JPH0515080B2 - - Google Patents
Info
- Publication number
- JPH0515080B2 JPH0515080B2 JP59265575A JP26557584A JPH0515080B2 JP H0515080 B2 JPH0515080 B2 JP H0515080B2 JP 59265575 A JP59265575 A JP 59265575A JP 26557584 A JP26557584 A JP 26557584A JP H0515080 B2 JPH0515080 B2 JP H0515080B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic components
- electronic component
- alignment
- electronic
- respect
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001514 detection method Methods 0.000 claims description 13
- 239000000758 substrate Substances 0.000 claims 1
- 230000002950 deficient Effects 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
Landscapes
- Supply And Installment Of Electrical Components (AREA)
- Automatic Assembly (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、各種産業機器の自動化装置として用
いられている電子部品をプリント基板上に供給す
る電子部品供給装置に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an electronic component supply device that supplies electronic components onto a printed circuit board, which is used as an automation device for various industrial equipment.
従来の技術
近年、微小な電子部品をテープ、ステイツク、
マガジン等に封入したものや、又裸のままで各整
列装置に装着又は投入を行ない、前記整列装置に
おける電子部品を電子部品自動装着装置の移載ヘ
ツドにて吸着し、プリント基板へ自動装置を行な
うことが多用化されている。従来、裸の電子部品
は電子部品の整列装置に投入され、吸着位置の上
部にはＸ−Ｙ方向に移動する移載ヘツドが待機
し、又その前方にプリント基板が待機した構成と
なつている。前記整列装置により電子部品は整列
され、その後、前記移載ヘツドのノズルが下降
し、電子部品を真空圧により吸着し、プリント基
板へ実装する際に同時に装着角度が設定され、前
記プリント基板への装着が行なわれる。Conventional technology In recent years, minute electronic components have been
The electronic components sealed in a magazine or the like or naked are mounted or put into each alignment device, and the electronic components in the alignment device are adsorbed by the transfer head of the automatic electronic component mounting device, and the automatic device is attached to the printed circuit board. There are many things to do. Conventionally, bare electronic components are placed in an electronic component alignment device, and a transfer head that moves in the X-Y direction waits above the suction position, and a printed circuit board waits in front of it. . The electronic components are aligned by the alignment device, and then the nozzle of the transfer head descends to pick up the electronic components with vacuum pressure. At the same time, the mounting angle is set and the electronic components are mounted on the printed circuit board. Installation is performed.
発明が解決しようとする問題点
しかしながら、前記供給装置では、電子部品が
反対方向に整列されることがあり、従来は電子部
品の方向検出手段が無く、前記移載ヘツドは電子
部品をそのまま吸着し、角度設定を行ない、プリ
ント基板へ装着を行なうため、不良基板を生産し
てしまう問題を生じていた。Problems to be Solved by the Invention However, in the above-mentioned feeding device, the electronic components may be aligned in opposite directions, and conventionally there is no means for detecting the direction of the electronic components, and the transfer head simply picks up the electronic components. Since the angle is set and then mounted on the printed circuit board, a problem arises in that defective boards are produced.
本発明は前記従来の問題点を解消するもので、
整列装置における電子部品の整列方向を検出し、
反対方向の電子部品の場合は移載ヘツドが角度補
正を行なつて基板に装着し、不良基板の生産を防
ぐことができるようにすることを目的とする。 The present invention solves the above-mentioned conventional problems,
Detects the alignment direction of electronic components in the alignment device,
In the case of electronic components placed in the opposite direction, the transfer head corrects the angle and mounts the electronic components on the board, thereby preventing the production of defective boards.
問題点を解決するための手段
本発明は、整列される方向に対して左右非対称
な複数の電子部品をその上に配置し整列させる整
列装置と、前記整列装置上に整列された各電子部
品の左右一方の側の形状と所定の形状との相違を
検出する検出装置と、前記整列装置上に整列され
た各電子部品を基板上に装着するために吸着する
吸着装置と、前記検出装置からの信号に応答し
て、前記吸着装置による各電子部品の装着の向き
を整列方向に対して左右に反転させる制御装置と
を備えたものである。Means for Solving the Problems The present invention provides an alignment device for arranging and aligning a plurality of electronic components that are asymmetrical with respect to the alignment direction; a detection device that detects a difference between the shape of one of the left and right sides and a predetermined shape; a suction device that sucks each electronic component arranged on the alignment device in order to mount it on a board; The apparatus further includes a control device that, in response to a signal, reverses the mounting direction of each electronic component by the suction device to the left and right with respect to the alignment direction.
作 用
このようなものであると、検出装置が各電子部
品の左右一方の側の形状と所定の形状との相違を
検出することによつて、左右が逆方向に整列され
た電子部品を検出し、この検出装置からの信号に
応答して、制御装置が、吸着装置に吸着された電
子部品の装着方向を整列方向に対して左右に反転
させる。これにより、電子部品は、制御装置およ
び吸着装置によつて左右が正しく方向付けされ、
プリント基板に正常な装着角度で装着されること
になる。In this case, the detection device detects electronic components whose left and right sides are aligned in opposite directions by detecting the difference between the shape of one of the left and right sides of each electronic component and a predetermined shape. In response to a signal from the detection device, the control device reverses the mounting direction of the electronic components sucked by the suction device to the left and right with respect to the alignment direction. As a result, the electronic components are correctly oriented left and right by the control device and suction device.
It will be mounted on the printed circuit board at the normal mounting angle.
実施例
第１図は本発明の一実施例に係る電子部品供給
装置の要部斜視図、第２図はその全体斜視図を示
す。電子部品装着装置１の中央上部には、Ｘ−Ｙ
に移動して電子部品１０を吸着するノズルを有し
てこの電子部品１０を位置決めする吸着装置とし
ての移動ヘツド２が設けられている。その後方に
は各電子部品の整列装置３が装着されており、ま
たその前方はプリント基板１１を搬送する搬送コ
ンベア４が設けられている。第１図において、電
子部品の整列装置３の吸着位置には光電スイツチ
などの光学的検出装置７が設けてあり、電子部品
１０は整列方向Ａ（矢印）に整列される。前記移
載ヘツド２は、モータ８によりタイミングベルト
９を介して上記整列方向Ａに対して左右方向Ｂ
（矢印）に回転されるとともに、前方向Ｃ（矢印）
に移動し、前方の搬送コンベア４にて搬送された
プリント基板１１に電子部品１０の装着を行な
う。又前記検出装置７の信号は図外の制御装置に
送られ、この制御装置に記憶されている移載ヘツ
ド２の装着角度を前記信号により補正し、正常に
装着を行なう構成になつている。Embodiment FIG. 1 is a perspective view of essential parts of an electronic component supply apparatus according to an embodiment of the present invention, and FIG. 2 is a perspective view of the entirety thereof. At the upper center of the electronic component mounting device 1,
A movable head 2 is provided as a suction device that moves to position the electronic component 10 and has a nozzle that suctions the electronic component 10. An alignment device 3 for each electronic component is installed behind it, and a conveyor 4 for conveying the printed circuit board 11 is provided in front of it. In FIG. 1, an optical detection device 7 such as a photoelectric switch is provided at the suction position of the electronic component alignment device 3, and the electronic components 10 are aligned in the alignment direction A (arrow). The transfer head 2 is moved in a left-right direction B with respect to the alignment direction A by a motor 8 via a timing belt 9.
(arrow) and forward direction C (arrow)
The electronic component 10 is mounted on the printed circuit board 11 transported by the transport conveyor 4 in the front. Further, the signal from the detection device 7 is sent to a control device (not shown), and the mounting angle of the transfer head 2 stored in this control device is corrected based on the signal to ensure normal mounting.
整列される方向に対して左右非対称な複数の電
子部品１０は、電子部品の整列装置３により整列
される。第３図イは正常な方向に供給された電子
部品１０ａを示し、この電子部品１０ａは整列方
向Ａに流れ、整列装置３の吸着位置で停止する。
検出装置７の検出部は整列装置３の所定の位置に
設けられ、前記電子部品１０ａの左右一方の側の
足１２を検出し、その信号により、前記制御装置
にて移載ヘツド２ノズルが下降し、電子部品１０
ａを吸着し、上昇を行なう。電子部品１０ａの装
着角度は、モータ８とタイミングベルト９により
移載ヘツド２が上記整列方向Ａに対して左右方向
Ｂ（矢印）に回転を行なうことによつて設定され
る。また、移載ヘツド２は前方向Ｃ（矢印）に移
動し、前記プリント基板１１に電子部品１０ａが
装着される。 A plurality of electronic components 10 that are asymmetrical with respect to the direction in which they are to be aligned are aligned by an electronic component alignment device 3 . FIG. 3A shows the electronic component 10a fed in the normal direction, and this electronic component 10a flows in the alignment direction A and stops at the suction position of the alignment device 3.
The detection section of the detection device 7 is provided at a predetermined position of the alignment device 3, and detects the legs 12 on either the left or right side of the electronic component 10a, and in response to the signal, the transfer head 2 nozzle is lowered by the control device. and electronic parts 10
Adsorb a and ascend. The mounting angle of the electronic component 10a is set by rotating the transfer head 2 in the left-right direction B (arrow) with respect to the alignment direction A using the motor 8 and the timing belt 9. Furthermore, the transfer head 2 moves in the forward direction C (arrow), and the electronic component 10a is mounted on the printed circuit board 11.
電子部品１０の方向が正常な場合は前記述べた
動作を行なうが、電子部品の整列装置３により第
３図ロに示すように電子部品１０ｂが左右反対方
向に流れてきた場合は、前記検出装置７は電子部
品１０ｂの左右一方の側の足１２を矢印Ｄに示す
ように検出せず、不良信号を出す。すると、前記
制御装置により記憶された吸着角度の設定が行な
われるとともに、前記信号による180度の角度誤
差の補正が行なわれる。すなわち、前記移載ヘツ
ド２は、まずそのまま吸着動作を行ない、実装を
行なう工程にて、モータ８を介してタイミングベ
ルト９により整列方向Ａに対して左右方向Ｂ（矢
印）に180度反転される。これりより、前記プリ
ント基板１１へ電子部品１０ｂは正常に装着され
る。 If the direction of the electronic component 10 is normal, the above-mentioned operation is performed, but if the electronic component 10b flows in the opposite direction to the left and right by the electronic component alignment device 3 as shown in FIG. 7 does not detect the leg 12 on either the left or right side of the electronic component 10b as shown by arrow D, and issues a defective signal. Then, the suction angle stored in the controller is set, and the angular error of 180 degrees is corrected using the signal. That is, the transfer head 2 first performs the suction operation as it is, and in the mounting process, is reversed 180 degrees in the left-right direction B (arrow) with respect to the alignment direction A by the timing belt 9 via the motor 8. . From this, the electronic component 10b is normally mounted on the printed circuit board 11.
以上のように本実施例によれば、電子部品の整
列装置３に検出装置７を設け、左右が逆方向に整
列された電子部品１０ｂを検出し、制御装置にて
移載ヘツド２の角度を整列方向Ａに対して左右方
向Ｂに180度反転することにより、前記電子部品
の整列装置３が整列方向不良のまま電子部品１０
の供給を行なつても、正常にプリント基板に装着
が出来る。 As described above, according to this embodiment, the detection device 7 is provided in the electronic component alignment device 3, detects the electronic components 10b that are aligned in opposite left and right directions, and controls the angle of the transfer head 2 using the control device. By reversing 180 degrees in the left-right direction B with respect to the alignment direction A, the electronic component alignment device 3 removes the electronic components 10 with the alignment direction being incorrect.
Even if it is supplied with
発明の効果
以上述べたように本発明によると、電子部品の
整列装置における整列方向の検出装置を設けたこ
とにより、左右が逆方向に整列された電子部品を
検出でき、更に制御装置により前記検出装置から
の信号入力にもとづいて装着角度を整列方向に対
して左右に反転することができるので、電子部品
を裏返すことなく正常に装着でき、プリント基板
の不良品を少なくすることができる。また、検出
装置は左右非対称な電子部品の左右一方の側の形
状と所定の形状との相違を検出できれば良いた
め、簡易かつ安価な光学的検出装置などを用いる
ことができ、電子部品供給装置をコンパクト化で
きる。Effects of the Invention As described above, according to the present invention, by providing an alignment direction detection device in an electronic component alignment device, it is possible to detect electronic components that are aligned in opposite left and right directions. Since the mounting angle can be reversed left and right with respect to the alignment direction based on signal input from the device, electronic components can be mounted normally without being turned over, and the number of defective printed circuit boards can be reduced. In addition, since the detection device only needs to be able to detect the difference between the shape of one side of the asymmetrical electronic component and the predetermined shape, a simple and inexpensive optical detection device can be used, and the electronic component supply device can be Can be made compact.
第１図は本発明の一実施例に係る電子部品供給
装置の要部斜視図、第２図はその全体斜視図、第
３図イ，ロは吸着位置における電子部品整列状態
の斜視図である。
２……移載ヘツド（吸着装置）、３……整列装
置、７……検出装置、１０，１０ａ，１０ｂ……
電子部品。
FIG. 1 is a perspective view of essential parts of an electronic component supply device according to an embodiment of the present invention, FIG. 2 is a perspective view of the entire device, and FIGS. 3A and 3B are perspective views of electronic components arranged in a suction position. . 2... Transfer head (adsorption device), 3... Alignment device, 7... Detection device, 10, 10a, 10b...
electronic components.
Claims (1)
電子部品をその上に配置し整列させる整列装置
と、前記整列装置上に整列された各電子部品の左
右一方の側の形状と所定の形状との相違を検出す
る検出装置と、前記整列装置上に整列された各電
子部品を基板上に装着するために吸着する吸着装
置と、前記検出装置からの信号に応答して、前記
吸着装置による各電子部品の装着の向きを整列方
向に対して左右に反転させる制御装置とを備える
電子部品供給装置。1. An alignment device for arranging and aligning a plurality of electronic components that are asymmetrical with respect to the alignment direction, and a shape and a predetermined shape of one left and right side of each electronic component aligned on the alignment device. a detection device for detecting differences between the electronic components, a suction device for sucking electronic components arranged on the alignment device in order to mount them on a substrate, and An electronic component supply device comprising: a control device that reverses the mounting direction of electronic components to the left and right with respect to the alignment direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59265575A JPS61142800A (en) | 1984-12-17 | 1984-12-17 | Electronic component feeder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59265575A JPS61142800A (en) | 1984-12-17 | 1984-12-17 | Electronic component feeder |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6000182A Division JPH0824237B2 (en) | 1994-01-06 | 1994-01-06 | How to mount electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61142800A JPS61142800A (en) | 1986-06-30 |
| JPH0515080B2 true JPH0515080B2 (en) | 1993-02-26 |
Family
ID=17419018
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59265575A Granted JPS61142800A (en) | 1984-12-17 | 1984-12-17 | Electronic component feeder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61142800A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0518393Y2 (en) * | 1987-04-27 | 1993-05-17 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3958740A (en) * | 1974-07-08 | 1976-05-25 | Dixon Automation, Inc. | Automatic component assembly machine and method relating thereto |
| JPS56117913A (en) * | 1980-02-19 | 1981-09-16 | Sanyo Electric Co Ltd | Part sequential feeder |
| JPS5727036A (en) * | 1980-07-25 | 1982-02-13 | Toshiba Corp | Arranging device for direction of diode |
| JPS5946179A (en) * | 1982-09-09 | 1984-03-15 | 株式会社日立製作所 | Recognizer for chip part |
-
1984
- 1984-12-17 JP JP59265575A patent/JPS61142800A/en active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3958740A (en) * | 1974-07-08 | 1976-05-25 | Dixon Automation, Inc. | Automatic component assembly machine and method relating thereto |
| JPS56117913A (en) * | 1980-02-19 | 1981-09-16 | Sanyo Electric Co Ltd | Part sequential feeder |
| JPS5727036A (en) * | 1980-07-25 | 1982-02-13 | Toshiba Corp | Arranging device for direction of diode |
| JPS5946179A (en) * | 1982-09-09 | 1984-03-15 | 株式会社日立製作所 | Recognizer for chip part |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61142800A (en) | 1986-06-30 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |