JPS5727036A - Arranging device for direction of diode - Google Patents

Arranging device for direction of diode

Info

Publication number
JPS5727036A
JPS5727036A JP10228980A JP10228980A JPS5727036A JP S5727036 A JPS5727036 A JP S5727036A JP 10228980 A JP10228980 A JP 10228980A JP 10228980 A JP10228980 A JP 10228980A JP S5727036 A JPS5727036 A JP S5727036A
Authority
JP
Japan
Prior art keywords
section
feeder
diodes
transfer
inversion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10228980A
Other languages
Japanese (ja)
Other versions
JPS6231827B2 (en
Inventor
Koichi Watanabe
Masahiro Muta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP10228980A priority Critical patent/JPS5727036A/en
Publication of JPS5727036A publication Critical patent/JPS5727036A/en
Publication of JPS6231827B2 publication Critical patent/JPS6231827B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

PURPOSE:To improve the operation efficiency of arranging printing by a method wherein a large number of diodes are placed on two rows of feeders, corrected in the right direction at a time by means of a transfer section and an inversion section while being synchronized with operation for confirming the direction by means of a directional identifying instrument, transported to a printing section and printed. CONSTITUTION:A large number of the diodes 2 (2a-2d) are disposed onto the first feeder 3 as a transfer means, and transported successively in the order of a direction identifying section I, the transfer section II, the inversion section III and the printing section IV. The second feeder 4 is mounted previously in parallel with the first feeder 3 in the vicinity of the transfer section II and the inversion section III. The arranging direction of the diodes is identified by means of the polarity identifying instrument set up to the direction identifying section I, the signals are forwarded to a transfer magnet of the transfer section II and an inversion magnet of the inversion section III, the diodes disposed in the opposite direction are transported to the second feeder 4 and inverted, arranged and placed on the first feeder 3 again by means of a fixed magnet, and transferred and a cathode mark 9 is printed by the printing section IV. Accordingly, a large number of the diodes can be arranged and printed at a time, and operation efficiency is improved.
JP10228980A 1980-07-25 1980-07-25 Arranging device for direction of diode Granted JPS5727036A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10228980A JPS5727036A (en) 1980-07-25 1980-07-25 Arranging device for direction of diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10228980A JPS5727036A (en) 1980-07-25 1980-07-25 Arranging device for direction of diode

Publications (2)

Publication Number Publication Date
JPS5727036A true JPS5727036A (en) 1982-02-13
JPS6231827B2 JPS6231827B2 (en) 1987-07-10

Family

ID=14323446

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10228980A Granted JPS5727036A (en) 1980-07-25 1980-07-25 Arranging device for direction of diode

Country Status (1)

Country Link
JP (1) JPS5727036A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61142800A (en) * 1984-12-17 1986-06-30 松下電器産業株式会社 Electronic component feeder
CN111128808A (en) * 2019-12-30 2020-05-08 广安市嘉乐电子科技有限公司 Turnover tool for axial diode packaging process

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0382530U (en) * 1989-12-13 1991-08-22

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61142800A (en) * 1984-12-17 1986-06-30 松下電器産業株式会社 Electronic component feeder
JPH0515080B2 (en) * 1984-12-17 1993-02-26 Matsushita Electric Ind Co Ltd
CN111128808A (en) * 2019-12-30 2020-05-08 广安市嘉乐电子科技有限公司 Turnover tool for axial diode packaging process
CN111128808B (en) * 2019-12-30 2023-07-21 广安市嘉乐电子科技有限公司 Turnover tool for axial diode packaging process

Also Published As

Publication number Publication date
JPS6231827B2 (en) 1987-07-10

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