according to another embodiment of the present invention and an image captured by a camera.
8 is a diagram showing the structure of a bonding tool of a die bonder according to another embodiment of the present invention and an explanatory view showing an image captured by a camera.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1, the die bonder 10 of the present invention includes a bonding head 15 to which a bonding tool 24 is attached via a shank 20, a guide rail 15 which guides the bonding head 15 in the Y direction, A Y-direction moving mechanism 13 for moving the bonding head 15 in the Y direction; an X-direction moving mechanism 12 for moving the guide rail 11 and the bonding head 15 in the X direction; A camera 32 provided below the bonding head 15, a strobe 34 as a light source, an image processing unit 40 to which a camera 32 and a strobe 34 are connected, an X, Y direction moving mechanism 12, and 13 are connected to each other. The bonding tool 24 has a suction surface 27 for sucking the semiconductor die 30 at the tip thereof and the strobe 34 has a reflecting mirror 35 for directing the emitted light toward the bonding tool 24 have. The bonding head 15 includes a Z direction moving mechanism 16 for moving the bonding tool 24 in the Z direction and a θ direction moving mechanism 17 for rotating the bonding tool 24 in the θ direction , And each of the moving mechanisms 16 and 17 is connected to the control unit 50. The control unit 50 moves the bonding tool 24 in the X, Y, Z, and θ directions by operating the respective moving mechanisms 12, 13, 16, and 17 in the X, Y, . As shown in the coordinate axes in Fig. 1, the horizontal direction is the Y direction, the vertical direction is the Z direction, the vertical direction is the X direction, and the rotation direction around the Z axis is the [theta] direction.

As shown in Fig. 1, the image processing section 40 is a computer having a CPU 41 for processing signals and data therein, and a memory 42 for storing data and programs. The memory 42 internally stores an image acquisition program 43, a relative position detection program 44, and control data 45 to be described later. The image processing unit 40 includes a camera interface 47 and a strobe interface 48 for connecting to the camera 32 and the strobe 34. The image processing unit 40 is provided with a data bus interface 46 for performing data communication with the control unit 50 which is another computer. The CPU 41, the memory 42 and the respective interfaces 47 and 48 and the data bus interface 46 are connected by a data bus 49 in the image processing section 40.

1, the control unit 50 is a computer having a CPU 51 for processing signals and data therein, and a memory 52 for storing data and programs, similarly to the image processing unit 40 The CPU 41 and the memory 42 of the image processing unit 40 via the data bus interface 56 and the communication line 60 and the data bus interface 46 of the image processing unit 40. [ The memory 52 stores the position control program 53, the correction program 54 and the control data 55 which will be described later. The control unit 50 is also provided with a moving mechanism interface 57 for connecting with the moving mechanisms 12, 13, 16, 17 in the X, Y, Z, and θ directions. The CPU 51, the memory 52, the moving mechanism interface 57 and the data bus interface 56 are connected by a data bus 59 inside the control unit 50. [

Each of the X, Y, Z, and θ moving mechanisms 12, 13, 16 and 17 of the die bonder 10 of the present embodiment is located in each of the X, Y, Z and θ directions of the tip of the bonding tool 24 Y, Z, and &thetas; of the tip of the bonding tool 24 from the signals of the respective moving mechanisms 12, 13, 16, and 17 Quot;

2, the bonding tool 24 includes a suction surface 27 at the tip for absorbing the semiconductor die 30, a base portion 25 thicker than the suction surface 27 at the tip, And an inclined curved surface 26 connecting the base portion 25 and an inclined surface inclined with respect to the longitudinal center line 90. The absorption surface 27 at the tip end is approximately the same size as the semiconductor die 30 and is a plane perpendicular to the longitudinal center line 90 of the bonding tool 24. [ The back surface of the semiconductor die 30 adsorbed on the adsorption surface 27 is also a plane perpendicular to the longitudinal center line 90 of the bonding tool 24. [

The base portion 25 of the bonding tool 24 has a cylindrical shape fixed to the shank 20 and is thicker than the suction surface 27 at the front end and the inclined curved surface 26 extends from the suction surface 27 to the base portion 25, In the form of a funnel. The shank 20 has a cylindrical shape in which the outer peripheral surface of the base portion 25 of the bonding tool 24 is fitted to the inner circumferential side and the end surface 21 of the shank 20, Is a plane perpendicular to the longitudinal direction of the bonding tool 24 or the longitudinal center line 90 of the bonding tool 24, and its surface is mirror finished. Since the shank 20 is fitted with the bonding tool 24, the shank 20 is not moved relative to the bonding tool 24 but is disposed at a position adjacent to the base 25.

2, the camera 32 is mounted on the back surface (the surface on the lower side in the Z direction) of the semiconductor die 30 adsorbed by the bonding tool 24 when the bonding tool 24 moves to a predetermined position on the upper side And the sharpness of the back surface of the semiconductor die 30 can be obtained. That is, the camera 32 is adjusted such that the optical path length L1 between the lens of the camera 32 and the back surface of the semiconductor die 30 is the focal length of the lens of the camera 32. [

2, the inclined curved surface 26 of the bonding tool 24 and the end surface 21 of the shank 20 are arranged away from the adsorption surface 27 for absorbing the semiconductor die 30 in the longitudinal direction And the optical path length from the lens of the camera 32 to the inclined curved surface 26 of the bonding tool 24 and the end surface 21 of the shank 20 is the optical path lengths L2 and L3. On the other hand, since the depth of focus D of the lens of the camera 32 is a little longer than the thickness of the semiconductor die 30, the optical path lengths L2 and L3 respectively correspond to the optical path length L1 and the depth of focus D Is longer than the sum of the lengths. Therefore, when the image of the back surface of the semiconductor die 30, the image of the inclined curved surface 26 of the bonding tool 24, and the image of the end surface 21 of the shank 20 are acquired simultaneously by the camera 32, The inclined curved surface 26 of the bonding tool 24 and the end surface 21 of the shank 20 are in an unfit state and the image of the inclined curved surface 26 and the image of the end surface 21 are slightly blurred .

Next, the operation of the die bonder 10 of the present embodiment will be described. 3, the control unit 50 of the die bonder 10 executes the position control program 53 to drive the respective moving mechanisms 12, 13, 16, 17 in the X, Y, Z, The bonding tool 24 is moved on the diced wafer placed on the pick-up stage 36 and the semiconductor die 30 is sucked onto the suction surface 27 at the tip of the bonding tool 24. 3, the bonding head 15 is moved on the bonding stage 37 and the bonding head 15 is lowered onto the circuit board which is fixed on the bonding stage 37 by suction , The semiconductor die 30 is bonded onto the circuit board. This is the basic operation of the die bonder 10.

The CPU 51 of the control unit 50 executes the position control program 53 and controls the position of the bonding tool 24 in the X, Y, Z, and X directions while moving the bonding tool 24 from the pick- Y, Z and? Of the tip of the bonding tool 24 from the signals of the respective moving mechanisms 12, 13, 16 and 17 and detects the positions of the bonding tool 24 When the longitudinal center line 90 of the bonding tool 24 is combined with the center position of the lens of the camera 32 in a predetermined position immediately above the camera 32, And outputs a signal. The trigger signal is transmitted to the image processing section 40 by the data bus interfaces 56 and 46 and the communication line 60. The predetermined position is a position previously set in the position control program 53. [

The CPU 41 of the image processing unit 40 executes the image acquisition program 43 when the trigger signal is input. The CPU 41 outputs a command to light the strobe 34. [ With this instruction, the light emission signal is output from the strobe interface 48 to the strobe 34, and the strobe 34 emits light. When the trigger signal is inputted, the image processing unit 40 passes the camera interface 47 in synchronization with the light emission of the strobe 34, and takes in the image from the camera 32. The accepted image is stored in the memory 42 of the image processing section 40. [ In addition, the blowing of the image is performed while the bonding tool 24 is being moved (without stopping the movement).

The light from the strobe 34 is emitted from the side of the absorption surface 27 of the bonding tool 24 to the side of the bonding tool 24 as indicated by arrows 71, The inclined curved surface 26, the back surface of the semiconductor die 30, and the end surface 21 of the shank 20, as shown in Fig. A part of the light incident on the end face 21 of the shank 20 is directed in the longitudinal direction of the bonding tool 24 or along the longitudinal center line 90 of the bonding tool 24 Z direction minus side) and is incident on the camera 32 on the lower side (on the side of the attracting surface 27) of the bonding tool 24 as shown in Fig. Therefore, in the present embodiment, the shank 20 is a reflector, and the end surface 21 of the shank 20 is a reflecting surface. A part of the light incident on the back surface or the lower surface (the surface on the minus side in the Z direction) of the semiconductor die 30 is formed in the longitudinal direction of the bonding tool 24, (Negative side in the Z direction) along the longitudinal center line 90 of the tool 24 and enters the camera 32 on the lower side of the bonding tool 24 (on the side of the attracting surface 27).

On the other hand, as shown by an arrow 73 in FIG. 4, the light incident on the inclined curved surface 26 of the bonding tool 24 has a length of the bonding tool 24 such as a horizontal direction as shown by an arrow 74 shown in FIG. Direction or in a direction different from the direction along the longitudinal centerline 90 of the bonding tool 24. [

4 (b), in the field of view 33 of the camera 32, the light from the strobe 34 is reflected on the end face 21 of the camera 32, Of the slant surface 26 of the bonding tool 24 that does not reflect the light from the strobe 34 toward the camera 32 has a low brightness (black or gray) ) Circular image 82 and the light from the strobe 34 located in the circular image 82 is reflected toward the camera 32. The backside of the semiconductor die 30 has a lightness An image 84 is captured. The image processing unit 40 acquires these three images 81, 82, and 84 at the same time by the camera 32 and stores them in the memory 42. [ The image 83 at the tip of the bonding tool 24 shown by the broken line in Fig. 4 (b) is obscured by the image of the semiconductor die 30 and is not captured by the camera 32. Fig.

As described above, since the focus of the camera 32 is adjusted to fit the back surface of the semiconductor die 30, the image 84 on the back surface of the semiconductor die 30 is a sharp image. However, the end face 21 of the shank 20 and the inclined curved surface 26 of the bonding tool 24 are offset from the back surface of the semiconductor die 30 by a distance Z that is larger than the depth of focus D of the camera 32 A ring image 81 having a high brightness of the section 21 and a circular image 82 having a low brightness (black or gray) of the inclined curved surface 26 are faint images.

The CPU 41 of the image processing unit 40 executes the relative position detection program 44. [ In the following description, the brightness of an image is described as 256 gradations (brightness 0 to brightness 255). 5A, the ring-shaped image 81 (an image of the reflector) of the brightness of 255 on the end face 21 and the inclined curved surface 26 of the bonding tool 24 (An image of an oblique plane) of the brightness 0 of the semiconductor die 30 and a square image 84 of the brightness 255 of the back surface of the semiconductor die 30. As described above, the ring-shaped image 81 and the circular image 82 are faint images because the focus of the camera 32 is out of alignment. Therefore, as shown in Fig. 5 (a), the brightness of the image 81 is brightness 255 as indicated by a line a in the outer circumferential portion. However, since the brightness 81 is not in focus due to approaching the circular image 82, 82 are mixed with each other, and brightness is slightly lowered as indicated by line b. When entering the area of the image 82, the brightness rapidly decreases, and the brightness in the inner area of the image 82 becomes near zero. Then, as indicated by line c, the state of brightness 0 continues to the image 84 on the back surface of the semiconductor die 30. Since the focus of the camera 32 is matched to the backside of the semiconductor die 30, the image 84 has a sharp outline. Since the back surface of the semiconductor die 30 reflects the light of the strobe 34, the lightness is 255 in brightness. Thus, the brightness of the image rises substantially vertically from brightness 0 to brightness 255 at the edge of the image 84, as indicated by line d. In the area of the image 84, as shown by the line e, the brightness becomes constant at 255. [

5 (a), the CPU 41 of the image processing unit 40 uses the binarization threshold values set in advance to calculate the rounded outer contour baseline of the image 82 as shown in Fig. 5 (b) (91) and a quadrangular outer shape reference line (92) of the image (84). The binarization threshold is set such that a circular line having substantially the same diameter as the outer shape of the base portion 25 of the bonding tool 24 is formed in the image 82 when the condition of the light of the strobe 34, In advance so as to be able to be acquired as the round outer contour reference line 91 of FIG. Since the image 81 and the image 82 are the images of the inclined curved surface 26 of the bonding tool 24 and the end surface 21 of the shank 20 arranged concentrically, The change in the brightness of each area becomes a target around the longitudinal center line of the bonding tool 24. Therefore, even when the conditions of the light state and the photographing position of the strobe 34 are deviated from the reference conditions, the curve of the brightness change between the image 81 and the image 82 is the same as the one-dot chain line b ' The round outer contour 91 'to be obtained using the binarization threshold value shown in Fig. 5 (b) becomes the base of the bonding tool 24 And the outer shape of the bonding tool 24 having a smaller diameter than the outer shape of the portion 25. Therefore, even when the conditions of the light state and the photographing position of the strobe 34 are deviated from the reference condition, the centers of the round outer contour bases 91 and 91 'coincide with the positions of the longitudinal center line of the bonding tool 24 .

The back surface of the semiconductor die 30 is in focus and the brightness changes substantially vertically at the edge of the image 84. Even when the conditions of the light of the strobe 34 and the photographing position are deviated from the reference condition The size of the square outer contour line 92 of the image 84 hardly changes.

That is, in the present embodiment, the ring-shaped image 81 of the end face 21 that reflects the light of the strobe 34 has a high brightness, and on the contrary, the inclined curved surface 26 that does not reflect the light of the strobe 34, The circular image 82 has a low brightness and the difference in brightness is very large. The position of the end face 21 and the inclined curved face 26 in the longitudinal direction of the bonding tool 24 is farther from the back face of the semiconductor die 30 than the depth of focus D and even if a sharp image can not be obtained, It is possible to reliably extract the circular outer shape reference line 91 concentric with the outer shape of the bonding tool 24 by using the large difference in brightness between the images 81 and 82. In addition, it is possible to reliably extract the rectangular outer reference line 92 by using the sharp edge of the image 84 on the back surface of the semiconductor die 30.

6, the image processing section 40 detects the position of the center 97 of the circular outer shape basic line 91 and the position of the center 98 of the rectangular outer shape reference line 92 from the processed image An X direction reference line 94 passing through the center 97 of the circular outer reference line 91 and oriented in the X direction of the field of view 33 of the camera 32 and a center 97 of the circular outer reference line 91, Direction reference line 93 that is directed to the Y direction of the field of view 33 of the camera 32. The Y- The image processing section 40 also includes an X-direction measurement line 96 that passes through the center 98 of the rectangular outer reference line 92 and is parallel to a side of the rectangular outer reference line 92 near the X- Direction measuring line 95 that passes through the center 98 of the rectangular outer reference line 92 and is parallel to the side of the rectangular outer reference line 92 near the Y-direction reference line 93. [ The image processing unit 40 then calculates the shift amount DELTA X in the X direction and the Y direction in the position of the center 97 of the circular outer reference line 91 and the position of the center 98 of the rectangular outer reference line 92, ? Y). The image processing section 40 also has an angle difference in the? Direction between the X direction reference line 94 and the X direction measurement line 96 or an angle in the? Direction between the Y direction reference line 93 and the Y direction measurement line 95 The rotation angle deviation ?? in the? -Direction of the rectangular external reference line 92 is detected from the car.

The outer contour 91 of the circular shape is concentric with the contour of the inner side of the end face 21 of the shank 20 which is not displaced relative to the bonding tool 24 and the contour of the contour of the bonding tool 24 The position of the center 97 of the circular outer reference line 91 is the center position of the longitudinal center line 90 of the bonding tool 24 shown in Fig. 4 (a) The center 98 of the square outer contour line 92 becomes the center position of the semiconductor die 30 at the point where the edge 92 of the semiconductor die 30 is the edge of the contour of the semiconductor die 30. X and Y directions of the circular outer shape basic line 91 and the rectangular outer shape reference line 92 are shifted from the center position of the bonding tool 24 to the center position of the semiconductor die 30 In the X and Y directions.

An X direction reference line 94 passing through the center 97 of the circular outer reference line 91 and oriented in the X direction of the field of view 33 of the camera 32 and a center 97 of the circular outer reference line 91, Direction reference line 93 of the visual field 33 of the camera 32 facing the Y direction is a reference line on the attracting surface 27 of the bonding tool 24 and a center 98 of the rectangular outer reference line 92 Direction measurement line 96 parallel to the sides of the quadrangular outer reference line 92 near the X direction reference line 94 and the center 98 of the quadrangular outer reference line 92, A Y-direction measurement line 95 parallel to the Y-direction reference line 93 of the reference line 92 indicates a tilt angle of the semiconductor die 30 with respect to a reference line on the suction surface 27 of the bonding tool 24. [ Line. Therefore, the angle difference between the X-direction reference line 94 and the X-direction measurement line 96 or the angle difference between the Y-direction reference line 93 and the Y-direction measurement line 95 in the? The rotation angle deviation ?? in the? Direction of the external reference line 92 is the inclination angle of the semiconductor die 30 with respect to the reference axis on the attracting surface 27 of the bonding tool 24. The deviation amount between the center position of the bonding tool 24 and the center position of the semiconductor die 30 in the X and Y directions and the deviation amount of the semiconductor die 30 relative to the reference axis on the attracting surface 27 of the bonding tool 24 30 are the relative positions of the bonding tool 24 and the semiconductor die 30.

The image processing section 40 detects the shift amounts DELTA X, DELTA Y and DELTA [theta] in the X, Y and θ directions of the semiconductor die 30 with respect to the bonding tool 24 and outputs the data to the data bus interfaces 46 and 56 ), And transmits it to the control section 50 through the communication line 60. The CPU 51 of the control unit 50 executes the correction program 54 and controls the respective moving mechanisms 12, 13, 16 (see FIG. 3) until the bonding tool 24 is moved to the bonding stage 37 shown in FIG. X, Y, and? In the X, Y, and &thetas; directions by correcting the position of the leading end of the bonding tool 24 detected by the X, Y, The semiconductor die 30 can be bonded to the semiconductor die 30 in a position and direction.

As described above, the die bonder 10 of the present embodiment has the image 81 of the end face 21 of the shank 20 holding the bonding tool 24 and the inclined curved surface of the bonding tool 24 26 using the difference in brightness between the image 84 of the semiconductor die 30 and the image 82 of the inclined curved surface 26 of the bonding tool 24, The end face 21 and the inclined curved face 26 are located closer to the back side of the semiconductor die 30 than the depth of focus D because the center position of the longitudinal center line 90 of the semiconductor die 30 and the center position of the semiconductor die 30 are detected It is possible to reliably detect the relative positions of the bonding tool 24 and the semiconductor die 30 even when the images 81 and 82 are not sharp. For this reason, the positional deviation of the semiconductor die can be detected effectively without using a complicated optical system, with the simple structure that the end face 21 of the shank 20 is made mirror-finished to be a reflecting surface. The shank 20 grasps the bonding tool 24 and does not move relative to the bonding tool 24 so that when the image of the bonding tool 24, the shank 20 and the semiconductor die 30 is obtained It is not necessary to stop the movement of the bonding tool 24, and the tact time can be shortened. Further, since the shank 20 is not protruded from the bonding head 15, vibration is not generated by the movement of the bonding head 15, and the positional deviation of the semiconductor die can be effectively detected with a simple structure.

The inclined surface of the bonding tool 24 is inclined with respect to the longitudinal center line 90 of the bonding tool 24 and the inclined surface 26 is inclined with respect to the longitudinal direction center line 90 of the bonding tool 24. In the present embodiment, It may be any shape as long as it does not reflect light in the direction along the longitudinal center line 90. For example, it may be a tapered surface that connects the attracting surface 27 and the base portion 25 in an oblique direction.

In the present embodiment, it has been described that the positional shift amount is detected during the bonding operation and the correction is performed. However, the present invention can be applied not only to the correction during the bonding operation, It is also applicable to measuring the positional deviation in advance and setting the offset amount of the bonding tool 24 according to the result. In this case, the movement of the bonding tool 24 is stopped at the time of acquiring an image, and the inclined curved surface 26 of the bonding tool 24 picked up in the stopped state, the shank 20, and each image of the semiconductor die 30 81, 82, 84) and the bonding tool 24 without stopping the movement of the bonding tool 24, the shift amount and the offset amount may be set.

In the present embodiment, the position of the bonding tool 24 is corrected based on the relative position of the bonding tool 24 and the semiconductor die 30 adsorbed on the adsorption face 27 of the bonding tool 24 The relative position between the bonding tool 24 and the pick-up stage 36 or the bonding stage 37 is corrected using the position detection result of the longitudinal center line 90 of the bonding tool 24, Or the displacement of the bonding position in accordance with the temperature change of the bonding position. In this case, for example, a moving average of the positional deviation between the bonding tool 24 and the pick-up stage 36 or the bonding stage 37 is obtained, and based on the tendency of the variation of the moving average value, .

Next, another embodiment of the present invention will be described with reference to Figs. 7 and 8. Fig. The same reference numerals are given to the same parts as in the embodiment described with reference to Figs. 1 to 6, and a description thereof will be omitted. The embodiment shown in Fig. 7 has a structure in which a ring 22 fixed to the outer periphery of the base portion 25 of the bonding tool 24 is attached to the lower side of the shank 20 of the embodiment described with reference to Figs. 1 to 6 will be. The lower end surface 23 of the ring 22 is mirror-finished so as to be capable of reflecting light from the strobe 34. In the present embodiment, the ring 22 is a reflector, the end surface 23 is a reflection surface, and the ring 22 is disposed adjacent to the base portion 25.

As shown in Fig. 7 (b), in the present embodiment, the camera 32 includes an image 86 on the end face 23 of the ring 22 with a slightly hazy (white) ring shape, (Black or gray) image 82 of the slope curved surface 26 of the semiconductor wafer 24 and the image 84 of the back surface of the semiconductor die 30 having a high lightness (white) The circular outer contour line 91 between the image 86 of the oblique curve 26 and the oblique curve 26 image 82 and the oblique curve 26 image 82 and the image 84 of the back surface of the semiconductor die 30, And the relative positions of the bonding tool 24 and the semiconductor die 30 are detected. The effect of this embodiment is the same as the embodiment described with reference to Figs. 1 to 6 above.

8 (a), a step is formed in the base portion 25 of the bonding tool 24 and the lower surface 29 of the stepped portion 28 is subjected to mirror surface finishing to form the strobe 34 The light from the light source can be reflected. The bottom surface 29 of the stepped portion 28 is a reflecting surface and the bottom surface 29 is disposed adjacent to the base portion 25 have.

As shown in Fig. 8 (b), in the present embodiment, the camera 32 includes an image 88 of the lower surface 29 of the step portion 28 having a slightly hazy (white) ring shape, The image 82 of the low brightness (black or gray) of the slope curved surface 26 of the tool 24 and the image 84 of the back surface of the semiconductor die 30 of high brightness (white) Circular outline reference line 91 between the image 88 of the semiconductor die 30 and the image 88 of the back surface of the semiconductor die 30 and the inclined curved surface 26, And the relative position between the bonding tool 24 and the semiconductor die 30 is detected. The effect of this embodiment is the same as the embodiment described with reference to Figs. 1 to 6 above.

The present invention is not limited to the embodiments described above, but includes all changes and modifications which do not depart from the technical scope and nature of the present invention defined by the claims.

10 ... Die bonder 11 ... Guide rail
12 ... X-direction moving mechanism 13 ... Y-direction moving mechanism
15 ... Bonding head 16 ... Z-direction moving mechanism
17 ... the? direction moving mechanism 20 ... Shank
21, 23 ... Section 22 ... ring
24 ... Bonding tool 25 ... Base portion
26 ... Slope surface 27 ... Absorbing surface
28 ... Step 29 ... if
30 ... Semiconductor die 32 ... camera
33 ... Perspective 34 ... Strobe
35 ... Reflector 36 ... Pickup stage
37 ... Bonding stage 38 ... Locus
40 ... Image processing sections 41 and 51, CPU
42, 52 ... Memory 43 ... The image acquisition program
44 ... Relative position detection programs 45, 55 ... Control data
46, 56 ... Data bus interface 47 ... Camera interface
48 ... Strobe interface 49, 59 ... Data bus
50 ... The control unit 53 ... Position control program
54 ... Calibration program 57 ... Mobile interface
60 ... Communication lines 71 to 76 ... arrow
81-89 ... Image 90 ... Longitudinal centerline
91 ... Circular outer baseline 92 ... Square outline baseline
93 ... Y-direction reference line 94 ... X-direction reference line
95 ... Y direction measurement line 96 ... X-direction measurement line
97, 98 ... Center D ... Depth of focus
L1 to L3 ... Optical path lengths? X,? Y, ?? Shift amount

Claims (16)

Bonding tool,
Light source,
camera,
A reflector disposed coaxially with the bonding tool, and
An image processing unit,
Wherein the bonding tool includes a base portion that is thicker than the absorption surface of the tip at the tip for absorbing the semiconductor die and an inclined surface that connects the absorption surface and the base portion and is inclined with respect to the longitudinal centerline,
Wherein the light source is disposed on the attraction surface side of the bonding tool,
The camera simultaneously acquires an image of the semiconductor die, an image of the reflector, and an image of the inclined surface of the bonding tool, which are attracted to the attracting surface,
Wherein the reflector is a shank holding the bonding tool, a ring attached to the bonding tool, or a step portion adjacent to the base portion of the bonding tool, adjacent to the base portion of the bonding tool, And a reflecting surface for reflecting light from the light source at least on the side of the adsorption surface of the bonding tool without being relatively moved with respect to the bonding tool ,
Wherein the reflection surface is a cross-section of the shark on the side of the adsorption surface or a cross-section of the ring on the side of the adsorption surface or a cross section of the step,
Wherein the image processing unit is configured to detect the white and blurred circular image of the inclined surface of the bonding tool acquired by the camera and the white and blurred image of the reflector which is concentric with the circular image acquired by the camera and is adjacent to the outer periphery of the circular image The position of the center line in the longitudinal direction of the bonding tool is detected by the lightness difference between the image of the ring shape and the image,
Wherein the center of the semiconductor die is divided by a difference in brightness between a dark and blurred circular image of the inclined plane of the bonding tool acquired by the camera and a white and sharp image of the semiconductor die positioned in the circular image acquired by the camera, Detecting a position,
The die bonder detecting a relative position between the bonding tool and the semiconductor die from a position of the center line in the longitudinal direction of the bonding tool and a shift amount of the center position of the semiconductor die in the XY direction. The method according to claim 1,
The image processing unit
And a controller for processing the image of the reflector obtained by the camera, the image of the inclined surface of the bonding tool acquired by the camera, and the image of the semiconductor die acquired by the camera, Y, and θ directions of the bonding tool and the semiconductor die. The method according to claim 1,
Wherein the reflective surface is a surface perpendicular to the longitudinal centerline of the bonding tool. 3. The method of claim 2,
Wherein the reflective surface is a surface perpendicular to the longitudinal centerline of the bonding tool. 3. The method of claim 2,
Wherein a relative position between the bonding tool and the semiconductor die is a shift amount between a position on the attracting surface of the longitudinal center line of the bonding tool and a position on the attracting surface of the center of the semiconductor die, And the inclination angle of the semiconductor die. The method according to claim 1,
Also,
And a control unit,
The moving mechanism moves the bonding tool,
Wherein the control unit moves the bonding tool by the moving mechanism and causes the light source to emit light when the bonding tool reaches a predetermined position between the pickup position and the bonding position of the semiconductor die, And simultaneously acquires an image of the semiconductor die sucked on the attracting surface by the camera, an image of the inclined surface of the bonding tool, and an image of the reflector. 3. The method of claim 2,
Also,
And a control unit,
The moving mechanism moves the bonding tool,
Wherein the control unit moves the bonding tool by the moving mechanism and causes the light source to emit light when the bonding tool reaches a predetermined position between the pickup position and the bonding position of the semiconductor die, And simultaneously acquires an image of the semiconductor die sucked on the attracting surface by the camera, an image of the inclined surface of the bonding tool, and an image of the reflector. 3. The method of claim 2,
Also,
And a control unit,
The moving mechanism moves the bonding tool,
Wherein the control unit changes the position of the bonding tool by the moving mechanism and corrects the position of the bonding tool based on a relative position between the bonding tool and the semiconductor die detected by the image processing unit Die bonder. A position detecting method for detecting a relative position between a bonding tool of a die bonder and a semiconductor die,
Image acquisition step
Relative position detection process
/ RTI >
Wherein the die bonder comprises a bonding tool having a front end absorbing surface for absorbing the semiconductor die, a base portion thicker than the absorbing surface of the front end, a bonding tool connecting the absorbing surface and the base portion and having an inclined surface inclined with respect to a longitudinal centerline, A light source disposed on a side of the bonding surface of the bonding tool; a light source disposed on the same axis as the bonding tool and not relatively moved between the bonding tool and the light source, And a camera for simultaneously acquiring an image of the semiconductor die and an image of the reflector and an image of the inclined surface of the bonding tool, the reflector being adjacent to the base portion of the bonding tool And is disposed away from the attracting surface in a longitudinal direction of the bonding tool from a depth of focus of the camera, And a reflecting surface perpendicular to the longitudinal centerline of the reflecting surface,
Wherein the image acquiring step simultaneously acquires an image of the semiconductor die, an image of the reflector, and an image of the inclined plane of the bonding tool, which are attracted to the attracting surface by the camera,
Wherein the relative position detecting step is a step of detecting a relative position of the reflecting surface of the bonding tool, which is concentric with the circular image obtained by the camera, of the oblique surface of the bonding tool acquired by the camera, The position of the center line in the longitudinal direction of the bonding tool is detected by the lightness difference between the white and blurred ring-
Wherein the center of the semiconductor die is divided by a difference in brightness between a dark and blurred circular image of the inclined plane of the bonding tool acquired by the camera and a white and sharp image of the semiconductor die positioned in the circular image acquired by the camera, Detecting a position,
Wherein a relative position between the bonding tool and the semiconductor die is detected from a position of a center line in the longitudinal direction of the bonding tool and a shift amount of the center position of the semiconductor die in the XY direction. 10. The method of claim 9,
Wherein a relative position between the bonding tool and the semiconductor die is a shift amount between a position on the attracting surface of the longitudinal center line of the bonding tool and a position on the attracting surface of the center of the semiconductor die, Wherein the tilt angle of the semiconductor die is one or both of inclination angles of the semiconductor die. 10. The method of claim 9,
Wherein the die bonder further comprises a moving mechanism for moving the bonding tool,
The bonding tool moves the bonding tool by the moving mechanism to cause the light source to emit light when the bonding tool reaches a predetermined position between the pickup position and the bonding position of the semiconductor die, And simultaneously acquires an image of the semiconductor die, an image of the reflector, and an image of the inclined plane of the bonding tool while being moved by the camera on the attracting surface. 11. The method of claim 10,
Wherein the die bonder further comprises a moving mechanism for moving the bonding tool,
The bonding tool moves the bonding tool by the moving mechanism to cause the light source to emit light when the bonding tool reaches a predetermined position between the pickup position and the bonding position of the semiconductor die, And simultaneously acquires an image of the semiconductor die, an image of the reflector, and an image of the inclined plane of the bonding tool while being moved by the camera on the attracting surface. A bonding tool having a suction surface for sucking a semiconductor die at its tip, a base portion having a larger thickness than the suction surface at the tip, and an inclined surface inclined to the longitudinal center line, connecting the suction surface and the base portion,
A holding portion having a reflecting surface parallel to the attracting surface and holding the base portion,
A light source disposed below the absorption surface and projecting onto the absorption surface,
A camera disposed below the attracting surface for picking up the lower surface of the semiconductor die attracted to the attracting surface, the inclined surface and the reflecting surface in the same field of view,
A binarization process of an image of the absorption surface and the reflection surface reflecting the light from the light source to the camera side and a binarization process of an image of the slope surface reflecting the light from the light source in a direction not incident on the camera And an image processing unit using different binarization thresholds in the die bonder. 14. The method of claim 13,
The image processing unit
Contour setting means for setting a first contour line for the outer periphery of the inclined surface and a second contour line for contour corresponding to the edge of the semiconductor with respect to the image of the reflector picked up by the camera;
Calculating a first center coordinate of the first external reference line and a second center coordinate of the second external reference line based on the difference between the first and second center coordinates, And a displacement amount detecting means for detecting a displacement amount of the die bonder. 14. The method of claim 13,
The image processing unit
Contour setting means for setting a first contour line for the outer periphery of the inclined plane and a second contour line for contour corresponding to the edge of the semiconductor die with respect to the picked-
And rotation amount detecting means for calculating an angle difference between the first external reference line and the second external reference line and for detecting a displacement in the rotational direction of the semiconductor die with respect to the bonding tool based on the angle difference And a die bonder. 16. The method according to any one of claims 13 to 15,
Wherein the camera has a depth of focus that is focused on a lower surface of the semiconductor die than the slope and the reflective surface.
KR1020147023857A 2012-07-12 2013-04-10 Die bonder and method for detecting positions of bonding tool and semiconductor die relative to each other KR101739833B1 (en)

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