JPH088592A - Electronic part mounting device - Google Patents

Abstract

PURPOSE:To prevent the improper mounting of an electronic part held by a suction nozzle by immediately detecting the positional deviation of the part even when the deviation occurs after a picture recognition process is performed. CONSTITUTION:In an electronic part mounting device constituted of a part supplier provided at a part supplying position, X-Y table which is provided at a part mounting position and on which circuit boards are placed, and a part mounting head which intermittently moves a plurality of suction nozzles 18 for holding electronic part supplied from the part supplier by suction toward the part mounting position, a pressure sensor 23 which can detect the suction pressures of the nozzles 18 for holding an electronic part 5 is provided. The part 5 mounting operation of this electronic part mounting device is controlled based on the output signal of the sensor 23.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus for automatically mounting electronic components on a wiring board.

[0002]

2. Description of the Related Art A conventional electronic component mounting apparatus is constructed as shown in FIG. 3 and operates as shown in FIG. That is, the component feeder 2 is mounted on the component supply table 1, and the plurality of suction nozzles 4, 4, ... Are mounted on the component mounting head 3. The component mounting head 3 intermittently moves the suction nozzle 4 around. The electronic components supplied by the component supply unit 2 are picked up one by one by suction by the suction nozzle 4 that has moved to the position S1. The suction nozzle 4 that has moved to the position S2 rotates the suction-held electronic component 5 so as to align it with the component mounting direction. The posture of the electronic component 5 moved to the position S3 is image-recognized by the component recognizer 6, and the positional deviation in the rotation direction is corrected at the position S4. At the position S5, the cross line sensor 7 confirms the attitude of the electronic component 5, and the electronic component 5 is mounted on the wiring board 8 at the position S6.
The wiring board 8 is placed on the XY table 9, and
Reference numeral 0 indicates a θ rotation motor.

As described above, in the conventional electronic component mounting apparatus, the suction state of the electronic component 5 with respect to the suction nozzle 4 is detected by the component recognizer 6 and the cross line sensor 7, and the displacement of the electronic component 5 is corrected. . Parts recognizer 6
As shown in FIG. 5, it comprises a component recognition camera 11 and a lighting fixture 12, and captures the suction state of the electronic component 5 as an image 13 as illustrated in FIGS. 6 (a) and 6 (b). The displacement of the electronic component 5 sucked and held by the suction nozzle 4 is detected by the component recognizer 6, and the XY table 9 is driven based on the detection output, so that the positional shift amount ΔX in the X direction, The positional deviation amount ΔY in the Y direction is corrected. FIG. 6A shows a normal adsorption state, and FIG.
Indicates the adsorption state in which the positions are displaced.

FIGS. 7A and 7B are a plan view and a side view for explaining the operation principle of the cross line sensor 7. Since the parallel light rays 14 are radiated from the side to the electronic component 5 and the suction nozzle 4 which holds the electronic component by suction,
A shadow 15 of the electronic component 5 and the suction nozzle 4 is generated on the light receiving surface of the image sensor 16 including a CCD. By subtracting the height b of the suction nozzle 4 from the total length a of the shadow 15, a dimension c corresponding to the thickness of the electronic component 5 is obtained. d indicates a measurable range.

As shown in FIG. 7 (c), when the electronic component 5 is held by suction in an inclined state, the electronic component 5
Since the dimension c corresponding to the thickness of the wiring is detected longer than the reference dimension, it is recognized as a suction error and the wiring board 8 is detected at the position S6.
It is not attached to and is discharged as a defective product by skipping to position S8.

As described above, the electronic component 5 supplied from the component supply device 2 is transferred while undergoing various treatments due to the intermittent rotation of the component mounting head 3, and only the component in the normal suction state is positioned. It is mounted on the wiring board 8 in S6, and as the mounting density of components is further increased, it is required to further improve the mounting accuracy.

[0007]

In the conventional electronic component mounting apparatus as described above, the electronic component moved to the position S3 is image-recognized by the component recognizer 6, and the positional deviation is corrected / confirmed at the positions S4 and S5. However, when the electronic component 5 after the image recognition process is displaced from the center axis 4a of the suction nozzle 4 as shown in FIG. 8A, the moment of inertia applied to the electronic component 5 increases, The position shifts greatly even if a slight external force is applied.
Then, as shown in FIG. 8B, once a gap 17 is formed between the electronic component 5 and the suction nozzle 4, the position S6 is reached.
There is a problem that the holding state of the electronic component 5 is further changed until the time reaches, and the displacement amounts ΔX, ΔY, and Δθ are changed.

Accordingly, an object of the present invention is to provide an electronic component which can immediately detect a gap, if any, between the suction nozzle and the electronic component suction-held by the suction nozzle, and reflect the gap in the mounting operation. To provide a mounting device.

[0009]

According to the present invention, in order to achieve the above-mentioned object, a component feeder disposed at a component supply position and a circuit board disposed at a component mounting position are mounted. An XY table, a plurality of suction nozzles for sucking and holding the electronic components supplied by the component feeder, and a component mounting head for intermittently moving the suction nozzles toward the component mounting position, and an electronic component An electronic component comprising: a pressure sensor provided for each suction nozzle to detect a change in suction pressure of the suction nozzle that has suctioned, and controlling a mounting operation of the suction nozzle based on an electric signal output from the pressure sensor. A mounting device is provided.

[0010]

In the present invention, since the pressure sensor provided for each suction nozzle detects a change in the suction pressure of the suction nozzle that has sucked the electronic component, there is no gap between the suction nozzle and the electronic component sucked by the suction nozzle. If it does occur, it can be detected immediately. Then, based on this detection output, the mounting operation of the suction nozzle is stopped, or control is performed to perform re-inspection. Therefore, even if the electronic component after the image recognition process has a positional shift before reaching the mounting position, Occurrence of mounting failure due to this is suppressed.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

The configuration of this embodiment is different from that shown in FIG. 3 in that it is a vacuum system for a plurality of suction nozzles, and there is no fundamental difference in other configurations.

The vacuum system is constructed as shown in FIG. That is, the nozzle unit 1 including the suction nozzle 18
9 communicates with a vacuum generator 22 composed of a vacuum pump through a component mounting head 20 and a flexible air pipe 21, and a pressure sensor 2 for generating an output voltage proportional to the degree of vacuum.
3 is provided in a pipe portion between the vacuum generator 22 and the nozzle unit 19.

As the component mounting head 20 rotates intermittently, the nozzle unit 19 moves to the position S as shown in FIG.
The movement from 1 to the position S10 is the same as in the conventional case.

The electronic component 5 sucked and held by the suction nozzle 18 at the position S1 receives rotation control for adjusting the mounting direction at the position S2, and performs image recognition processing at the position S3.
Receive at. Then, in the transfer process 24 from the position S3 to the mounting position S6, the pressure sensor 23 detects a change in the suction force with respect to the electronic component 5 by a change in the vacuum pressure.

Therefore, when a gap as shown in FIG. 8B is generated between the suction surface of the suction nozzle 18 and the electronic component 5, even if it is generated instantaneously, the change in the suction force is caused by the vacuum pressure. Is detected by the pressure sensor 23, and the output voltage of the pressure sensor 23 changes.

In this example, when the output voltage of the pressure sensor 23 changes, the mounting operation of the electronic component sucked by the suction nozzle is not performed and the position S6 is skipped. Then, as shown by an arrow 25 in FIG. 2, the circuit is further rotated once, and the mounting operation is performed at the position S6 only when the suction force of the electronic component does not change in the process, and when the change occurs, the sheet is discharged at the position S8. The method of letting it take.

Although one nozzle unit is representatively shown in FIG. 1, a pressure sensor is actually provided for each vacuum system of all the nozzle units, and the nozzle unit of each nozzle unit is based on the output signal of each pressure sensor. Controls the subsequent behavior.

[0019]

As described above, according to the present invention, after image recognition processing is performed on the electronic component sucked and held by the suction nozzle,
Positional deviations that occur during the process of mounting electronic components on the circuit board can be immediately detected, and the mounting operation of the suction nozzle is controlled based on this detection output, further improving mounting accuracy. Can be made.

[Brief description of drawings]

FIG. 1 is a perspective view of a vacuum system for a suction nozzle of an electronic component mounting apparatus according to an exemplary embodiment of the present invention.

FIG. 2 is an operation explanatory diagram of the electronic component mounting apparatus according to the embodiment of the present invention.

FIG. 3 is a perspective view showing the overall configuration of an electronic component mounting apparatus.

FIG. 4 is an operation explanatory view of the electronic component mounting apparatus.

FIG. 5 is a perspective view showing a configuration of a component recognizer.

FIG. 6 is a pattern diagram of an image captured by a component recognizer.

FIG. 7 is a diagram for explaining the operation principle of the cross line sensor.

FIG. 8 is a diagram showing a suction state of an electronic component with respect to a suction nozzle.

[Explanation of symbols]

 18 Adsorption Nozzle 20 Component Mounting Head 22 Vacuum Generator 23 Pressure Sensor

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hironori Konno 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (1)

[Claims] 1. A component supply device arranged at a component supply position, an XY table arranged at a component mounting position for mounting a circuit board, and an electronic component supplied by the component supply device. A component mounting head that is equipped with multiple suction nozzles and that intermittently moves the suction nozzles to the component mounting position, and a suction nozzle that detects the change in suction pressure of the suction nozzle that has suctioned electronic components. An electronic component mounting apparatus comprising: a pressure sensor that controls the suction nozzle mounting operation based on an electric signal output from the pressure sensor.