JP2844825B2 - Electronic component mounting method and mounting device - Google Patents
Electronic component mounting method and mounting deviceInfo
- Publication number
- JP2844825B2 JP2844825B2 JP2095816A JP9581690A JP2844825B2 JP 2844825 B2 JP2844825 B2 JP 2844825B2 JP 2095816 A JP2095816 A JP 2095816A JP 9581690 A JP9581690 A JP 9581690A JP 2844825 B2 JP2844825 B2 JP 2844825B2
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- JP
- Japan
- Prior art keywords
- component
- chip component
- nozzle
- holding
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Supply And Installment Of Electrical Components (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、チップ部品をプリント基板上の所定位置に
装着する電子部品装着装置に関する。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus for mounting a chip component at a predetermined position on a printed circuit board.
従来の技術 昨今、電子部品実装分野の拡大と共に、電子部品実装
装置には、高生産性・高信頼性・高機能性が求められ、
特に、電子部品のチップ化への移行と共に電子部品装着
装置に求められるニーズは大きなものとなっている。2. Description of the Related Art Recently, with the expansion of the electronic component mounting field, electronic component mounting apparatuses are required to have high productivity, high reliability, and high functionality.
In particular, with the shift to electronic components as chips, the needs required for electronic component mounting apparatuses are increasing.
第６図，第７図を用いて、従来の電子部品装着装置の
一例を説明する。An example of a conventional electronic component mounting apparatus will be described with reference to FIGS. 6 and 7. FIG.
第６図は、電子部品装着装置の構成を示している。 FIG. 6 shows a configuration of the electronic component mounting apparatus.
第６図に於て14は部品供給テーブルであり、部品供給
装置15を固定・保持し、所定の部品供給を行なえる様に
一方向に直動可能となっている。16はヘッドであり、間
欠回転運動を行なう。17は吸着ノズルであり、ヘッド16
の周縁に回動可能かつ昇降自在に取り付けられている。
18はモータであり、吸着ノズル17の方向を定める。19は
電子部品であり、20はＸ−Ｙテーブルである。21は止め
具であり、プリント基板22をＸ−Ｙテーブル20上に固定
・保持している。In FIG. 6, reference numeral 14 denotes a component supply table which fixes and holds the component supply device 15 and is capable of linearly moving in one direction so as to supply a predetermined component. Reference numeral 16 denotes a head which performs intermittent rotation. Reference numeral 17 denotes a suction nozzle, and a head 16
Is rotatably mounted on the peripheral edge of the device.
Reference numeral 18 denotes a motor, which determines the direction of the suction nozzle 17. 19 is an electronic component, and 20 is an XY table. Reference numeral 21 denotes a stopper, which fixes and holds the printed circuit board 22 on the XY table 20.
以上の様に構成された電子部品装着装置について以下
その動作について説明する。先ず部品供給装置14より電
子部品19を吸着した吸着ノズル17はヘッド16の間欠回転
運動により装着位置へ移動する。この移動中にモータ18
の回転運動により電子部品19の姿勢を定め、装着位置に
て、Ｘ−Ｙテーブル20がプリント基板22の所定位置が装
着位置に合致する様位置決めを行ない。次いで吸着ノズ
ル17が下降し、プリント基板22上に電子部品19を装着す
る。この一連のサイクルを繰り返し、一枚のプリント基
板上に全部品を装着する。The operation of the electronic component mounting apparatus configured as described above will be described below. First, the suction nozzle 17 that has picked up the electronic component 19 from the component supply device 14 moves to the mounting position by intermittent rotation of the head 16. During this movement, the motor 18
The posture of the electronic component 19 is determined by the rotational movement of the electronic component 19, and the XY table 20 is positioned at the mounting position so that the predetermined position of the printed circuit board 22 matches the mounting position. Next, the suction nozzle 17 descends, and the electronic component 19 is mounted on the printed board 22. This series of cycles is repeated, and all components are mounted on one printed circuit board.
第７図は、第６図で示したヘッド16の間欠回転時の各
位置での動作を示した概念上面図である。代表的な一例
を示したものであり、装置により若干の差異はあるが間
欠回転動作中の各停止位置（S1〜S10）にて、役割を固
定化し、ヘッド停止中に一斉に部品取り出し・姿勢認識
・部品検出・部品方向回転・部品装着・ノズル回転・不
良部品排出等の動作を行なっている。FIG. 7 is a conceptual top view showing the operation at each position during the intermittent rotation of the head 16 shown in FIG. This is a typical example, but the role is fixed at each stop position (S 1 to S 10 ) during intermittent rotation operation, although there are slight differences depending on the device, and parts are removed all at once while the head is stopped Performs posture recognition, component detection, component direction rotation, component mounting, nozzle rotation, defective component ejection, etc.
発明が解決しようとする課題 しかし上記の様な構成・動作で示された従来の電子部
品装着装置では次に述べる様な問題が生じる。Problems to be Solved by the Invention However, the following problems occur in the conventional electronic component mounting apparatus shown in the above configuration and operation.
通常チップ部品は、紙テープ内に表（おもて）面を上
に、等ピッチに整列させた状態で、部品取り出し位置迄
搬送される。これを図示したのが第８図のＡである。23
は吸着ノズルであり、24はカバーテープである。部品取
り出し位置迄はカバーテープ24で覆われている。25はキ
ャビティであり、26は送り穴であり、紙テープ27を順に
矢印方向へ送っていく。28は電子部品であり、カバーテ
ープ24がめくられ、露出状態となって、吸着ノズル23に
より取り出される。正常な吸着状態を第８図Ｂに示す。
紙テープ27のキャビティ25内に入れられた状態のまま、
表面を上側にして吸着されている。一方、吸着時に、正
しく吸着が出来なかったケースを各々C,D,Eに示す。Ｃ
は部品の側面を吸着した所謂立ち吸着と言われる状態を
示す。Ｄは部品を裏側に吸着しに状態を示す。Ｅは部品
の吸着そのものを失敗した、所謂、未吸着状態を示す。Normally, chip components are conveyed to a component take-out position in a state of being arranged at an equal pitch in a paper tape with a front (front) surface facing upward. This is illustrated in FIG. 8A. twenty three
Is a suction nozzle, and 24 is a cover tape. The parts are covered with the cover tape 24 up to the component take-out position. 25 is a cavity, 26 is a feed hole, and feeds the paper tape 27 sequentially in the direction of the arrow. Reference numeral 28 denotes an electronic component. The cover tape 24 is turned over, is exposed, and is taken out by the suction nozzle 23. FIG. 8B shows a normal adsorption state.
While it is in the cavity 25 of the paper tape 27,
Adsorbed with the surface facing upward. On the other hand, C, D, and E indicate cases in which adsorption was not performed correctly during adsorption. C
Indicates a state called so-called standing suction in which the side surface of the component is sucked. D indicates a state in which the component is sucked to the back side. E indicates a so-called unsucked state in which the suction of the component itself has failed.
これまでの電子部品装着装置は、第８図のＣの場合は
部品の高さをカメラにより測距する等の方法で検出し、
装着を禁止し、その後の工程で不良部品として排出する
方法を取っている。しかし、第８図で示すＤの様な裏向
きの場合は上述した方法では検出出来ず、そのまま装着
してしまっている。部品メーカの方では表向き装着，裏
向き装着のいずれも品質的には保証しているケースもあ
るが、現実の量産工程では、検査時に、抵抗チップの印
字を読み取る事が項目として挙げられるケースがあり、
この様なラインでは裏面装着は許されない。又、製品と
しての見ばえの問題もあり、裏面装着は通常受け入れ難
い。Ｃの立ち吸着の場合は、部品を捨てなければならな
いという問題、Ｄの裏面吸着は回避する方法がこれ迄の
装着装置には含まれていないという問題がある。In the case of the conventional electronic component mounting apparatus, in the case of FIG. 8C, the height of the component is detected by a method such as measuring the distance with a camera, and the like.
A method is adopted in which mounting is forbidden and then ejected as a defective part in a subsequent process. However, in the case of a back face like D shown in FIG. 8, it cannot be detected by the above-described method, and the camera is mounted as it is. In some cases, the parts manufacturer guarantees the quality of both face-up and face-down mounting, but in the actual mass production process, there is a case where reading the printout of the resistor chip during inspection is an item. Yes,
In such a line, the back side is not allowed. Also, there is a problem of appearance as a product, and mounting on the back side is usually unacceptable. In the case of standing suction of C, there is a problem that components must be discarded, and there is a problem that a method for avoiding suction of the back surface of D is not included in conventional mounting apparatuses.
さらに、昨今、これまでの紙テープで部品を搬送する
方法とは全く異なった部品供給方式、即ち部品をバラの
状態で供給し、エアー吐出等の整列方法をとる所謂バル
ク供給方式が、市場の一部で導入が始まっている。テー
ピングコストの軽減には効果があるが、致命的な短所の
ひとつに表裏識別が不可能という問題がある。Further, recently, a so-called bulk supply method, which is a completely different component supply method from the conventional method of transporting components by a paper tape, that is, a so-called bulk supply method in which components are supplied in a loose state and an alignment method such as air ejection is employed. The introduction has begun in the department. Although effective in reducing taping costs, one of the fatal disadvantages is the inability to distinguish between front and back.
本発明は上記問題点に鑑み、より高機能化を目指した
電子部品装着装置を提供するものである。SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and provides an electronic component mounting apparatus aiming at higher functionality.
課題を解決するための手段 上記問題点を解決するために、本発明の電子部品装着
装置は、チップ部品を供給する部品供給装置と、チップ
部品の上面を保持する第１のノズルを有し前記部品供給
装置から前記チップ部品を取り出し、プリント基板の所
定の場所に所定の姿勢で装着するヘッド部と、前記プリ
ント基板を保持する保持テーブル部と、前記第１のノズ
ルによりチップ部品の上面を保持した状態でチップ部品
の表裏或いは吸着状態を認識する手段と、チップ部品の
側面を保持する第２のノズルを有し前記ノズルを軸心と
してチップ部品を所定の角度回転或いは表裏の反転を行
う回転装置を備えている。Means for Solving the Problems In order to solve the above problems, an electronic component mounting device of the present invention has a component supply device for supplying a chip component, and a first nozzle for holding an upper surface of the chip component. A head unit for taking out the chip component from the component supply device and mounting the chip component at a predetermined position on a printed board in a predetermined posture, a holding table unit for holding the printed board, and holding the upper surface of the chip component by the first nozzle Means for recognizing the front or back or the suction state of the chip component in a state in which the chip component is held, and a second nozzle for holding the side surface of the chip component, and a rotation for rotating the chip component by a predetermined angle or reversing the front and back around the nozzle. Equipment.
作用 本発明は上記した構成により、立ち吸着、或いは裏面
吸着等の部品の吸着状態を識別し、かつ状態に応じて部
品を正しい方向に再吸着させることが可能となる。According to the present invention, it is possible to identify a suction state of a component, such as standing suction or back surface suction, and re-adsorb the component in a correct direction according to the state.
実 施 例 以下本発明の一実施例の電子部品装着装置について図
面を参照しながら説明する。Embodiment An electronic component mounting apparatus according to an embodiment of the present invention will be described below with reference to the drawings.
第１図は本発明の実施例における電子部品装着装置の
構成を示すものである。１は部品表裏認識及び部品反転
装置であり、２は部品姿勢認識装置、３は部品検出装置
である。他の構成部については、第６図と共通である為
説明は省略する。また、部品姿勢認識装置２は部品の位
置を認識するものであり、部品検出装置３は部品の厚
み、長さを測距するものであるが、既に公知であるので
ここでは詳述しない。FIG. 1 shows the configuration of an electronic component mounting apparatus according to an embodiment of the present invention. 1 is a component front / back recognition and component reversing device, 2 is a component orientation recognition device, and 3 is a component detection device. The other components are the same as those shown in FIG. The component posture recognition device 2 recognizes the position of the component, and the component detection device 3 measures the thickness and length of the component. However, since it is already known, it will not be described in detail here.
第２図に、第１図の構成図中のヘッドの上面概略図を
示す。第２図を用いて、部品を供給装置より取り出し、
プリント基板に装着する迄の流れを説明する。部品取り
出し位置S1より、吸着ノズル17によって吸着された部品
はヘッド16の間欠回転運動によりS3の位置へ移載され、
ここで表裏もしくは立ちの識別を行ない、もし正常な吸
着状態でなければ部品を反転或いは任意の角度回転さ
せ、正常な吸着状態即ち、部品の上面（表面）を吸着す
るようにする。次に、S4へ移動し、部品の姿勢を認識
し、部品のズレ量を測距し、S5にて部品の厚み，幅を測
距する。次に、部品装着位置S6へ移動し、S4にて測距し
たズレ量を補正し、プリント基板へ装着する。FIG. 2 is a schematic top view of the head in the configuration diagram of FIG. Using FIG. 2, take out the parts from the supply device,
The flow until mounting on a printed circuit board will be described. From the component take-out position S1, the component sucked by the suction nozzle 17 is transferred to the position S3 by the intermittent rotation of the head 16,
At this point, the front side, the back side, or the upside-down state is identified. If the suction state is not normal, the component is reversed or rotated by an arbitrary angle so that the normal suction state, that is, the upper surface (front surface) of the component is sucked. Next, the process moves to S4, the posture of the component is recognized, the displacement of the component is measured, and the thickness and width of the component are measured in S5. Next, it moves to the component mounting position S6, corrects the deviation amount measured in S4, and mounts the component on the printed circuit board.
第３図では本発明における電子部品装着装置で設けて
いる。部品表裏認識及び部品回転装置を示している。FIG. 3 shows an electronic component mounting apparatus according to the present invention. 4 shows a component front / back recognition and component rotation device.
４は吸着ノズル、５は電子部品、６は電子部品の側面
を吸着する吸着ノズルである。７は規正爪であり、部品
５の側面が吸着ノズル６の正面に向く様規正する。８は
ボールねじであり、９はモータである。吸着ノズル６
は、モータ９の回転動作により、直動及び回動可能であ
る。10は反射式の光電管センサであり、反射面の色によ
り、反射による電圧が変化する。第４図を参照しながら
表裏識別方法について説明する。通常角型チップコンデ
ンサについては、表裏の区別が無く、側面も含め４方向
が全て等価である。一方、第４図に示す様な角型チップ
抵抗では表裏で色に違いがあるのが一般的である。図中
で11は印字で、これは部品表面にある。12は電極であ
り、13は部品表面に施されるガラスコーティングであ
る。部品の裏面をＢに示すがこの面は角型抵抗チップの
素材であるセラミックが露出しており、白色である。従
って第３図に於て、光電管センサ10の設定を白色の時の
みON（或いはOFF）となる様設定しておけば、部品の表
裏認識が可能となる。Reference numeral 4 denotes a suction nozzle, reference numeral 5 denotes an electronic component, and reference numeral 6 denotes a suction nozzle for suctioning a side surface of the electronic component. Reference numeral 7 denotes a setting claw that sets the side surface of the component 5 so as to face the front of the suction nozzle 6. 8 is a ball screw and 9 is a motor. Suction nozzle 6
Can be moved linearly and rotated by the rotation operation of the motor 9. Reference numeral 10 denotes a reflection-type photoelectric tube sensor, and the voltage due to reflection changes according to the color of the reflection surface. The method for identifying the front and back will be described with reference to FIG. Regarding a normal square chip capacitor, there is no distinction between front and back, and all four directions are equivalent including the side. On the other hand, a square chip resistor as shown in FIG. 4 generally has a difference in color between front and back. In the figure, reference numeral 11 denotes printing, which is on the surface of the component. 12 is an electrode, and 13 is a glass coating applied to the surface of the component. The back surface of the component is indicated by B, and this surface is white because the ceramic material of the square resistor chip is exposed. Therefore, in FIG. 3, if the setting of the photoelectric tube sensor 10 is set to be ON (or OFF) only when the color is white, the front and back of the component can be recognized.
次に第５図を用いて、部品が裏側であるケースの反転
メカニズムを説明する。Next, with reference to FIG. 5, a reversing mechanism of the case where the component is on the back side will be described.
センサ10により裏側と認識された場合にのみ回転装置
は駆動する。Ａは部品が裏側に吸着された状態を示して
いる。Ｂではモータ６の回転動作により吸着ノズル６が
部品５の側面に当接し、吸着する。吸着ノズル４は吸着
を停止し、Ｃでは再び吸着ノズルは元の位置へ部品５を
吸着した状態で戻る。ここで、Ｄ図に示す様にモータ９
の回転動作により吸着ノズル６を回転させ、部品５を反
転させる。Ｅで再び吸着ノズル６は、部品５を吸着ノズ
ル４に戻し吸着ノズル４は再び吸着，吸着ノズル６は吸
着を停止する。このＡからＥのサイクルにより部品の吸
着状態を正常な表向きとする。The rotation device is driven only when the back side is recognized by the sensor 10. A shows a state where the component is sucked to the back side. In B, the suction nozzle 6 comes into contact with the side surface of the component 5 by the rotation operation of the motor 6 and sucks. The suction nozzle 4 stops sucking, and in C, the suction nozzle returns to the original position with the component 5 sucked again. Here, as shown in FIG.
By rotating the suction nozzle 6, the suction nozzle 6 is rotated, and the component 5 is inverted. At E, the suction nozzle 6 returns the component 5 to the suction nozzle 4 again, the suction nozzle 4 suctions again, and the suction nozzle 6 stops suction. By the cycles A to E, the suction state of the component is set to a normal face-up state.
本発明の実施例では部品の表裏認識を反射式の光電管
センサにより行なったが、さらに立ち吸着，斜め吸着を
も認識するなら、部品のＦ側にカメラを設け、直接部品
下面を画像処理し、部品の向きを識別し、上述した部品
回転装置を用いて、任意の角度回転させれば良い。In the embodiment of the present invention, the recognition of the front and back of the component is performed by the reflection type photoelectric tube sensor. However, if the vertical suction and the oblique suction are also recognized, a camera is provided on the F side of the component, and the lower surface of the component is directly image-processed. The orientation of the component may be identified, and the component may be rotated by an arbitrary angle using the component rotating device described above.
発明の効果 以上の様に本発明は、従来の電子部品装着装置には無
かった、部品の表裏認識が可能であり、これを修正する
回転装置を設けているので、常に部部を正しい方向で装
着することが可能である。又、部品の吸着状態をさらに
細かく識別し、立ち吸着・斜め吸着も修正可能である。Effect of the Invention As described above, the present invention is capable of recognizing the front and back of a component, which was not possible in a conventional electronic component mounting device, and has a rotating device for correcting this, so that the part is always oriented in the correct direction. It is possible to attach. Further, the suction state of the component can be more finely identified, and the vertical suction and the oblique suction can be corrected.
第１図は本発明の一実施例における電子部品装着装置の
斜視図、第２図は第１図のヘッドの構成を示す上面概略
図、第３図は本発明の一実施例における電子部品装着内
に設けた照部表裏認識センサと部品回転装置を示す斜視
図、第４図は角型チップ抵抗の表面・裏面から見た斜視
図、第５図は部品回転装置のメカニズムを示す正面図、
第６図は従来の電子部品装着装置の一例を示す斜視図、
第７図は第６図のヘッド構成を示す上面概略図、第８図
は紙テープからの部品吸着状態を示す斜視図である。 １……部品表裏認識装置及び部品反転装置、２……部品
姿勢認識装置、３……部品検出装置、５……電子部品、
６……吸着ノズル、10……光電管センサ。FIG. 1 is a perspective view of an electronic component mounting apparatus according to one embodiment of the present invention, FIG. 2 is a schematic top view showing the configuration of the head of FIG. 1, and FIG. 3 is an electronic component mounting according to one embodiment of the present invention. FIG. 4 is a perspective view showing an illumination unit front / back recognition sensor and a component rotating device provided in the inside, FIG. 4 is a perspective view seen from the front and back surfaces of the rectangular chip resistor, FIG. 5 is a front view showing a mechanism of the component rotating device,
FIG. 6 is a perspective view showing an example of a conventional electronic component mounting apparatus,
FIG. 7 is a schematic top view showing the configuration of the head shown in FIG. 6, and FIG. 8 is a perspective view showing a state where components are attracted from a paper tape. 1 ... parts front / back recognition device and parts reversing device, 2 ... component posture recognition device, 3 ... component detection device, 5 ... electronic components,
6 ... Suction nozzle, 10 ... Phototube sensor.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 米沢 隆弘 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (72)発明者 桑原 公人 大阪府門真市大字門真1006番地 松下電 器産業株式会社内 (56)参考文献 特開 平２−70000（ＪＰ，Ａ) 特開 平２−56945（ＪＰ，Ａ) 特開 昭62−176200（ＪＰ，Ａ) (58)調査した分野(Int.Cl.6，ＤＢ名) H05K 13/00──────────────────────────────────────────────────の Continued on the front page (72) Inventor Takahiro Yonezawa 1006 Kazuma Kadoma, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd. In-company (56) References JP-A-2-700000 (JP, A) JP-A-2-56945 (JP, A) JP-A-62-176200 (JP, A) (58) Fields investigated (Int. . 6 , DB name) H05K 13/00
Claims (3)
ップ部品の上面を保持する第１のノズルを有し前記部品
供給装置から前記チップ部品を取り出し、プリント基板
の所定の場所に所定の姿勢で装着するヘッド部と、前記
プリント基板を保持する保持テーブル部と、前記第１の
ノズルによりチップ部品の上面を保持した状態でチップ
部品の表裏或いは吸着状態を認識する手段と、チップ部
品の側面を保持する第２のノズルを有し前記ノズルを軸
心としてチップ部品を所定の角度回転或いは表裏の反転
を行う回転装置を備えた電子部品装着装置。1. A component supply device for supplying a chip component, and a first nozzle for holding an upper surface of the chip component, the chip component being taken out from the component supply device, and a predetermined posture at a predetermined location on a printed circuit board. A head unit for mounting the printed circuit board, a holding table unit for holding the printed circuit board, means for recognizing the front and back or the suction state of the chip component while holding the top surface of the chip component by the first nozzle, and a side surface of the chip component An electronic component mounting apparatus comprising: a second nozzle for holding the chip component; and a rotating device for rotating the chip component by a predetermined angle or reversing the front and back with the nozzle as an axis.
のノズルを所定角回転することにより第１のノズルに保
持する部品の立ち、斜め状態を修正する特許請求の範囲
第１項に記載の電子部品装着装置。2. The method according to claim 1, wherein the direction of the component is recognized by an image pickup means.
2. The electronic component mounting device according to claim 1, wherein the nozzle held by the first nozzle is rotated by a predetermined angle to correct the standing or oblique state of the component held by the first nozzle.
した状態でチップを取り出し、チップ部品の表裏或いは
吸着状態を認識する工程と、前記認識結果に基づき表裏
反転或いは所定の角度回転が必要な場合、前記チップ部
品の側面を吸着し、チップ部品の上面の保持を解除する
工程と、前記チップ部品の側面を保持した状態で表裏反
転或いは所定の角度回転を行う工程と、前記チップ部品
の上面を再吸着し、側面保持を解除する工程と、プリン
ト基板の所定の場所に所定の姿勢で装着する工程からな
る電子部品装着方法。3. A step of taking out a chip from a component supply device while holding the upper surface of the chip component, and recognizing the front or back or the suction state of the chip component, and reversing the front and back or rotating a predetermined angle based on the recognition result. A step of adsorbing the side surface of the chip component and releasing the upper surface of the chip component; releasing the front and back or rotating a predetermined angle while holding the side surface of the chip component; The method of mounting an electronic component comprises the steps of: re-suctioning and releasing the side surface holding; and mounting the electronic component at a predetermined position on a printed circuit board in a predetermined posture.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2095816A JP2844825B2 (en) | 1990-04-11 | 1990-04-11 | Electronic component mounting method and mounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2095816A JP2844825B2 (en) | 1990-04-11 | 1990-04-11 | Electronic component mounting method and mounting device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03293797A JPH03293797A (en) | 1991-12-25 |
| JP2844825B2 true JP2844825B2 (en) | 1999-01-13 |
Family
ID=14147948
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2095816A Expired - Fee Related JP2844825B2 (en) | 1990-04-11 | 1990-04-11 | Electronic component mounting method and mounting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2844825B2 (en) |
-
1990
- 1990-04-11 JP JP2095816A patent/JP2844825B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03293797A (en) | 1991-12-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |